Naik; Rajan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Naik; Rajan.The latest application filed is for "wirebond structure and method to connect to a microelectronic die".
- Naik; Rajan - Cambridge MA
| Patent | Date |
|---|---|
| Wirebond structure and method to connect to a microelectronic die Grant 7,855,103 - Gleixner , et al. December 21, 2 | 2010-12-21 |
| Wirebond Structure And Method To Connect To A Microelectronic Die App 20080227285 - GLEIXNER; ROBERT J. ; et al. | 2008-09-18 |
| Wirebond structure and method to connect to a microelectronic die Grant 7,393,772 - Gleixner , et al. July 1, 2 | 2008-07-01 |
| Wirebond structure and method to connect to a microelectronic die Grant 6,924,554 - Gleixner , et al. August 2, 2 | 2005-08-02 |
| Wirebond structure and method to connect to a microelectronic die App 20050079651 - Gleixner, Robert J. ; et al. | 2005-04-14 |
| Wirebond structure and method to connect to a microelectronic die Grant 6,683,383 - Gleixner , et al. January 27, 2 | 2004-01-27 |
| Wirebond structure and method to connect to a microelectronic die App 20030205827 - Gleixner, Robert J. ; et al. | 2003-11-06 |
| Wirebond structure and method to connect to a microelectronic die App 20030075804 - Gleixner, Robert J. ; et al. | 2003-04-24 |
| SEC | 0001750714 | NAIK RAJAN |
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