| Patent | Date |
|---|
Bonded Body, Power Module Substrate, Power Module, Method For Manufacturing Bonded Body, And Method For Manufacturing Power Module Substrate
App 20220278019 - Terasaki; Nobuyuki ; et al. | 2022-09-01 |
Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate
Grant 11,404,622 - Arai , et al. August 2, 2 | 2022-08-02 |
Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate
Grant 11,393,738 - Terasaki , et al. July 19, 2 | 2022-07-19 |
Insulation Circuit Board With Heat Sink
App 20220223493 - Yumoto; Ryohei ; et al. | 2022-07-14 |
Thermoelectric Conversion Module
App 20220181533 - Arai; Koya ; et al. | 2022-06-09 |
Method of manufacturing insulating circuit board with heatsink
Grant 11,355,408 - Kitahara , et al. June 7, 2 | 2022-06-07 |
Method Of Manufacturing Bonded Body For Insulation Circuit Substrate Board And Bonded Body For Insulation Circuit Substrate Board
App 20220173010 - Yumoto; Ryohei ; et al. | 2022-06-02 |
Insulation circuit board with heat sink
Grant 11,322,424 - Yumoto , et al. May 3, 2 | 2022-05-03 |
Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board
Grant 11,289,400 - Yumoto , et al. March 29, 2 | 2022-03-29 |
Insulation circuit board with heat sink
Grant 11,289,390 - Yumoto , et al. March 29, 2 | 2022-03-29 |
Thermoelectric Conversion Module And Method For Producing Thermoelectric Conversion Module
App 20210265552 - Arai; Koya ; et al. | 2021-08-26 |
Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate
Grant 11,062,974 - Terasaki , et al. July 13, 2 | 2021-07-13 |
Insulated Heat Transfer Substrate, Thermoelectric Conversion Module, And Method For Manufacturing Insulated Heat Transfer Substrate
App 20210175401 - Arai; Koya ; et al. | 2021-06-10 |
Insulated circuit board
Grant 11,013,107 - Kitahara , et al. May 18, 2 | 2021-05-18 |
Method For Producing Insulating Circuit Substrate With Heat Sink
App 20210134609 - Yumoto; Ryouhei ; et al. | 2021-05-06 |
Insulation Circuit Board With Heat Sink
App 20210118769 - YUMOTO; Ryohei ; et al. | 2021-04-22 |
Thermoelectric Conversion Module And Method For Producing Thermoelectric Conversion Module
App 20210111327 - Arai; Koya ; et al. | 2021-04-15 |
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Producing Power Module Substrate, Paste For Copper Sheet Bonding, And Method Of Producing Bonded Body
App 20210068251 - Terasaki; Nobuyuki ; et al. | 2021-03-04 |
Method Of Manufacturing Power Module Substrate Board And Ceramic-copper Bonded Body
App 20210050278 - Kitahara; Takeshi ; et al. | 2021-02-18 |
Bonded Body, Power Module Substrate, Power Module, Method For Manufacturing Bonded Body, And Method For Manufacturing Power Module Substrate
App 20210043540 - Terasaki; Nobuyuki ; et al. | 2021-02-11 |
Method Of Manufacturing Bonded Body For Insulation Circuit Substrate Board And Bonded Body For Insulation Circuit Substrate Board
App 20210028086 - Yumoto; Ryohei ; et al. | 2021-01-28 |
Insulation Circuit Board With Heat Sink
App 20210020530 - Yumoto; Ryohei ; et al. | 2021-01-21 |
Method Of Manufacturing Insulating Circuit Board With Heatsink
App 20210020536 - Kitahara; Takeshi ; et al. | 2021-01-21 |
Insulated Circuit Board
App 20210007217 - Kitahara; Takeshi ; et al. | 2021-01-07 |
Insulated Circuit Board
App 20200413534 - Kitahara; Takeshi ; et al. | 2020-12-31 |
Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
Grant 10,734,297 - Nishimoto , et al. | 2020-08-04 |
Ceramic-aluminum conjugate, power module substrate, and power module
Grant 10,607,907 - Kuromitsu , et al. | 2020-03-31 |
Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink
Grant 10,600,719 - Terasaki , et al. | 2020-03-24 |
Thermoelectric conversion module and thermoelectric conversion device
Grant 10,573,798 - Nakada , et al. Feb | 2020-02-25 |
Method For Producing Bonded Body, Method For Producing Insulated Circuit Board, And Method For Producing Insulated Circuit Board
App 20200009671 - Yumoto; Ryouhei ; et al. | 2020-01-09 |
Ceramic/aluminum joined body, insulating circuit board, power module, LED module, and thermoelectric module
Grant 10,526,252 - Terasaki , et al. J | 2020-01-07 |
Semiconductor device
Grant 10,504,749 - Nishimoto , et al. Dec | 2019-12-10 |
Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
Grant 10,497,637 - Terasaki , et al. De | 2019-12-03 |
Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
Grant 10,497,585 - Terasaki , et al. De | 2019-12-03 |
Power module substrate
Grant 10,453,783 - Ohashi , et al. Oc | 2019-10-22 |
Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
Grant 10,410,951 - Terasaki , et al. Sept | 2019-09-10 |
Process for producing bonded body and process for producing power module substrate
Grant 10,370,303 - Terasaki , et al. | 2019-08-06 |
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
Grant 10,375,825 - Terasaki , et al. | 2019-08-06 |
Power Module Substrate
App 20190189548 - OHASHI; Toyo ; et al. | 2019-06-20 |
Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
Grant 10,319,664 - Terasaki , et al. | 2019-06-11 |
Bonded body, power module substrate with heat sink, heat sink, method of manufacturing bonded body, method of manufacturing power module substrate with heat sink, and method of manufacturing heat sink
Grant 10,283,431 - Terasaki , et al. | 2019-05-07 |
Thermoelectric Conversion Module And Thermoelectric Conversion Device
App 20190044042 - Nakada; Yoshinobu ; et al. | 2019-02-07 |
Method for manufacturing bonded body and method for manufacturing power-module substrate
Grant 10,199,237 - Terasaki , et al. Fe | 2019-02-05 |
Ag UNDERLAYER- ATTACHED METALLIC MEMBER, Ag UNDERLAYER- ATTACHED INSULATING CIRCUIT SUBSTRATE,SEMICONDUCTOR DEVICE, HEAT SINK- ATTACHED INSULATING CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING Ag UNDERLAYER-ATTACHED METALLIC MEMBER
App 20190035703 - Nishimoto; Shuji ; et al. | 2019-01-31 |
Bonded Body, Power Module Substrate, Method For Manufacturing Bonded Body, And Method For Manufacturing Power Module Substrate
App 20190035710 - Terasaki; Nobuyuki ; et al. | 2019-01-31 |
Semiconductor Device
App 20190027380 - Nishimoto; Shuji ; et al. | 2019-01-24 |
Bonded body and power module substrate
Grant 10,173,282 - Terasaki , et al. J | 2019-01-08 |
Ceramic/aluminum Joined Body, Insulating Circuit Board, Power Module, Led Module, And Thermoelectric Module
App 20180346387 - Terasaki; Nobuyuki ; et al. | 2018-12-06 |
Ceramic-aluminum Conjugate, Power Module Substrate, And Power Module
App 20180323122 - Kuromitsu; Yoshirou ; et al. | 2018-11-08 |
Copper-ceramic bonded body and power module substrate
Grant 10,103,035 - Terasaki , et al. October 16, 2 | 2018-10-16 |
Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate
Grant 10,016,956 - Terasaki , et al. July 10, 2 | 2018-07-10 |
Bonding structure of aluminum member and copper member
Grant 10,011,093 - Terasaki , et al. July 3, 2 | 2018-07-03 |
Power module substrate, method of producing same, and power module
Grant 9,966,353 - Nishimoto , et al. May 8, 2 | 2018-05-08 |
Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate
Grant 9,968,012 - Terasaki , et al. May 8, 2 | 2018-05-08 |
Power module
Grant 9,953,944 - Ohashi , et al. April 24, 2 | 2018-04-24 |
Bonded Body, Substrate For Power Module With Heat Sink, Heat Sink, Method For Producing Bonded Body, Method For Producing Substrate For Power Module With Heat Sink, And Method For Producing Heat Sink
App 20180108593 - Terasaki; Nobuyuki ; et al. | 2018-04-19 |
Power module substrate with Ag underlayer and power module
Grant 9,941,235 - Nishimoto , et al. April 10, 2 | 2018-04-10 |
Bonded Body, Substrate For Power Module With Heat Sink, Heat Sink, Method For Producing Bonded Body, Method For Producing Substrate For Power Module With Heat Sink, And Method For Producing Heat Sink
App 20180090413 - Terasaki; Nobuyuki ; et al. | 2018-03-29 |
Bonded Body, Substrate For Power Module With Heat Sink, Heat Sink, Method For Producing Bonded Body, Method For Producing Substrate For Power Module With Heat Sink, And Method For Producing Heat Sink
App 20180068871 - Terasaki; Nobuyuki ; et al. | 2018-03-08 |
Method of producing bonded body and method of producing power module substrate
Grant 9,905,437 - Terasaki , et al. February 27, 2 | 2018-02-27 |
Manufacturing Method For Junction, Manufacturing Method For Substrate For Power Module With Heat Sink, And Manufacturing Method For Heat Sink
App 20180040533 - Terasaki; Nobuyuki ; et al. | 2018-02-08 |
Bonded Body, Substrate For Power Module With Heat Sink, Heat Sink, Method For Producing Bonded Body, Method For Producing Substrate For Power Module With Heat Sink, And Method For Producing Heat Sink
App 20180040535 - Terasaki; Nobuyuki ; et al. | 2018-02-08 |
Method for manufacturing power module substrate
Grant 9,833,855 - Terasaki , et al. December 5, 2 | 2017-12-05 |
Substrate for power modules, substrate with heat sink for power modules, and power module
Grant 9,807,865 - Nagatomo , et al. October 31, 2 | 2017-10-31 |
POWER MODULE SUBSTRATE WITH Ag UNDERLAYER AND POWER MODULE
App 20170294399 - Nishimoto; Shuji ; et al. | 2017-10-12 |
Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module
Grant 9,786,577 - Terasaki , et al. October 10, 2 | 2017-10-10 |
Bonded Body, Power Module Substrate With Heat Sink, Heat Sink, Method Of Manufacturing Bonded Body, Method Of Manufacturing Power Module Substrate With Heat Sink, And Method Of Manufacturing Heat Sink
App 20170271237 - Terasaki; Nobuyuki ; et al. | 2017-09-21 |
Bonded Body, Power Module Substrate With Heat Sink, Heat Sink, Method Of Manufacturing Bonded Body, Method Of Manufacturing Power Module Substrate With Heat Sink, And Method Of Manufacturing Heat Sink
App 20170271238 - Terasaki; Nobuyuki ; et al. | 2017-09-21 |
Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module
Grant 9,764,416 - Nagase , et al. September 19, 2 | 2017-09-19 |
Bonded body, power module substrate, power module and method for producing bonded body
Grant 9,735,085 - Terasaki , et al. August 15, 2 | 2017-08-15 |
Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part
Grant 9,693,449 - Nishimoto , et al. June 27, 2 | 2017-06-27 |
Bonded body and power module substrate
Grant 9,648,737 - Terasaki , et al. May 9, 2 | 2017-05-09 |
Power module
Grant 9,642,275 - Ohashi , et al. May 2, 2 | 2017-05-02 |
Bonded Body, Power Module Substrate, Power Module And Method For Producing Bonded Body
App 20170062305 - Terasaki; Nobuyuki ; et al. | 2017-03-02 |
Power-module Substrate, Heat-sink-attached Power-module Substrate, And Heat-sink-attached Power Module
App 20170047268 - Terasaki; Nobuyuki ; et al. | 2017-02-16 |
Process For Producing Bonded Body And Process For Producing Power Module Substrate
App 20170044072 - Terasaki; Nobuyuki ; et al. | 2017-02-16 |
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Manufacturing Power Module Substrate, And Copper Member-bonding Paste
App 20170034905 - Terasaki; Nobuyuki ; et al. | 2017-02-02 |
Bonding body, power module substrate, and heat-sink-attached power module substrate
Grant 9,560,755 - Terasaki , et al. January 31, 2 | 2017-01-31 |
Bonded body and power module substrate
Grant 9,530,717 - Terasaki , et al. December 27, 2 | 2016-12-27 |
Copper-ceramic Bonded Body And Power Module Substrate
App 20160358791 - Terasaki; Nobuyuki ; et al. | 2016-12-08 |
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
Grant 9,504,144 - Terasaki , et al. November 22, 2 | 2016-11-22 |
Power module substrate, power module substrate with heat sink, and power module
Grant 9,480,144 - Nagatomo , et al. October 25, 2 | 2016-10-25 |
Power Module Substrate, Method Of Producing Same, And Power Module
App 20160293562 - Nishimoto; Shuji ; et al. | 2016-10-06 |
Power Module
App 20160276302 - Ohashi; Toyo ; et al. | 2016-09-22 |
Bonded Body And Power Module Substrate
App 20160276244 - Terasaki; Nobuyuki ; et al. | 2016-09-22 |
Bonded Body And Power Module Substrate
App 20160249452 - Terasaki; Nobuyuki ; et al. | 2016-08-25 |
Power module
Grant 9,426,915 - Ohashi , et al. August 23, 2 | 2016-08-23 |
Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module
Grant 9,414,512 - Nagatomo , et al. August 9, 2 | 2016-08-09 |
Cu/CERAMIC BONDED BODY, METHOD FOR MANUFACTURING Cu/CERAMIC BONDED BODY, AND POWER MODULE SUBSTRATE
App 20160221305 - Terasaki; Nobuyuki ; et al. | 2016-08-04 |
Power Module Substrate, Power Module Substrate With Metal Part, Power Module With Metal Part, Method For Producing Power Module Substrate, And Method For Producing Power Module Substrate With Metal Part
App 20160219693 - Nishimoto; Shuji ; et al. | 2016-07-28 |
Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device
Grant 9,401,340 - Nishimoto , et al. July 26, 2 | 2016-07-26 |
Method Of Producing Bonded Body And Method Of Producing Power Module Substrate
App 20160181123 - Terasaki; Nobuyuki ; et al. | 2016-06-23 |
Bonded Body And Power Module Substrate
App 20160167170 - Terasaki; Nobuyuki ; et al. | 2016-06-16 |
Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer
Grant 9,355,986 - Nishimoto , et al. May 31, 2 | 2016-05-31 |
Bonding Body, Power Module Substrate, And Heat-sink-attached Power Module Substrate
App 20160035660 - Terasaki; Nobuyuki ; et al. | 2016-02-04 |
Method For Manufacturing Power Module Substrate
App 20160016245 - Terasaki; Nobuyuki ; et al. | 2016-01-21 |
Substrate For Power Modules, Substrate With Heat Sink For Power Modules, And Power Module
App 20160021729 - Nagatomo; Yoshiyuki ; et al. | 2016-01-21 |
Method For Manufacturing Bonded Body And Method For Manufacturing Power-module Substrate
App 20160013073 - TERASAKI; Nobuyuki ; et al. | 2016-01-14 |
Power module substrate with heat sink, and method for producing power module substrate with heat sink
Grant 9,237,682 - Nagatomo , et al. January 12, 2 | 2016-01-12 |
Power Module Substrate, Heat-sink-attached Power Module Substrate, And Heat-sink-attached Power Module
App 20150366048 - Nagase; Toshiyuki ; et al. | 2015-12-17 |
Power Module
App 20150319877 - Ohashi; Touyou ; et al. | 2015-11-05 |
Power Module
App 20150319876 - Ohashi; Touyou ; et al. | 2015-11-05 |
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Producing Power Module Substrate, Paste For Copper Sheet Bonding, And Method Of Producing Bonded Body
App 20150313011 - Terasaki; Nobuyuki ; et al. | 2015-10-29 |
Heat-sink-attached Power Module Substrate, Heat-sink-attached Power Module, And Method For Producing Heat-sink-attached Power Module Substrate
App 20150282379 - Terasaki; Nobuyuki ; et al. | 2015-10-01 |
Semiconductor Device And Ceramic Circuit Substrate, And Producing Method Of Semiconductor Device
App 20150255419 - Nishimoto; Shuji ; et al. | 2015-09-10 |
Bonding Structure Of Aluminum Member And Copper Member
App 20150251382 - Terasaki; Nobuyuki ; et al. | 2015-09-10 |
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Method Of Manufacturing Power Module Substrate, And Copper Member-bonding Paste
App 20150208496 - Terasaki; Nobuyuki ; et al. | 2015-07-23 |
Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate
Grant 9,079,264 - Tonomura , et al. July 14, 2 | 2015-07-14 |
Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module
Grant 9,076,755 - Tonomura , et al. July 7, 2 | 2015-07-07 |
Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
Grant 9,066,433 - Kuromitsu , et al. June 23, 2 | 2015-06-23 |
Power Module Substrate With Heatsink, Power Module Substrate With Cooler And Power Module
App 20150055302 - Nagatomo; Yoshiyuki ; et al. | 2015-02-26 |
Power Module Substrate With Heat Sink, And Method For Producing Power Module Substrate With Heat Sink
App 20150055303 - Nagatomo; Yoshiyuki ; et al. | 2015-02-26 |
Power Module Substrate, Power Module Substrate With Heatsink, Power Module, And Method For Producing Power Module Substrate
App 20150041188 - Terasaki; Nobuyuki ; et al. | 2015-02-12 |
Power Module Substrate, Power Module Substrate With Heat Sink, And Power Module
App 20150034367 - Nagatomo; Yoshiyuki ; et al. | 2015-02-05 |
Solder Joint Structure, Power Module, Power Module Substrate With Heat Sink And Method Of Manufacturing The Same, And Paste For Forming Solder Base Layer
App 20150035137 - Nishimoto; Shuji ; et al. | 2015-02-05 |
Power Module Substrate, Power Module, And Method For Manufacturing Power Module Substrate
App 20150022977 - Kuromitsu; Yoshirou ; et al. | 2015-01-22 |
Power module substrate, power module, and method for manufacturing power module substrate
Grant 8,921,996 - Kuromitsu , et al. December 30, 2 | 2014-12-30 |
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, And Method Of Manufacturing Power Module Substrate
App 20140192486 - Kuromitsu; Yoshirou ; et al. | 2014-07-10 |
Power Module Substrate, Power Module, And Method For Manufacturing Power Module Substrate
App 20140015140 - Kuromitsu; Yoshirou ; et al. | 2014-01-16 |
Substrate For Power Module, Substrate With Heat Sink For Power Module, Power Module, Method For Producing Substrate For Power Module, And Method For Producing Substrate With Heat Sink For Power Module
App 20130335921 - Nagatomo; Yoshiyuki ; et al. | 2013-12-19 |
Power module substrate, power module, and method for manufacturing power module substrate
Grant 8,564,118 - Kuromitsu , et al. October 22, 2 | 2013-10-22 |
Ceramic Substrate, Method Of Manufacturing Ceramic Substrate, And Method Of Manufacturing Power Module Substrate
App 20130232783 - Tonomura; Hiroshi ; et al. | 2013-09-12 |
Method For Producing Substrate For Power Module With Heat Sink, Substrate For Power Module With Heat Sink, And Power Module
App 20130010429 - Tonomura; Hiroshi ; et al. | 2013-01-10 |
Substrate For Power Module And Power Module
App 20120298408 - Nagatomo; Yoshiyuki ; et al. | 2012-11-29 |
Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
Grant 8,164,909 - Nagase , et al. April 24, 2 | 2012-04-24 |
Method for manufacturing power module substrate, power module substrate, and power module
Grant 8,116,084 - Kitahara , et al. February 14, 2 | 2012-02-14 |
Power Module Substrate, Power Module, And Method For Manufacturing Power Module Substrate
App 20110074010 - Kuromitsu; Yoshirou ; et al. | 2011-03-31 |
Method For Manufacturing Power Module Substrate, Power Module Substrate, And Power Module
App 20100285331 - Kitahara; Takeshi ; et al. | 2010-11-11 |
Ceramic Substrate, Method Of Manufacturing Ceramic Substrate, And Method Of Manufacturing Power Module Substrate
App 20100258233 - Tonomura; Hiroshi ; et al. | 2010-10-14 |
Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF Al/AlN JOINT MATERIAL
App 20100230473 - Nagase; Toshiyuki ; et al. | 2010-09-16 |
Insulating Circuit Board And Insulating Circuit Board Having Cooling Sink
App 20090229864 - Kuromitsu; Yoshirou ; et al. | 2009-09-17 |
Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
Grant 7,532,481 - Nagase , et al. May 12, 2 | 2009-05-12 |
Ai/ain Joint Material, Base Plate For Power Module, Power Module, And Manufacturing Method Of Ai/ain Joint Material
App 20080248326 - Nagase; Toshiyuki ; et al. | 2008-10-09 |
Ai/Ain Joint Material, Base Plate For Power Module, Power Module, And Manufacturing Method Of Ai/Ain Joint Material
App 20070274047 - Nagase; Toshiyuki ; et al. | 2007-11-29 |
Circuit board, method of producing same, and power module
Grant 7,128,979 - Nagase , et al. October 31, 2 | 2006-10-31 |
Power module and power module with heat sink
Grant 7,019,975 - Nagatomo , et al. March 28, 2 | 2006-03-28 |
Circuit board, process for producing the same, and power module
App 20050214518 - Nagase, Toshiyuki ; et al. | 2005-09-29 |
Heat-conducting multilayer substrate and power module substrate
App 20040188828 - Nagatomo, Yoshiyuki ; et al. | 2004-09-30 |
Power module and power module with heat sink
App 20040022029 - Nagatomo, Yoshiyuki ; et al. | 2004-02-05 |
Liquid-cooled heat sink and manufacturing method thereof
Grant 6,563,709 - Negishi , et al. May 13, 2 | 2003-05-13 |
Power module substrate, method of producing the same, and semiconductor device including the substrate
Grant 6,483,185 - Nagase , et al. November 19, 2 | 2002-11-19 |
Liquid-cooled heat sink and manufacturing method thereof
App 20020101718 - Negishi, Takeshi ; et al. | 2002-08-01 |
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