Nagata; Kinji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nagata; Kinji.The latest application filed is for "solder bump forming method".
- Nagata; Kinji - Nagano JP
- Nagata; Kinji - Nagano-shi JP
| Patent | Date |
|---|---|
| Solder bump forming method Grant 7,807,560 - Imafuji , et al. October 5, 2 | 2010-10-05 |
| Multilayered wiring substrate including wiring layers and insulating layers and method of manufacturing the same Grant 7,696,613 - Nakamura , et al. April 13, 2 | 2010-04-13 |
| Solder Bump Forming Method App 20090023281 - Imafuji; Kei ; et al. | 2009-01-22 |
| Multilayered wiring substrate and method of manufacturing the same App 20070057363 - Nakamura; Junichi ; et al. | 2007-03-15 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 