NAKADAIRA; Yoshikuni

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAKADAIRA; Yoshikuni.The latest application filed is for "semiconductor chip assembly and method for making same".

Company Profile

0.10.10

NAKADAIRA; Yoshikuni - Yokohama JP
Nakadaira; Yoshikuni - Hodogaya-Ku N/A JP
Nakadaira; Yoshikuni - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor chip assembly and method for making same App 20170309593 - KANG; Teck-Gyu ; et al.	2017-10-26
Semiconductor chip assembly and method for making same Grant 9,716,075 - Kang , et al. July 25, 2	2017-07-25
Fan-out WLP with package App 20160254247 - SATO; Hiroaki ; et al.	2016-09-01
Method for manufacturing a fan-out WLP with package Grant 9,337,165 - Sato , et al. May 10, 2	2016-05-10
Semiconductor Chip Assembly And Method For Making Same App 20160005711 - Kang; Teck-Gyu ; et al.	2016-01-07
Semiconductor chip assembly and method for making same Grant 9,137,903 - Kang , et al. September 15, 2	2015-09-15
Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts Grant 8,957,520 - Sato , et al. February 17, 2	2015-02-17
Fan-Out WLP With Package App 20150044824 - Sato; Hiroaki ; et al.	2015-02-12
Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material Grant 8,890,304 - Sato , et al. November 18, 2	2014-11-18
Chip with sintered connections to package Grant 8,525,338 - Sato , et al. September 3, 2	2013-09-03
Chip With Sintered Connections To Package App 20120313264 - Sato; Hiroaki ; et al.	2012-12-13
Semiconductor Chip Package Assembly And Method For Making Same App 20120313238 - Sato; Hiroaki ; et al.	2012-12-13
Fan-out Wlp With Package App 20120313253 - Nakadaira; Yoshikuni ; et al.	2012-12-13
Semiconductor Chip Package Assembly And Method For Making Same App 20120286416 - Sato; Hiroaki ; et al.	2012-11-15
Semiconductor Chip Assembly And Method For Making Same App 20120155055 - Kang; Teck-Gyu ; et al.	2012-06-21
Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package App 20060151878 - Jeong; Se-Young ; et al.	2006-07-13

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