Patent | Date |
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Electronic package arrangements and related methods Grant 11,114,363 - Nair , et al. September 7, 2 | 2021-09-07 |
Laminate substrate with sintered components Grant 10,906,274 - Railkar , et al. February 2, 2 | 2021-02-02 |
Electronic Package Arrangements And Related Methods App 20200203248 - Nair; Deepukumar M. ;   et al. | 2020-06-25 |
Laminate Substrate With Sintered Components App 20200147938 - Railkar; Tarak A. ;   et al. | 2020-05-14 |
Process For Making Laminate Substrate With Sintered Components App 20200147695 - Railkar; Tarak A. ;   et al. | 2020-05-14 |
Multi-layer substrate with integrated resonator Grant 10,587,029 - Dekosky , et al. | 2020-03-10 |
Substrate With Embedded Active Thermoelectric Cooler App 20190131209 - Woods; Mark C. ;   et al. | 2019-05-02 |
Multi-layer Substrate With Integrated Resonator App 20190074571 - Dekosky; Jeffrey ;   et al. | 2019-03-07 |
Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape Grant 9,579,748 - Nair , et al. February 28, 2 | 2017-02-28 |
Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications Grant 9,153,863 - Nair , et al. October 6, 2 | 2015-10-06 |
Method Of Fabricating Electromagnetic Bandgap (ebg) Structures For Microwave/millimeterwave Applications Using Laser Processing Of Unfired Low Temperature Co-fired Ceramic (ltcc) Tape App 20140354513 - NAIR; DEEPUKUMAR M. ;   et al. | 2014-12-04 |
Method Of Making Microwave And Millimeterwave Electronic Circuits By Laser Patterning Of Unfired Low Temperature Co-fired Ceramic (ltcc) Substrates App 20140353005 - NAIR; DEEPUKUMAR M. ;   et al. | 2014-12-04 |
Low temperature co-fired ceramic structure for high frequency applications and process for making same Grant 8,742,262 - Gordon , et al. June 3, 2 | 2014-06-03 |
Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefrom Grant 8,633,858 - Nair , et al. January 21, 2 | 2014-01-21 |
LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) SYSTEM IN A PACKAGE (SiP) CONFIGURATIONS FOR MICROWAVE/MILLIMETER WAVE PACKAGING APPLICATIONS App 20130189935 - NAIR; DEEPUKUMAR M. ;   et al. | 2013-07-25 |
Thin-film capacitor structures embedded in semiconductor packages and methods of making Grant 8,391,017 - McGregor , et al. March 5, 2 | 2013-03-05 |
Low Temperature Co-fired Ceramic Structure For High Frequency Applications And Process For Making Same App 20120305296 - GORDON; SCOTT E. ;   et al. | 2012-12-06 |
Method Of Manufacturing High Frequency Receiving And/or Transmitting Devices From Low Temperature Co Fired Ceramic Materials And Devices Made Therefrom App 20110187602 - Nair; Deepukumar M. ;   et al. | 2011-08-04 |
Microwave communication package Grant 7,855,685 - Walsh , et al. December 21, 2 | 2010-12-21 |
Thin-film Capacitor Structures Embedded In Semiconductor Packages And Methods Of Making App 20100270646 - CHAN; CHEONG-WO HUNTER ;   et al. | 2010-10-28 |
Thin-film Capacitor Structures Embedded In Semiconductor Packages And Methods Of Making App 20100270645 - MCGREGOR; DAVID ROSS ;   et al. | 2010-10-28 |
High-frequency electromagnetic bandgap device and method for making same Grant 7,586,444 - Berlin , et al. September 8, 2 | 2009-09-08 |
Microwave communication package App 20090085808 - Walsh; Matthew R. ;   et al. | 2009-04-02 |
Electromagnetic bandgap motion sensor device and method for making same App 20080142911 - Berlin; Carl W. ;   et al. | 2008-06-19 |
High-frequency electromagnetic bandgap device and method for making same App 20080129645 - Berlin; Carl W. ;   et al. | 2008-06-05 |
Method for creating and tuning Electromagnetic Bandgap structure and device App 20070224737 - Berlin; Carl W. ;   et al. | 2007-09-27 |
Ball coax interconnect App 20060226928 - Henning; Larry C. ;   et al. | 2006-10-12 |
Multiple fiber chip clamp Grant 6,731,853 - Boudreau , et al. May 4, 2 | 2004-05-04 |
Multiple fiber chip clamp App 20020131752 - Boudreau, Robert A. ;   et al. | 2002-09-19 |