Nagata; Haruto
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nagata; Haruto.The latest application filed is for "semiconductor device with heat sink plate".
- Nagata; Haruto - Sakai-shi JP
- Nagata; Haruto - Sakai JP
| Patent | Date |
|---|---|
| Semiconductor device with heat sink plate App 20080308927 - Nagata; Haruto ; et al. | 2008-12-18 |
| Method for manufacturing solid-state imaging devices Grant 7,247,509 - Yamauchi , et al. July 24, 2 | 2007-07-24 |
| Lead frame, resin-encapsulated semiconductor device, and method of producing the same App 20070007633 - Minamio; Masanori ; et al. | 2007-01-11 |
| Lead frame, resin-encapsulated semiconductor device, and method of producing the same Grant 7,126,209 - Minamio , et al. October 24, 2 | 2006-10-24 |
| Semiconductor device App 20050151242 - Nagata, Haruto ; et al. | 2005-07-14 |
| Lead frame, resin-encapsulated semiconductor device, and method of producing the same App 20050110121 - Minamio, Masanori ; et al. | 2005-05-26 |
| Method for manufacturing solid-state imaging devices App 20050074912 - Yamauchi, Kouichi ; et al. | 2005-04-07 |
| Method of mounting electronics component Grant 5,743,007 - Onishi , et al. April 28, 1 | 1998-04-28 |
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