NAKAGAWA; Norikiyo

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAKAGAWA; Norikiyo.The latest application filed is for "ablation layer, photosensitive resin structure, method for producing relief printing plate using said photosensitive resin structure".

Company Profile

0.5.7

NAKAGAWA; Norikiyo - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ablation Layer, Photosensitive Resin Structure, Method For Producing Relief Printing Plate Using Said Photosensitive Resin Structure App 20210229480 - NAKAGAWA; Norikiyo	2021-07-29
Heat-reactive resist material, layered product for thermal lithography using the material, and method of manufacturing a mold using the material and layered product Grant 9,257,142 - Mitamura , et al. February 9, 2	2016-02-09
Copper oxide etchant and etching method using the same Grant 9,139,771 - Nakagawa , et al. September 22, 2	2015-09-22
Etchant and etching method using the same Grant 9,121,101 - Nakata , et al. September 1, 2	2015-09-01
Etchant And Etching Method Using The Same App 20140202987 - Nakata; Takuto ; et al.	2014-07-24
Copper Oxide Etchant And Etching Method Using The Same App 20140091058 - NAKAGAWA; Norikiyo ; et al.	2014-04-03
Copper Oxide Etchant And Etching Method Using The Same App 20130026134 - Nakagawa; Norikiyo ; et al.	2013-01-31
Heat-reactive Resist Material, Layered Product For Thermal Lithography Using The Material, And Method Of Manufacturing A Mold Using The Material And Layered Product App 20110195142 - Mitamura; Yoshimichi ; et al.	2011-08-11

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