Nakai; Katsuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakai; Katsuya.The latest application filed is for "method for producing perfluoroalkadiene compounds".

Company Profile

2.7.7

Nakai; Katsuya - Osaka JP
Nakai; Katsuya - Settsu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing perfluoroalkadiene compounds Grant 11,225,446 - Etou , et al. January 18, 2	2022-01-18
Method For Producing Perfluoroalkadiene Compounds App 20210221757 - ETOU; Yuusuke ; et al.	2021-07-22
Method for producing perfluoroalkadiene compounds Grant 11,001,545 - Etou , et al. May 11, 2	2021-05-11
Composition Including Fluoromethane And Method For Producing Same App 20200172456 - NAKAMURA; Shingo ; et al.	2020-06-04
Composition including fluoromethane and method for producing same Grant 10,597,343 - Nakamura , et al.	2020-03-24
Method For Producing Perfluoroalkadiene Compounds App 20200010389 - ETOU; Yuusuke ; et al.	2020-01-09
Composition Including Fluoromethane And Method For Producing Same App 20180141886 - NAKAMURA; Shingo ; et al.	2018-05-24
Particulate material processing apparatus and particulate material processing system Grant 8,157,899 - Isogai , et al. April 17, 2	2012-04-17
Particulate material processing apparatus and particulate material processing system Grant 8,007,736 - Hirakawa , et al. August 30, 2	2011-08-30
Process for preparing fluoropolymer Grant 7,566,762 - Otsuka , et al. July 28, 2	2009-07-28
Particulate Material Processing Apparatus And Particulate Material Processing System App 20090126217 - Hirakawa; Taku ; et al.	2009-05-21
Particulate Material Processing Apparatus And Particulate Material Processing System App 20090126571 - Isogai; Tomohiro ; et al.	2009-05-21
Process for preparing fluoropolymer App 20070149733 - Otsuka; Masao ; et al.	2007-06-28
Hermetic packaging apparatus Grant 4,860,523 - Teteishi , et al. August 29, 1	1989-08-29

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