NAGAOKA; Kensuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for NAGAOKA; Kensuke.The latest application filed is for "method of processing a substrate".
- NAGAOKA; Kensuke - Munich DE
- Nagaoka; Kensuke - Tokyo JP
| Patent | Date |
|---|---|
| Method Of Processing A Substrate App 20220044970 - NAGAOKA; Kensuke ; et al. | 2022-02-10 |
| Method of processing a substrate Grant 11,011,406 - Priewasser , et al. May 18, 2 | 2021-05-18 |
| Method Of Processing A Substrate App 20200066569 - PRIEWASSER; Karl Heinz ; et al. | 2020-02-27 |
| Wafer processing method including attaching a protective tape to a front side of a functional layer to prevent debris adhesion Grant 9,779,993 - Ogawa , et al. October 3, 2 | 2017-10-03 |
| Wafer processing method Grant 9,716,039 - Ogawa , et al. July 25, 2 | 2017-07-25 |
| Wafer processing method Grant 9,536,787 - Ogawa , et al. January 3, 2 | 2017-01-03 |
| Wafer Processing Method App 20160343614 - Ogawa; Yuki ; et al. | 2016-11-24 |
| Wafer Processing Method App 20160315011 - Ogawa; Yuki ; et al. | 2016-10-27 |
| Wafer Processing Method App 20160111331 - Ogawa; Yuki ; et al. | 2016-04-21 |
| Wafer processing method Grant 9,293,372 - Nagaoka , et al. March 22, 2 | 2016-03-22 |
| Wafer Processing Method App 20160027696 - Nagaoka; Kensuke ; et al. | 2016-01-28 |
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