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Patent applications and USPTO patent grants for Nakajyo, Shinsuke.The latest application filed is for "manufacture of wafer level semiconductor device with quality markings on the sealing resin".
Patent | Date |
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Manufacture of wafer level semiconductor device with quality markings on the sealing resin App 20040235271 - Nakajyo, Shinsuke ;   et al. | 2004-11-25 |
Manufacture of wafer level semiconductor device with quality markings on the sealing resin Grant 6,777,250 - Nakajyo , et al. August 17, 2 | 2004-08-17 |
Mounting substrate and mounting method for semiconductor device Grant 6,600,217 - Onodera , et al. July 29, 2 | 2003-07-29 |
Mounting substrate and mounting method for semiconductor device App 20010013641 - Onodera, Masanori ;   et al. | 2001-08-16 |
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