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Patent applications and USPTO patent grants for Nagura; Seiichi.The latest application filed is for "fluid pressure cylinder".
Patent | Date |
---|---|
Fluid pressure cylinder Grant 11,261,885 - Takakuwa , et al. March 1, 2 | 2022-03-01 |
Fluid Pressure Cylinder App 20210317850 - TAKAKUWA; Youji ;   et al. | 2021-10-14 |
Pressure Booster App 20210293258 - ASAHARA; Hiroyuki ;   et al. | 2021-09-23 |
Pressure booster Grant 10,851,806 - Asahara , et al. December 1, 2 | 2020-12-01 |
Boosting Device App 20200232449 - ASAHARA; Hiroyuki ;   et al. | 2020-07-23 |
Fluid pressure cylinder Grant D890,215 - Sato , et al. | 2020-07-14 |
Fluid pressure cylinder Grant D890,214 - Sato , et al. | 2020-07-14 |
Fluid pressure cylinder Grant D890,213 - Sato , et al. | 2020-07-14 |
Fluid pressure cylinder Grant D888,773 - Sato , et al. | 2020-06-30 |
Fluid pressure cylinder Grant D888,775 - Sato , et al. | 2020-06-30 |
Pressure Booster App 20200063760 - ASAHARA; Hiroyuki ;   et al. | 2020-02-27 |
Sensor mount assembly Grant D782,929 - Takakuwa , et al. April 4, 2 | 2017-04-04 |
Sensor mount assembly Grant D782,931 - Takakuwa , et al. April 4, 2 | 2017-04-04 |
Sensor mount assembly Grant D782,930 - Takakuwa , et al. April 4, 2 | 2017-04-04 |
Sensor mount assembly Grant D782,928 - Takakuwa , et al. April 4, 2 | 2017-04-04 |
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