loadpatents
name:-0.00699782371521
name:-0.011841058731079
name:-0.0072441101074219
Nagura; Seiichi Patent Filings

Nagura; Seiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nagura; Seiichi.The latest application filed is for "fluid pressure cylinder".

Company Profile
7.15.4
  • Nagura; Seiichi - Moriya JP
  • NAGURA; Seiichi - Moriya-shi JP
  • Nagura; Seiichi - Tsukubamirai N/A JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Fluid pressure cylinder
Grant 11,261,885 - Takakuwa , et al. March 1, 2
2022-03-01
Fluid Pressure Cylinder
App 20210317850 - TAKAKUWA; Youji ;   et al.
2021-10-14
Pressure Booster
App 20210293258 - ASAHARA; Hiroyuki ;   et al.
2021-09-23
Pressure booster
Grant 10,851,806 - Asahara , et al. December 1, 2
2020-12-01
Boosting Device
App 20200232449 - ASAHARA; Hiroyuki ;   et al.
2020-07-23
Fluid pressure cylinder
Grant D890,215 - Sato , et al.
2020-07-14
Fluid pressure cylinder
Grant D890,214 - Sato , et al.
2020-07-14
Fluid pressure cylinder
Grant D890,213 - Sato , et al.
2020-07-14
Fluid pressure cylinder
Grant D888,773 - Sato , et al.
2020-06-30
Fluid pressure cylinder
Grant D888,775 - Sato , et al.
2020-06-30
Pressure Booster
App 20200063760 - ASAHARA; Hiroyuki ;   et al.
2020-02-27
Sensor mount assembly
Grant D782,929 - Takakuwa , et al. April 4, 2
2017-04-04
Sensor mount assembly
Grant D782,931 - Takakuwa , et al. April 4, 2
2017-04-04
Sensor mount assembly
Grant D782,930 - Takakuwa , et al. April 4, 2
2017-04-04
Sensor mount assembly
Grant D782,928 - Takakuwa , et al. April 4, 2
2017-04-04

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