NAGAURA; Tomota

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAGAURA; Tomota.The latest application filed is for "copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconduct".

Company Profile

2.10.15

NAGAURA; Tomota - Ibaraki JP
Nagaura; Tomota - Hitachi JP
Nagaura; Tomota - Hitachi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper Sulfate, Copper Sulfate Solution, Plating Solution, Method For Producing Copper Sulfate, Method For Producing Semiconduct App 20200095699 - NAGAURA; Tomota ; et al.	2020-03-26
Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus Grant 10,519,558 - Nagaura , et al. Dec	2019-12-31
Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device Grant 10,332,756 - Moriyama , et al.	2019-06-25
Carrier-attached copper foil, laminate, printed-wiring board and method for manufacturing the printed wiring board Grant 10,201,092 - Nagaura Fe	2019-02-05
Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board Grant 10,187,983 - Kohiki , et al. Ja	2019-01-22
Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device Grant 10,123,433 - Moriyama , et al. November 6, 2	2018-11-06
Copper Sulfate, Copper Sulfate Solution, Plating Solution, Method For Producing Copper Sulfate, Method For Producing Semiconductor Circuit Board, And Method For Producing Electronic Apparatus App 20180312989 - NAGAURA; Tomota ; et al.	2018-11-01
Copper Sulfate, Copper Sulfate Solution, Plating Solution, Method For Producing Copper Sulfate, Method For Producing Semiconductor Circuit Board, And Method For Producing Electronic Apparatus App 20180282891 - Nagaura; Tomota ; et al.	2018-10-04
Carrier-attached copper foil Grant 9,826,635 - Nagaura , et al. November 21, 2	2017-11-21
Copper foil with carrier Grant 9,788,423 - Nagaura , et al. October 10, 2	2017-10-10
Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board Grant 9,578,741 - Nagaura , et al. February 21, 2	2017-02-21
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device App 20170032978 - Moriyama; Terumasa ; et al.	2017-02-02
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device App 20170034926 - Moriyama; Terumasa ; et al.	2017-02-02
Copper Foil With Carrier, Laminate, Printed Wiring Board, And Method Of Producing Electronic Devices App 20160381806 - MIYOSHI; YOSHIYUKI ; et al.	2016-12-29
Copper Foil With Carrier, Laminate, Printed Wiring Board, And Method Of Producing Electronic Devices App 20160381805 - MIYOSHI; YOSHIYUKI ; et al.	2016-12-29
Copper Foil With Carrier, Laminate, Method Of Producing Printed Wiring Board, And Method Of Producing Electronic Devices App 20160374205 - MORIYAMA; TERUMASA ; et al.	2016-12-22
Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Method For Manufacturing The Printed Wiring Board App 20160353581 - Nagaura; Tomota	2016-12-01
Copper Foil With Carrier App 20160242281 - Nagaura; Tomota ; et al.	2016-08-18
Copper Foil Provided With Carrier, Laminate, Printed Wiring Board, Electronic Device, And Method For Fabricating Printed Wiring Board App 20160212846 - KOHIKI; Michiya ; et al.	2016-07-21
Carrier-Attached Copper Foil App 20150086806 - Nagaura; Tomota ; et al.	2015-03-26
Carrier-attached copper foil Grant 8,980,414 - Nagaura , et al. March 17, 2	2015-03-17
Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board App 20150047884 - Nagaura; Tomota ; et al.	2015-02-19
Carrier-attached Copper Foil App 20130216855 - Nagaura; Tomota ; et al.	2013-08-22

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