| Patent | Date |
|---|
Subtractive Metals And Subtractive Metal Semiconductor Structures
App 20220285212 - REN; He ; et al. | 2022-09-08 |
Doped selective metal caps to improve copper electromigration with ruthenium liner
Grant 11,373,903 - Naik , et al. June 28, 2 | 2022-06-28 |
Gap fill deposition process
Grant 11,101,174 - Jiang , et al. August 24, 2 | 2021-08-24 |
Interconnection structure of selective deposition process
Grant 11,094,588 - You , et al. August 17, 2 | 2021-08-17 |
Method Of Cleaning A Structure And Method Of Depositing A Capping Layer In A Structure
App 20210233765 - YOSHIDA; Naomi ; et al. | 2021-07-29 |
Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping
Grant 11,043,415 - Wu , et al. June 22, 2 | 2021-06-22 |
Gap Fill Deposition Process
App 20210111067 - JIANG; Hao ; et al. | 2021-04-15 |
Methods for etching a structure for semiconductor applications
Grant 10,957,533 - Jiang , et al. March 23, 2 | 2021-03-23 |
Interconnection Structure Of Selective Deposition Process
App 20210074583 - YOU; Shi ; et al. | 2021-03-11 |
Methods for forming a metal silicide interconnection nanowire structure
Grant 10,930,472 - Mebarki , et al. February 23, 2 | 2021-02-23 |
Methods of forming metal silicide layers and metal silicide layers formed therefrom
Grant 10,916,433 - Ren , et al. February 9, 2 | 2021-02-09 |
Seed layers for copper interconnects
Grant 10,847,463 - Wu , et al. November 24, 2 | 2020-11-24 |
Process integration approach of selective tungsten via fill
Grant 10,727,119 - Ren , et al. | 2020-07-28 |
Enhanced Cobalt Agglomeration Resistance And Gap-fill Performance By Ruthenium Doping
App 20200235006 - WU; Zhiyuan ; et al. | 2020-07-23 |
Methods for manufacturing an interconnect structure for semiconductor devices
Grant 10,692,759 - Jiang , et al. | 2020-06-23 |
Process integration method to tune resistivity of nickel silicide
Grant 10,651,043 - Ren , et al. | 2020-05-12 |
Methods For Etching A Structure For Semiconductor Applications
App 20200135459 - JIANG; Hao ; et al. | 2020-04-30 |
Seam-healing method upon supra-atmospheric process in diffusion promoting ambient
Grant 10,636,704 - Mebarki , et al. | 2020-04-28 |
Laminate and core shell formation of silicide nanowire
Grant 10,593,592 - Mebarki , et al. | 2020-03-17 |
Method to improve film stability
Grant 10,566,188 - Clemons , et al. Feb | 2020-02-18 |
Method to reduce trap-induced capacitance in interconnect dielectric barrier stack
Grant 10,546,742 - Ren , et al. Ja | 2020-01-28 |
Methods For Manufacturing An Interconnect Structure For Semiconductor Devices
App 20200027782 - JIANG; Hao ; et al. | 2020-01-23 |
Process Integration Method To Tune Resistivity Of Nickel Silicide
App 20190371610 - REN; He ; et al. | 2019-12-05 |
Method To Improve Film Stability
App 20190355579 - CLEMONS; Maximillian ; et al. | 2019-11-21 |
Method And Apparatus For Protecting Metal Interconnect From Halogen Based Precursors
App 20190348369 - NAIK; Mehul B. ; et al. | 2019-11-14 |
Methods Of Forming Metal Silicide Layers And Metal Silicide Layers Formed Therefrom
App 20190311908 - REN; He ; et al. | 2019-10-10 |
Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping
Grant 10,410,918 - Wu , et al. Sept | 2019-09-10 |
Process integration method to tune resistivity of nickel silicide
Grant 10,388,533 - Ren , et al. A | 2019-08-20 |
Method To Reduce Trap-induced Capacitance In Interconnect Dielectric Barrier Stack
App 20190189433 - REN; He ; et al. | 2019-06-20 |
Methods For Forming A Metal Silicide Interconnection Nanowire Structure
App 20190172686 - MEBARKI; Bencherki ; et al. | 2019-06-06 |
Process Integration Approach Of Selective Tungsten Via Fill
App 20190157145 - REN; He ; et al. | 2019-05-23 |
Methods For Forming Capping Protection For An Interconnection Structure
App 20190148150 - LEE; Joung Joo ; et al. | 2019-05-16 |
Process integration approach of selective tungsten via fill
Grant 10,256,144 - Ren , et al. | 2019-04-09 |
Seed Layers For Copper Interconnects
App 20190067201 - WU; Zhiyuan ; et al. | 2019-02-28 |
Seam-healing Method Upon Supra-atmospheric Process In Diffusion Promoting Ambient
App 20190051557 - MEBARKI; Bencherki ; et al. | 2019-02-14 |
Method to reduce trap-induced capacitance in interconnect dielectric barrier stack
Grant 10,170,299 - Ren , et al. J | 2019-01-01 |
Process Integration Method To Tune Resistivity Of Nickel Silicide
App 20180366328 - REN; He ; et al. | 2018-12-20 |
Process Integration Approach Of Selective Tungsten Via Fill
App 20180315650 - REN; He ; et al. | 2018-11-01 |
UV assisted silylation for porous low-k film sealing
Grant 10,113,234 - Xie , et al. October 30, 2 | 2018-10-30 |
Seam-healing method upon supra-atmospheric process in diffusion promoting ambient
Grant 10,049,927 - Mebarki , et al. August 14, 2 | 2018-08-14 |
Enhanced Cobalt Agglomeration Resistance And Gap-fill Performance By Ruthenium Doping
App 20180211872 - WU; Zhiyuan ; et al. | 2018-07-26 |
Dielectric/metal barrier integration to prevent copper diffusion
Grant 10,008,448 - Ren , et al. June 26, 2 | 2018-06-26 |
Method and apparatus for protecting metal interconnect from halogen based precursors
Grant 10,002,834 - Naik , et al. June 19, 2 | 2018-06-19 |
Doped Selective Metal Caps To Improve Copper Electromigration With Ruthenium Liner
App 20180096888 - NAIK; Mehul B. ; et al. | 2018-04-05 |
Silicide phase control by confinement
Grant 9,865,466 - Mebarki , et al. January 9, 2 | 2018-01-09 |
Seam-healing Method Upon Supra-atmospheric Process In Diffusion Promoting Ambient
App 20170358490 - MEBARKI; Bencherki ; et al. | 2017-12-14 |
Interconnect integration for sidewall pore seal and via cleanliness
Grant 9,793,108 - Ren , et al. October 17, 2 | 2017-10-17 |
Dielectric/metal Barrier Integration To Prevent Copper Diffusion
App 20170162511 - REN; He ; et al. | 2017-06-08 |
Integrated metal spacer and air gap interconnect
Grant 9,640,424 - Ren , et al. May 2, 2 | 2017-05-02 |
Direct deposition of nickel silicide nanowire
Grant 9,613,859 - Lakshmanan , et al. April 4, 2 | 2017-04-04 |
Silicide Phase Control By Confinement
App 20170092502 - MEBARKI; Bencherki ; et al. | 2017-03-30 |
Dielectric/metal barrier integration to prevent copper diffusion
Grant 9,601,431 - Ren , et al. March 21, 2 | 2017-03-21 |
Method To Reduce Trap-induced Capacitance In Interconnect Dielectric Barrier Stack
App 20170005041 - REN; He ; et al. | 2017-01-05 |
Interconnect Integration For Sidewall Pore Seal And Via Cleanliness
App 20160379819 - REN; He ; et al. | 2016-12-29 |
Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications
Grant 9,508,561 - Naik , et al. November 29, 2 | 2016-11-29 |
Method And Apparatus For Protecting Metal Interconnect From Halogen Based Precursors
App 20160268207 - NAIK; Mehul B. ; et al. | 2016-09-15 |
Integrated Metal Spacer And Air Gap Interconnect
App 20160211172 - REN; He ; et al. | 2016-07-21 |
Direct Deposition Of Nickel Silicide Nanowire
App 20160204027 - LAKSHMANAN; Annamalai ; et al. | 2016-07-14 |
Laminate And Core Shell Formation Of Silicide Nanowire
App 20160204029 - MEBARKI; Bencherki ; et al. | 2016-07-14 |
Metal-containing films as dielectric capping barrier for advanced interconnects
Grant 9,368,448 - Chen , et al. June 14, 2 | 2016-06-14 |
Method for critical dimension reduction using conformal carbon films
Grant 9,337,051 - Mebarki , et al. May 10, 2 | 2016-05-10 |
Integrated cluster to enable next generation interconnect
Grant 9,318,383 - Naik , et al. April 19, 2 | 2016-04-19 |
Air gap structure integration using a processing system
Grant 9,312,168 - Naik , et al. April 12, 2 | 2016-04-12 |
Integrated metal spacer and air gap interconnect
Grant 9,305,831 - Ren , et al. April 5, 2 | 2016-04-05 |
Methods for etching a dielectric barrier layer in a dual damascene structure
Grant 9,299,577 - Ren , et al. March 29, 2 | 2016-03-29 |
Methods for forming passivation protection for an interconnection structure
Grant 9,299,605 - Ren , et al. March 29, 2 | 2016-03-29 |
Methods for forming interconnect structure utilizing selective protection process for hardmask removal process
Grant 9,269,563 - Ren , et al. February 23, 2 | 2016-02-23 |
Integrated Cluster To Enable Next Generation Interconnect
App 20160049331 - NAIK; Mehul B. ; et al. | 2016-02-18 |
Method For Critical Dimension Reduction Using Conformal Carbon Films
App 20160049305 - MEBARKI; Bencherki ; et al. | 2016-02-18 |
Uv Assisted Silylation For Porous Low-k Film Sealing
App 20160017492 - XIE; Bo ; et al. | 2016-01-21 |
Methods For Forming Interconnect Structure Utilizing Selective Protection Process For Hardmask Removal Process
App 20150357183 - REN; He ; et al. | 2015-12-10 |
Integrated cluster to enable next generation interconnect
Grant 9,184,093 - Naik , et al. November 10, 2 | 2015-11-10 |
Integrated Metal Spacer And Air Gap Interconnect
App 20150279726 - REN; He ; et al. | 2015-10-01 |
Methods For Forming Interconnection Structures In An Integrated Cluster System For Semicondcutor Applications
App 20150262869 - NAIK; Mehul B. ; et al. | 2015-09-17 |
Methods For Forming Passivation Protection For An Interconnection Structure
App 20150255329 - Ren; He ; et al. | 2015-09-10 |
Dielectric/metal Barrier Integration To Prevent Copper Diffusion
App 20150221596 - REN; He ; et al. | 2015-08-06 |
Methods For Etching A Dielectric Barrier Layer In A Dual Damascene Structure
App 20150214101 - REN; He ; et al. | 2015-07-30 |
Metal-containing Films As Dielectric Capping Barrier For Advanced Interconnects
App 20150179581 - CHEN; Yihong ; et al. | 2015-06-25 |
Air Gap Structure Integration Using A Processing System
App 20150170956 - NAIK; Mehul B. ; et al. | 2015-06-18 |
Process for damascene structure with reduced low-k damage
Grant 8,951,911 - Naik , et al. February 10, 2 | 2015-02-10 |
Integrated Cluster To Enable Next Generation Interconnect
App 20140273430 - NAIK; Mehul B. ; et al. | 2014-09-18 |
Process For Damascene Structure With Reduced Low-k Damage
App 20120252206 - NAIK; MEHUL B. ; et al. | 2012-10-04 |
Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop
Grant 7,910,476 - Fang , et al. March 22, 2 | 2011-03-22 |
Method For Critical Dimension Shrink Using Conformal Pecvd Films
App 20090286402 - Xia; Li-Qun ; et al. | 2009-11-19 |
Adhesion And Minimizing Oxidation On Electroless Co Alloy Films For Integration With Low K Inter-metal Dielectric And Etch Stop
App 20090029544 - Fang; Hongbin ; et al. | 2009-01-29 |
Method of forming a dual damascene structure utilizing a three layer hard mask structure
Grant 7,226,853 - Bekiaris , et al. June 5, 2 | 2007-06-05 |
Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stop
App 20070099417 - Fang; Hongbin ; et al. | 2007-05-03 |
Solvent free photoresist strip and residue removal processing for post etching of low-k films
App 20050158667 - Nguyen, Huong Thanh ; et al. | 2005-07-21 |
Damascene structure fabricated using a layer of silicon-based photoresist material
Grant 6,825,562 - Naik , et al. November 30, 2 | 2004-11-30 |
Solvent free photoresist strip and residue removal processing for post etching of low-k films
Grant 6,680,164 - Nguyen , et al. January 20, 2 | 2004-01-20 |
Method of forming a dual damascene structure
App 20030119307 - Bekiaris, Nikolaos ; et al. | 2003-06-26 |
Solvent free photoresist strip and residue removal processing for post etching of low-k films
App 20030104320 - Nguyen, Huong Thanh ; et al. | 2003-06-05 |
Damascene structure fabricated using a layer of silicon-based photoresist material
App 20030062627 - Naik, Mehul B. ; et al. | 2003-04-03 |
Damascene structure fabricated using a layer of silicon-based photoresist material
Grant 6,514,857 - Naik , et al. February 4, 2 | 2003-02-04 |
Integrated circuit interconnect lines having sidewall layers
Grant 6,391,771 - Naik , et al. May 21, 2 | 2002-05-21 |
Damascene structure fabricated using a layer of silicon-based photoresist material
Grant 6,204,168 - Naik , et al. March 20, 2 | 2001-03-20 |
Metallization process and method
Grant 6,169,030 - Naik , et al. January 2, 2 | 2001-01-02 |
| 