Naito; Nobuhiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Naito; Nobuhiro.The latest application filed is for "liquid layer thickness measurement method, measurement device, film production method".

Company Profile

2.6.12

Naito; Nobuhiro - Hara-Mura JP
Naito; Nobuhiro - Otsu-shi JP
Naito; Nobuhiro - Otsu JP
Naito; Nobuhiro - Chino JP
Naito; Nobuhiro - Chino-shi JP
NAITO; Nobuhiro - Suwa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid discharge head and liquid discharge apparatus Grant 11,345,151 - Tamai , et al. May 31, 2	2022-05-31
Liquid Layer Thickness Measurement Method, Measurement Device, Film Production Method App 20210239456 - Nakajima; Kenta ; et al.	2021-08-05
Liquid Discharge Head And Liquid Discharge Apparatus App 20210094296 - TAMAI; Shotaro ; et al.	2021-04-01
Nip roller and method of manufacturing film roll body Grant 10,370,215 - Ichinomiya , et al.	2019-08-06
Nip Roller And Method Of Manufacturing Film Roll Body App 20180312360 - Ichinomiya; Takashi ; et al.	2018-11-01
Nozzle plate, liquid ejecting head, and liquid ejecting apparatus Grant 9,327,500 - Nagatoya , et al. May 3, 2	2016-05-03
Liquid ejecting head and liquid ejecting apparatus Grant 8,936,355 - Wakamatsu , et al. January 20, 2	2015-01-20
Liquid ejecting head and liquid ejecting apparatus Grant 8,905,523 - Nagatoya , et al. December 9, 2	2014-12-09
Liquid Ejecting Head And Liquid Ejecting Apparatus App 20140184705 - Wakamatsu; Kosuke ; et al.	2014-07-03
Nozzle Plate, Liquid Ejecting Head, And Liquid Ejecting Apparatus App 20140183284 - Nagatoya; Satoshi ; et al.	2014-07-03
Liquid Ejecting Head And Liquid Ejecting Apparatus App 20140184706 - NAGATOYA; Satoshi ; et al.	2014-07-03
Bonding Method And Bonded Structure App 20100304156 - SATO; Mitsuru ; et al.	2010-12-02
Bonding Method And Bonded Structure App 20100304157 - SATO; Mitsuru ; et al.	2010-12-02
Bonding Method And Bonded Structure App 20100206474 - SATO; Mitsuru ; et al.	2010-08-19
Bonding Method And Bonded Body App 20100092788 - NAITO; Nobuhiro ; et al.	2010-04-15
Bonding Method And Bonded Body App 20100092767 - NAITO; Nobuhiro ; et al.	2010-04-15
Method for manufacturing optical module, positioning apparatus, evaluation method and evaluation apparatus for evaluating optical module Grant 7,593,104 - Naito , et al. September 22, 2	2009-09-22
Method For Manufacturing Optical Module, Positioning Apparatus, Evaluation Method And Evaluation Apparatus For Evaluating Optical Module App 20070091312 - NAITO; Nobuhiro ; et al.	2007-04-26

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