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Patent applications and USPTO patent grants for NAGAOKA; Yasuo.The latest application filed is for "method for polishing germanium wafer".
Patent | Date |
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Method For Polishing Germanium Wafer App 20170216992 - NAGAOKA; Yasuo ;   et al. | 2017-08-03 |
Semiconductor-wafer Cleaning Tank And Method Of Manufacturing Bonded Wafer App 20160336188 - NAGAOKA; Yasuo | 2016-11-17 |
Method for manufacturing bonded wafer Grant 8,173,521 - Kobayashi , et al. May 8, 2 | 2012-05-08 |
Method For Manufacturing Bonded Wafer App 20100120223 - Kobayashi; Norihiro ;   et al. | 2010-05-13 |
Manufacturing Method of SOI Wafer and SOI Wafer Manufactured by This Method App 20090117706 - Soeta; Yasutsugu ;   et al. | 2009-05-07 |
Method for producing direct bonded wafer and direct bonded wafer Grant 7,521,334 - Kobayashi , et al. April 21, 2 | 2009-04-21 |
Method for Producing Direct Bonded Wafer and Direct Bonded Wafer App 20080102603 - Kobayashi; Norihiro ;   et al. | 2008-05-01 |
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