loadpatents
Patent applications and USPTO patent grants for Nakajima; Dai.The latest application filed is for "semiconductor device and method of manufacturing the same".
Patent | Date |
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Semiconductor device and method for manufacturing the same Grant 11,152,280 - Sanda , et al. October 19, 2 | 2021-10-19 |
Semiconductor device and method for manufacturing the same Grant 11,107,745 - Sanda , et al. August 31, 2 | 2021-08-31 |
Semiconductor device and method of manufacturing the same Grant 11,049,787 - Tada , et al. June 29, 2 | 2021-06-29 |
Thermal conductivity measurement device and thermal conductivity measurement method Grant 10,775,329 - Tada , et al. Sept | 2020-09-15 |
Thermal conductivity measurement apparatus and thermal conductivity measurement method Grant 10,768,127 - Sanda , et al. Sep | 2020-09-08 |
Power semiconductor device and method for manufacturing power semiconductor device Grant 10,727,167 - Yamada , et al. | 2020-07-28 |
Semiconductor Device and Method of Manufacturing the Same App 20200043824 - TADA; Haruna ;   et al. | 2020-02-06 |
Semiconductor device and method of manufacturing the same Grant 10,529,643 - Yamamoto , et al. J | 2020-01-07 |
Thermal Conductivity Measurement Device And Thermal Conductivity Measurement Method App 20190369038 - Tada; Haruna ;   et al. | 2019-12-05 |
Power module, power semiconductor device and power module manufacturing method Grant 10,461,010 - Yoshihara , et al. Oc | 2019-10-29 |
Semiconductor Device and Method for Manufacturing the Same App 20190295919 - Sanda; Yasuyuki ;   et al. | 2019-09-26 |
Rotating electric machine stator Grant 10,348,150 - Miyamoto , et al. July 9, 2 | 2019-07-09 |
Power Module, Power Semiconductor Device And Power Module Manufacturing Method App 20190067154 - Yoshihara; Hiroyuki ;   et al. | 2019-02-28 |
Power Semiconductor Device And Method For Manufacturing Power Semiconductor Device App 20190006265 - Yamada; Takayuki ;   et al. | 2019-01-03 |
Thermal Conductivity Measurement Apparatus And Thermal Conductivity Measurement Method App 20180299391 - SANDA; Yasuyuki ;   et al. | 2018-10-18 |
Semiconductor Device And Method Of Manufacturing The Same App 20180261520 - YAMAMOTO; Kei ;   et al. | 2018-09-13 |
Swaged heat sink and heat sink integrated power module Grant 9,892,992 - Sanda , et al. February 13, 2 | 2018-02-13 |
Electric rotating machine Grant 9,812,929 - Shirakata , et al. November 7, 2 | 2017-11-07 |
Rotating electrical machine Grant 9,698,646 - Shirakata , et al. July 4, 2 | 2017-07-04 |
Brush structure with heat dissipation member Grant 9,653,969 - Fukase , et al. May 16, 2 | 2017-05-16 |
Power semiconductor device Grant 9,620,444 - Fukase , et al. April 11, 2 | 2017-04-11 |
Rotary electric machine Grant 9,577,495 - Fukase , et al. February 21, 2 | 2017-02-21 |
Rotating electrical machine Grant 9,531,318 - Shirakata , et al. December 27, 2 | 2016-12-27 |
Rotating Electric Machine Stator App 20160336828 - MIYAMOTO; Tomohiko ;   et al. | 2016-11-17 |
Electric rotating machine Grant 9,479,029 - Fukase , et al. October 25, 2 | 2016-10-25 |
Swaged Heat Sink And Heat Sink Integrated Power Module App 20160225691 - SANDA; Yasuyuki ;   et al. | 2016-08-04 |
Electric power semiconductor device and method for producing same Grant 9,236,324 - Besshi , et al. January 12, 2 | 2016-01-12 |
Power Semiconductor Device App 20150287670 - Fukase; Tatsuya ;   et al. | 2015-10-08 |
Power semiconductor module Grant 9,129,949 - Asada , et al. September 8, 2 | 2015-09-08 |
Electric Rotating Machine App 20140361648 - Shirakata; Yuji ;   et al. | 2014-12-11 |
Electric Power Semiconductor Device And Method For Producing Same App 20140293548 - Besshi; Noriyuki ;   et al. | 2014-10-02 |
Rotating Electrical Machine App 20140145526 - Shirakata; Yuji ;   et al. | 2014-05-29 |
Rotary Electric Machine App 20140125168 - Fukase; Tatsuya ;   et al. | 2014-05-08 |
Rotating Electrical Machine App 20140035431 - Fukase; Tatsuya ;   et al. | 2014-02-06 |
Electric Rotating Machine App 20140001915 - Fukase; Tatsuya ;   et al. | 2014-01-02 |
Rotating Electrical Machine App 20130221890 - Shirakata; Yuji ;   et al. | 2013-08-29 |
Power Semiconductor Module App 20130221516 - Asada; Shinsuke ;   et al. | 2013-08-29 |
Reflow Soldering Device And Reflow Soldering Method App 20130200136 - Besshi; Noriyuki ;   et al. | 2013-08-08 |
Power supply unit-integrated dynamoelectric machine Grant 8,461,733 - Takechi , et al. June 11, 2 | 2013-06-11 |
Control apparatus-integrated dynamoelectric machine Grant 8,299,666 - Shirakata , et al. October 30, 2 | 2012-10-30 |
Power Supply Unit-integrated Dynamoelectric Machine App 20110193432 - TAKECHI; Atsushi ;   et al. | 2011-08-11 |
Control Apparatus-integrated Dynamoelectric Machine App 20110175496 - SHIRAKATA; Yuji ;   et al. | 2011-07-21 |
Semiconductor device Grant 7,560,809 - Nakajima July 14, 2 | 2009-07-14 |
Semiconductor Device App 20070187819 - NAKAJIMA; Dai | 2007-08-16 |
Capacitor module and semiconductor device using the same Grant 7,151,661 - Kimura , et al. December 19, 2 | 2006-12-19 |
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer Grant 7,151,311 - Nakajima , et al. December 19, 2 | 2006-12-19 |
Power module Grant 7,081,671 - Fukada , et al. July 25, 2 | 2006-07-25 |
Electric power semiconductor device Grant 6,984,884 - Kikuchi , et al. January 10, 2 | 2006-01-10 |
Power semiconductor device Grant 6,979,843 - Nakajima , et al. December 27, 2 | 2005-12-27 |
Power module Grant 6,940,164 - Yoshimatsu , et al. September 6, 2 | 2005-09-06 |
Power semiconductor device Grant 6,903,457 - Nakajima , et al. June 7, 2 | 2005-06-07 |
Power module Grant 6,900,986 - Kimoto , et al. May 31, 2 | 2005-05-31 |
Semiconductor device Grant 6,867,484 - Nakajima , et al. March 15, 2 | 2005-03-15 |
Capacitor module and semiconductor App 20050041369 - Kimura, Tohru ;   et al. | 2005-02-24 |
Electric power semiconductor device App 20040251528 - Kikuchi, Masao ;   et al. | 2004-12-16 |
Power module App 20040179341 - Kimoto, Nobuyoshi ;   et al. | 2004-09-16 |
Semiconductor device Grant 6,787,893 - Nakajima , et al. September 7, 2 | 2004-09-07 |
Power module Grant 6,762,937 - Kimoto , et al. July 13, 2 | 2004-07-13 |
Resin-sealed semiconductor device Grant 6,753,596 - Nakajima , et al. June 22, 2 | 2004-06-22 |
Resin-sealed Semiconductor Device App 20040108602 - Nakajima, Dai ;   et al. | 2004-06-10 |
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer App 20040089928 - Nakajima, Dai ;   et al. | 2004-05-13 |
Power semiconductor device App 20040089931 - Nakajima, Dai ;   et al. | 2004-05-13 |
Semiconductor device Grant 6,700,194 - Nakajima , et al. March 2, 2 | 2004-03-02 |
Power semiconductor device App 20030213979 - Nakajima, Dai ;   et al. | 2003-11-20 |
Semiconductor device App 20030197255 - Nakajima, Dai ;   et al. | 2003-10-23 |
Power module App 20030063442 - Kimoto, Nobuyoshi ;   et al. | 2003-04-03 |
Power module Grant 6,522,544 - Kimoto , et al. February 18, 2 | 2003-02-18 |
Semiconductor device App 20030011057 - Nakajima, Dai ;   et al. | 2003-01-16 |
Semiconductor device App 20020190374 - Nakajima, Dai ;   et al. | 2002-12-19 |
Power module App 20020186545 - Fukada, Masakazu ;   et al. | 2002-12-12 |
Capacitor module and semiconductor device using the same App 20020158329 - Kimura, Tohru ;   et al. | 2002-10-31 |
Semiconductor device App 20010035562 - Kimura, Toru ;   et al. | 2001-11-01 |
Power module Grant 6,304,448 - Fukada , et al. October 16, 2 | 2001-10-16 |
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