Nagase; Rihei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nagase; Rihei.The latest application filed is for "composition dispensable at high speed for bonding electric parts to printed wiring boards".
- Nagase; Rihei - Tokyo JP
| Patent | Date |
|---|---|
| Composition dispensable at high speed for bonding electric parts to printed wiring boards Grant 5,585,421 - Kawano , et al. December 17, 1 | 1996-12-17 |
| Hardening agent composition, method of preparing the same and thermosetting epoxy resin composition based on surface treated zeolites Grant 5,218,015 - Yasuda , et al. June 8, 1 | 1993-06-08 |
| Epoxy resin/imidazole/polyphenol adduct as epoxy curing agent Grant 5,077,355 - Nagase , et al. December 31, 1 | 1991-12-31 |
| Adhesive for surface mounting devices Grant 5,001,168 - Fujii , et al. March 19, 1 | 1991-03-19 |
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