Nair; Krishna K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nair; Krishna K..The latest application filed is for "electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers".

Company Profile

0.7.7

Nair; Krishna K. - Apex NC
Nair; Krishna K. - Binghamton NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers Grant 8,294,269 - Nair , et al. October 23, 2	2012-10-23
Electronic Structures Including Conductive Layers Comprising Copper and Having a Thickness of at Least 0.5 Micrometers App 20110084392 - Nair; Krishna K. ; et al.	2011-04-14
Methods of forming electronic structures including conductive shunt layers and related structures Grant 7,879,715 - Nair , et al. February 1, 2	2011-02-01
Methods Of Forming Electronic Structures Including Conductive Shunt Layers And Related Structures App 20080026560 - Nair; Krishna K. ; et al.	2008-01-31
Methods of forming electronic structures including conductive shunt layers and related structures Grant 7,297,631 - Nair , et al. November 20, 2	2007-11-20
Low temperature methods of bonding components and related structures App 20070040003 - Rinne; Glenn A. ; et al.	2007-02-22
Low temperature methods of bonding components and related structures Grant 7,156,284 - Rinne , et al. January 2, 2	2007-01-02
Methods of forming electronic structures including conductive shunt layers and related structures App 20060009023 - Nair; Krishna K. ; et al.	2006-01-12
Electronic structures including conductive shunt layers Grant 6,960,828 - Nair , et al. November 1, 2	2005-11-01
Low temperature methods of bonding components Grant 6,863,209 - Rinne , et al. March 8, 2	2005-03-08
Low temperature methods of bonding components and related structures App 20040169064 - Rinne, Glenn A. ; et al.	2004-09-02
Methods of forming electronic structures including conductive shunt layers and related structures App 20040053483 - Nair, Krishna K. ; et al.	2004-03-18
Low temperature methods of bonding components and related structures App 20020074381 - Rinne, Glenn A. ; et al.	2002-06-20
Process for making multilayer integrated circuit substrate Grant 4,386,116 - Nair , et al. May 31, 1	1983-05-31

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