NAGASE; Toshiyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for NAGASE; Toshiyuki.The latest application filed is for "vehicle".

Company Profile

5.23.30

NAGASE; Toshiyuki - Nisshin-shi JP
Nagase; Toshiyuki - Naka-shi JP
Nagase; Toshiyuki - Kawagoe JP
Nagase; Toshiyuki - Naka JP
NAGASE; Toshiyuki - Yokohama JP
Nagase; Toshiyuki - Kitamoto-shi JP
Nagase; Toshiyuki - Gotenba JP
NAGASE; Toshiyuki - Kawagoe-shi JP
Nagase; Toshiyuki - Gotemba JP
Nagase; Toshiyuki - Gotenba-shi JP
Nagase; Toshiyuki - Kitamoto JP
Nagase; Toshiyuki - Tokyo JP
Nagase; Toshiyuki - Gotemba-shi JP
Nagase; Toshiyuki - Kanagawa JP
Nagase; Toshiyuki - Naka-gun JP
Nagase; Toshiyuki - Saitama JP
Nagase; Toshiyuki - Omiya JP
Nagase, Toshiyuki - Saitama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Vehicle App 20220177037 - NAGASE; Toshiyuki	2022-06-09
Metal Layer-including Carbonaceous Member And Heat Conduction Plate App 20210352828 - Kita; Koichi ; et al.	2021-11-11
Hybrid Vehicle And Method For Controlling Hybrid Vehicle App 20200207235 - Ozawa; Tamaki ; et al.	2020-07-02
Ceramic-aluminum conjugate, power module substrate, and power module Grant 10,607,907 - Kuromitsu , et al.	2020-03-31
Thermoelectric conversion module and thermoelectric conversion device Grant 10,573,798 - Nakada , et al. Feb	2020-02-25
Ultrasound Probe And Ultrasound Probe Manufacturing Method App 20190069880 - NAGASE; Toshiyuki ; et al.	2019-03-07
Thermoelectric Conversion Module And Thermoelectric Conversion Device App 20190044042 - Nakada; Yoshinobu ; et al.	2019-02-07
Ceramic-aluminum Conjugate, Power Module Substrate, And Power Module App 20180323122 - Kuromitsu; Yoshirou ; et al.	2018-11-08
Resistor and method for manufacturing resistor Grant 10,121,574 - Nagase , et al. November 6, 2	2018-11-06
Light-emission Module Having Cooler And Production Method For Light-emission Module Having Cooler App 20180277730 - NAGASE; Toshiyuki ; et al.	2018-09-27
Light-emitting Module Substrate, Light-emitting Module, Substrate For Light-emitting Module Having Cooler, And Production Method For Light-emitting Module Substrate App 20180277729 - Nagase; Toshiyuki ; et al.	2018-09-27
Resistor and method for manufacturing resistor Grant 10,037,837 - Nagase , et al. July 31, 2	2018-07-31
Resistor And Method For Manufacturing Resistor App 20180012685 - Nagase; Toshiyuki ; et al.	2018-01-11
Power-module substrate and manufacturing method thereof Grant 9,862,045 - Nagase , et al. January 9, 2	2018-01-09
Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module Grant 9,764,416 - Nagase , et al. September 19, 2	2017-09-19
BMC processing circuit, USB power delivery controller, BMC reception method, and non-transitory computer readable medium storing BMC reception program Grant 9,715,263 - Nagase July 25, 2	2017-07-25
Power module Grant 9,642,275 - Ohashi , et al. May 2, 2	2017-05-02
Resistor And Method For Manufacturing Resistor App 20160336099 - Nagase; Toshiyuki ; et al.	2016-11-17
Bmc Processing Circuit, Usb Power Delivery Controller, Bmc Reception Method, And Non-transitory Computer Readable Medium Storing Bmc Reception Program App 20160254902 - NAGASE; Toshiyuki	2016-09-01
Power module Grant 9,426,915 - Ohashi , et al. August 23, 2	2016-08-23
Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device Grant 9,401,340 - Nishimoto , et al. July 26, 2	2016-07-26
Power module substrate with heat sink, and method for producing power module substrate with heat sink Grant 9,237,682 - Nagatomo , et al. January 12, 2	2016-01-12
Power Module Substrate, Heat-sink-attached Power Module Substrate, And Heat-sink-attached Power Module App 20150366048 - Nagase; Toshiyuki ; et al.	2015-12-17
Power-module Substrate And Manufacturing Method Thereof App 20150328706 - Nagase; Toshiyuki ; et al.	2015-11-19
Power Module App 20150319877 - Ohashi; Touyou ; et al.	2015-11-05
Power Module App 20150319876 - Ohashi; Touyou ; et al.	2015-11-05
Semiconductor Device And Ceramic Circuit Substrate, And Producing Method Of Semiconductor Device App 20150255419 - Nishimoto; Shuji ; et al.	2015-09-10
Power Module Substrate With Heat Sink, And Method For Producing Power Module Substrate With Heat Sink App 20150055303 - Nagatomo; Yoshiyuki ; et al.	2015-02-26
Power Module Substrate, Power Module Substrate With Heat Sink, Power Module, Paste For Forming Flux Component Intrusion-preventing Layer And Method For Bonding Bonded Body App 20140318831 - Nishikawa; Kimihito ; et al.	2014-10-30
Substrate For Power Module And Power Module App 20120298408 - Nagatomo; Yoshiyuki ; et al.	2012-11-29
Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same Grant 8,188,376 - Negishi , et al. May 29, 2	2012-05-29
Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material Grant 8,164,909 - Nagase , et al. April 24, 2	2012-04-24
Method for manufacturing power module substrate, power module substrate, and power module Grant 8,116,084 - Kitahara , et al. February 14, 2	2012-02-14
Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same Grant 8,001,682 - Negishi , et al. August 23, 2	2011-08-23
Method For Manufacturing Power Module Substrate, Power Module Substrate, And Power Module App 20100285331 - Kitahara; Takeshi ; et al.	2010-11-11
Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF Al/AlN JOINT MATERIAL App 20100230473 - Nagase; Toshiyuki ; et al.	2010-09-16
Insulation Substrate, Power Module Substrate, Manufacturing Method Thereof, And Power Module Using The Same App 20100053903 - Negishi; Takeshi ; et al.	2010-03-04
USB hub, USB-compliant apparatus, and communication system Grant 7,565,467 - Nagase July 21, 2	2009-07-21
Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material Grant 7,532,481 - Nagase , et al. May 12, 2	2009-05-12
Ai/ain Joint Material, Base Plate For Power Module, Power Module, And Manufacturing Method Of Ai/ain Joint Material App 20080248326 - Nagase; Toshiyuki ; et al.	2008-10-09
Insulation Substrate, Power Module Substrate, Manufacturing Method Thereof, and Power Module Using the Same App 20070297162 - Negishi; Takeshi ; et al.	2007-12-27
Ai/Ain Joint Material, Base Plate For Power Module, Power Module, And Manufacturing Method Of Ai/Ain Joint Material App 20070274047 - Nagase; Toshiyuki ; et al.	2007-11-29
Circuit board, method of producing same, and power module Grant 7,128,979 - Nagase , et al. October 31, 2	2006-10-31
USB hub, USB-compliant apparatus, and communication system App 20060179144 - Nagase; Toshiyuki	2006-08-10
Power module and power module with heat sink Grant 7,019,975 - Nagatomo , et al. March 28, 2	2006-03-28
Circuit board, process for producing the same, and power module App 20050214518 - Nagase, Toshiyuki ; et al.	2005-09-29
Heat-conducting multilayer substrate and power module substrate App 20040188828 - Nagatomo, Yoshiyuki ; et al.	2004-09-30
Power module and power module with heat sink App 20040022029 - Nagatomo, Yoshiyuki ; et al.	2004-02-05
Liquid-cooled heat sink and manufacturing method thereof Grant 6,563,709 - Negishi , et al. May 13, 2	2003-05-13
Power module substrate, method of producing the same, and semiconductor device including the substrate Grant 6,483,185 - Nagase , et al. November 19, 2	2002-11-19
Liquid-cooled heat sink and manufacturing method thereof App 20020101718 - Negishi, Takeshi ; et al.	2002-08-01
Ceramic circuit board with heat sink Grant 6,033,787 - Nagase , et al. March 7, 2	2000-03-07
Highly heat-radiating ceramic package Grant 5,675,474 - Nagase , et al. October 7, 1	1997-10-07

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