NAKAI; Shunsuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAKAI; Shunsuke.The latest application filed is for "nonvolatile semiconductor storage device and read voltage correction method".

Company Profile

1.21.23

NAKAI; Shunsuke - Osaka JP
NAKAI; Shunsuke - Tokyo JP
Nakai; Shunsuke - Kanagawa-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Nonvolatile Semiconductor Storage Device And Read Voltage Correction Method App 20220254426 - NAKAI; Shunsuke ; et al.	2022-08-11
Communication Device App 20220166448 - NAKAI; Shunsuke	2022-05-26
Processing end point detection method, polishing method, and polishing apparatus Grant 10,207,390 - Shimizu , et al. Feb	2019-02-19
Processing End Point Detection Method, Polishing Method, And Polishing Apparatus App 20140004773 - SHIMIZU; Noburu ; et al.	2014-01-02
Processing end point detection method, polishing method, and polishing apparatus Grant 8,554,356 - Shimizu , et al. October 8, 2	2013-10-08
Polishing state monitoring method Grant 8,342,907 - Kobayashi , et al. January 1, 2	2013-01-01
Polishing State Monitoring Apparatus And Polishing Apparatus And Method App 20100075576 - KOBAYASHI; Yoichi ; et al.	2010-03-25
Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus Grant 7,675,634 - Kimba , et al. March 9, 2	2010-03-09
Processing end point detection method, polishing method,and polishing apparatus App 20100015889 - Shimizu; Noburu ; et al.	2010-01-21
Polishing state monitoring apparatus and polishing apparatus Grant 7,645,181 - Kobayashi , et al. January 12, 2	2010-01-12
Substrate polishing apparatus Grant 7,585,204 - Kobayashi , et al. September 8, 2	2009-09-08
Substrate Polishing Apparatus App 20090191790 - KOBAYASHI; Yoichi ; et al.	2009-07-30
Substrate polishing apparatus Grant 7,547,242 - Hirokawa , et al. June 16, 2	2009-06-16
Substrate polishing apparatus Grant 7,510,460 - Kobayashi , et al. March 31, 2	2009-03-31
Substrate polishing apparatus Grant 7,507,144 - Hirokawa , et al. March 24, 2	2009-03-24
Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus App 20090051939 - Kimba; Toshifumi ; et al.	2009-02-26
Polishing state monitoring apparatus and polishing apparatus and method App 20090011680 - Kobayashi; Yoichi ; et al.	2009-01-08
Polishing state monitoring method Grant 7,438,627 - Kobayashi , et al. October 21, 2	2008-10-21
Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus Grant 7,428,064 - Kimba , et al. September 23, 2	2008-09-23
Polishing state monitoring apparatus and polishing apparatus and method App 20070254557 - Kobayashi; Yoichi ; et al.	2007-11-01
Substrate polishing apparatus App 20070254565 - Kobayashi; Yoichi ; et al.	2007-11-01
Polishing state monitoring apparatus and polishing apparatus and method Grant 7,252,575 - Kobayashi , et al. August 7, 2	2007-08-07
Substrate polishing apparatus App 20070173177 - Hirokawa; Kazuto ; et al.	2007-07-26
Substrate polishing apparatus Grant 7,241,202 - Kobayashi , et al. July 10, 2	2007-07-10
Substrate polishing apparatus Grant 7,214,122 - Hirokawa , et al. May 8, 2	2007-05-08
Substrate polishing apparatus App 20070042679 - Hirokawa; Kazuto ; et al.	2007-02-22
Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus App 20060209308 - Kimba; Toshifumi ; et al.	2006-09-21
Substrate polishing apparatus Grant 7,101,257 - Hirokawa , et al. September 5, 2	2006-09-05
Polishing state monitoring apparatus and polishing apparatus and method App 20060166606 - Kobayashi; Yoichi ; et al.	2006-07-27
Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus Grant 7,072,050 - Kimba , et al. July 4, 2	2006-07-04
Substrate polishing apparatus App 20060105679 - Hirokawa; Kazuto ; et al.	2006-05-18
Substrate polishing apparatus App 20050239372 - Kobayashi, Yoichi ; et al.	2005-10-27
Substrate polishing apparatus Grant 6,942,543 - Kobayashi , et al. September 13, 2	2005-09-13
Substrate polishing apparatus App 20040242121 - Hirokawa, Kazuto ; et al.	2004-12-02
Substrate polishing apparatus App 20040235393 - Hirokawa, Kazuto ; et al.	2004-11-25
Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus App 20040223166 - Kimba, Toshifumi ; et al.	2004-11-11
Substrate polishing apparatus App 20040219865 - Kobayashi, Yoichi ; et al.	2004-11-04
Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus Grant 6,785,010 - Kimba , et al. August 31, 2	2004-08-31
Substrate polishing apparatus Grant 6,758,723 - Kobayashi , et al. July 6, 2	2004-07-06
Method and apparatus for measuring film thickness Grant 6,657,737 - Kimba , et al. December 2, 2	2003-12-02
Substrate polishing apparatus App 20030124957 - Kobayashi, Yoichi ; et al.	2003-07-03
Method and apparatus for measuring film thickness App 20010052987 - Kimba, Toshifumi ; et al.	2001-12-20
Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus App 20010005265 - Kimba, Toshifumi ; et al.	2001-06-28

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