Nagao; Kouichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nagao; Kouichi.The latest application filed is for "wiring board, semiconductor device and method for manufacturing the same".
- Nagao; Kouichi - Kyoto JP
- Nagao; Kouichi - Kadoma-shi Osaka
- Nagao; Kouichi - Osaka JP
- Nagao; Kouichi - Shimodate JP
- Nagao; Kouichi - Ibaraki JP
| Patent | Date |
|---|---|
| Wiring board, semiconductor device and method for manufacturing the same Grant 8,283,775 - Shimoishizaka , et al. October 9, 2 | 2012-10-09 |
| Wiring Board, Semiconductor Device And Method For Manufacturing The Same App 20110163436 - SHIMOISHIZAKA; Nozomi ; et al. | 2011-07-07 |
| Wiring board and semiconductor device using the same Grant 7,800,913 - Torii , et al. September 21, 2 | 2010-09-21 |
| Wiring board with a protective film greater in heights than bumps Grant 7,582,968 - Shimoishizaka , et al. September 1, 2 | 2009-09-01 |
| Semiconductor Device And Method For Manufacturing The Same App 20090154126 - SHIMOISHIZAKA; Nozomi ; et al. | 2009-06-18 |
| Wiring board Grant 7,514,802 - Tetani , et al. April 7, 2 | 2009-04-07 |
| Wiring board and method for producing the same Grant 7,442,074 - Shimoishizaka , et al. October 28, 2 | 2008-10-28 |
| Wiring board, semiconductor device and display module Grant 7,250,575 - Nagao , et al. July 31, 2 | 2007-07-31 |
| Wiring Board And Method For Manufacturing The Same, And Semiconductor Device App 20070120235 - Shimoishizaka; Nozomi ; et al. | 2007-05-31 |
| Wiring Board And Method For Producing The Same App 20070119614 - SHIMOISHIZAKA; Nozomi ; et al. | 2007-05-31 |
| Wiring Board And Semiconductor Device Using The Same App 20070109759 - TORII; Michiharu ; et al. | 2007-05-17 |
| Wiring Board App 20070075426 - TETANI; Michinari ; et al. | 2007-04-05 |
| Wiring board, semiconductor device and display module App 20060268530 - Nagao; Kouichi ; et al. | 2006-11-30 |
| Wiring board and semiconductor device App 20060267219 - Nakamura; Yoshifumi ; et al. | 2006-11-30 |
| Method for manufacturing an electronic component Grant 5,526,563 - Tamaki , et al. June 18, 1 | 1996-06-18 |
| Method of producing flexible printed-circuit board covered with coverlay Grant 5,234,522 - Suzuki , et al. August 10, 1 | 1993-08-10 |
| Heat resistant adhesive composition and bonding method using the same Grant 5,089,346 - Imaizumi , et al. February 18, 1 | 1992-02-18 |
| High speed freezing system for a refrigerator Grant 4,389,854 - Ogita , et al. June 28, 1 | 1983-06-28 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 