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name:-0.02687406539917
name:-0.015269041061401
name:-0.0091629028320312
Nair; Deepukumar M. Patent Filings

Nair; Deepukumar M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nair; Deepukumar M..The latest application filed is for "electronic package arrangements and related methods".

Company Profile
7.14.18
  • Nair; Deepukumar M. - Lake Mary FL
  • Nair; Deepukumar M - Cary NC
  • NAIR; DEEPUKUMAR M. - Cary NC
  • Nair; Deepukumar M. - Christiansburg VA
  • Nair; Deepukumar M. - Peru IN
  • Nair; Deepukumar M. - Kokomo IN
  • Nair; Deepukumar M. - Corning NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electronic package arrangements and related methods
Grant 11,114,363 - Nair , et al. September 7, 2
2021-09-07
Laminate substrate with sintered components
Grant 10,906,274 - Railkar , et al. February 2, 2
2021-02-02
Electronic Package Arrangements And Related Methods
App 20200203248 - Nair; Deepukumar M. ;   et al.
2020-06-25
Laminate Substrate With Sintered Components
App 20200147938 - Railkar; Tarak A. ;   et al.
2020-05-14
Process For Making Laminate Substrate With Sintered Components
App 20200147695 - Railkar; Tarak A. ;   et al.
2020-05-14
Multi-layer substrate with integrated resonator
Grant 10,587,029 - Dekosky , et al.
2020-03-10
Substrate With Embedded Active Thermoelectric Cooler
App 20190131209 - Woods; Mark C. ;   et al.
2019-05-02
Multi-layer Substrate With Integrated Resonator
App 20190074571 - Dekosky; Jeffrey ;   et al.
2019-03-07
Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape
Grant 9,579,748 - Nair , et al. February 28, 2
2017-02-28
Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications
Grant 9,153,863 - Nair , et al. October 6, 2
2015-10-06
Method Of Fabricating Electromagnetic Bandgap (ebg) Structures For Microwave/millimeterwave Applications Using Laser Processing Of Unfired Low Temperature Co-fired Ceramic (ltcc) Tape
App 20140354513 - NAIR; DEEPUKUMAR M. ;   et al.
2014-12-04
Method Of Making Microwave And Millimeterwave Electronic Circuits By Laser Patterning Of Unfired Low Temperature Co-fired Ceramic (ltcc) Substrates
App 20140353005 - NAIR; DEEPUKUMAR M. ;   et al.
2014-12-04
Low temperature co-fired ceramic structure for high frequency applications and process for making same
Grant 8,742,262 - Gordon , et al. June 3, 2
2014-06-03
Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom
Grant 8,633,858 - Nair , et al. January 21, 2
2014-01-21
LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) SYSTEM IN A PACKAGE (SiP) CONFIGURATIONS FOR MICROWAVE/MILLIMETER WAVE PACKAGING APPLICATIONS
App 20130189935 - NAIR; DEEPUKUMAR M. ;   et al.
2013-07-25
Thin-film capacitor structures embedded in semiconductor packages and methods of making
Grant 8,391,017 - McGregor , et al. March 5, 2
2013-03-05
Low Temperature Co-fired Ceramic Structure For High Frequency Applications And Process For Making Same
App 20120305296 - GORDON; SCOTT E. ;   et al.
2012-12-06
Method Of Manufacturing High Frequency Receiving And/or Transmitting Devices From Low Temperature Co Fired Ceramic Materials And Devices Made Therefrom
App 20110187602 - Nair; Deepukumar M. ;   et al.
2011-08-04
Microwave communication package
Grant 7,855,685 - Walsh , et al. December 21, 2
2010-12-21
Thin-film Capacitor Structures Embedded In Semiconductor Packages And Methods Of Making
App 20100270646 - CHAN; CHEONG-WO HUNTER ;   et al.
2010-10-28
Thin-film Capacitor Structures Embedded In Semiconductor Packages And Methods Of Making
App 20100270645 - MCGREGOR; DAVID ROSS ;   et al.
2010-10-28
High-frequency electromagnetic bandgap device and method for making same
Grant 7,586,444 - Berlin , et al. September 8, 2
2009-09-08
Microwave communication package
App 20090085808 - Walsh; Matthew R. ;   et al.
2009-04-02
Electromagnetic bandgap motion sensor device and method for making same
App 20080142911 - Berlin; Carl W. ;   et al.
2008-06-19
High-frequency electromagnetic bandgap device and method for making same
App 20080129645 - Berlin; Carl W. ;   et al.
2008-06-05
Method for creating and tuning Electromagnetic Bandgap structure and device
App 20070224737 - Berlin; Carl W. ;   et al.
2007-09-27
Ball coax interconnect
App 20060226928 - Henning; Larry C. ;   et al.
2006-10-12
Multiple fiber chip clamp
Grant 6,731,853 - Boudreau , et al. May 4, 2
2004-05-04
Multiple fiber chip clamp
App 20020131752 - Boudreau, Robert A. ;   et al.
2002-09-19

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