Nakagawa; Dai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nakagawa; Dai.The latest application filed is for "multilayer laminate film".
- Nakagawa; Dai - Tokyo JP
- Nakagawa; Dai - Nagaokakyo JP
- Nakagawa; Dai - Kyoto JP
- NAKAGAWA; Dai - Nagaokakyo-shi JP
- NAKAGAWA; Dai - Chiyoda-ku Tokyo
- Nakagawa; Dai - Gifu JP
- NAKAGAWA; Dai - Kasugai-shi JP
- Nakagawa; Dai - Anpachi-gun JP
- Nakagawa; Dai - Moriyama JP
- NAKAGAWA; Dai - Moriyama-shi JP
| Patent | Date |
|---|---|
| Multi-layer layered film Grant 11,448,809 - Hirose , et al. September 20, 2 | 2022-09-20 |
| Radio-frequency module, transmission power amplifier, and communication apparatus Grant 11,309,925 - Matsumoto , et al. April 19, 2 | 2022-04-19 |
| High-frequency module and communication device Grant 11,239,876 - Nakagawa February 1, 2 | 2022-02-01 |
| Multilayer Laminate Film App 20210349246 - NAKAGAWA; Dai ; et al. | 2021-11-11 |
| Multilayer Laminate Film App 20210349249 - NAKAGAWA; Dai ; et al. | 2021-11-11 |
| Multilayer Laminate Film App 20210349247 - NAKAGAWA; Dai ; et al. | 2021-11-11 |
| Radio-frequency Module, Transmission Power Amplifier, And Communication Apparatus App 20210226652 - MATSUMOTO; Sho ; et al. | 2021-07-22 |
| Radio Frequency Module And Communication Device App 20210219419 - TAKEMATSU; Yuji ; et al. | 2021-07-15 |
| Multilayer laminated film and processed article using same Grant 10,974,489 - Nakagawa , et al. April 13, 2 | 2021-04-13 |
| High frequency module and communication device Grant 10,971,466 - Nakazawa , et al. April 6, 2 | 2021-04-06 |
| Radio-frequency module and communication device Grant 10,964,657 - Nakazawa , et al. March 30, 2 | 2021-03-30 |
| High frequency module and communication device Grant 10,950,569 - Nakazawa , et al. March 16, 2 | 2021-03-16 |
| Multilayer Laminated Film App 20210003757 - NAKAGAWA; Dai ; et al. | 2021-01-07 |
| High-frequency module Grant 10,847,306 - Nakagawa November 24, 2 | 2020-11-24 |
| Radio-frequency Module And Communication Device App 20200211998 - UEJIMA; Takanori ; et al. | 2020-07-02 |
| High-frequency Module App 20200058436 - NAKAGAWA; Dai | 2020-02-20 |
| Radio-frequency Module And Communication Device App 20200051942 - NAKAZAWA; Katsunari ; et al. | 2020-02-13 |
| High Frequency Module And Communication Device App 20200051943 - NAKAZAWA; Katsunari ; et al. | 2020-02-13 |
| High Frequency Module And Communication Device App 20200051941 - NAKAZAWA; Katsunari ; et al. | 2020-02-13 |
| High-frequency Module And Communication Device App 20200044683 - Nakagawa; Dai | 2020-02-06 |
| Multi-layer Layered Film App 20200025991 - HIROSE; Amane ; et al. | 2020-01-23 |
| Multilayer Laminated Film And Processed Article Using Same App 20190322087 - NAKAGAWA; Dai ; et al. | 2019-10-24 |
| Insulating film Grant 10,438,746 - Masuda , et al. O | 2019-10-08 |
| Highly insulating film Grant 9,617,407 - Nakahiro , et al. April 11, 2 | 2017-04-11 |
| Die And Method Of Producing Die App 20150202722 - NAKAGAWA; Dai | 2015-07-23 |
| Insulating film Grant 8,859,087 - Masuda , et al. October 14, 2 | 2014-10-14 |
| Die And Method Of Producing Die App 20140193537 - Nakagawa; Dai | 2014-07-10 |
| Highly Insulating Film App 20140050913 - Nakahiro; Takashi ; et al. | 2014-02-20 |
| Highly Insulating Film App 20120232209 - Masuda; Shigeyoshi ; et al. | 2012-09-13 |
| Low-voltage control high-frequency switch and composite high-frequency component Grant 8,179,206 - Nakagawa , et al. May 15, 2 | 2012-05-15 |
| Insulating Film App 20100178483 - Masuda; Shigeyoshi ; et al. | 2010-07-15 |
| Method For Mounting Electronic-component Module, Method For Manufacturing Electronic Apparatus Using The Same, And Electronic-component Module App 20100085722 - KOYAMA; Kunihiro ; et al. | 2010-04-08 |
| Method for mounting electronic-component module Grant 7,650,692 - Koyama , et al. January 26, 2 | 2010-01-26 |
| Low-voltage Control High-frequency Switch And Composite High-frequency Component App 20080310382 - NAKAGAWA; Dai ; et al. | 2008-12-18 |
| Method For Mounting Electronic-component Module, Method For Manufacturing Electronic Apparatus Using The Same, And Electronic-component Module App 20080192447 - KOYAMA; Kunihiro ; et al. | 2008-08-14 |
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