loadpatents
name:-0.0030250549316406
name:-0.0070919990539551
name:-0.0016059875488281
Nagase; Koichi Patent Filings

Nagase; Koichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nagase; Koichi.The latest application filed is for "polyamide composition and molded article".

Company Profile
1.5.2
  • Nagase; Koichi - Tokyo JP
  • Nagase; Koichi - Hyogo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polyamide composition and molded article
Grant 11,192,979 - Ieda , et al. December 7, 2
2021-12-07
Polyamide Composition And Molded Article
App 20200087458 - IEDA; Shinji ;   et al.
2020-03-19
Polyamide, polyamide composition, and molded article
Grant 9,228,057 - Ieda , et al. January 5, 2
2016-01-05
Polyamide, Polyamide Composition, And Molded Article
App 20150175744 - Ieda; Shinji ;   et al.
2015-06-25
Semiconductor device in which the number of word lines selected simultaneously in a refresh mode is externally selectable and method of manufacturing the same
Grant 5,373,475 - Nagase December 13, 1
1994-12-13
Semiconductor memory device and method for controlling its output
Grant 5,309,398 - Nagase , et al. May 3, 1
1994-05-03
Package of cement mixing material
Grant 5,224,595 - Sugimoto , et al. July 6, 1
1993-07-06

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