| Patent | Date |
|---|
Key Exchange System, Communication Apparatus, Key Exchange Method And Program
App 20220303124 - TOMIDA; Junichi ; et al. | 2022-09-22 |
Resin member and sheet using same, method for producing resin member, and heat storage material and heat control sheet using same
Grant 11,441,022 - Nagai , et al. September 13, 2 | 2022-09-13 |
Key Exchange System, Communication Apparatus, Key Exchange Method And Program
App 20220224520 - TOMIDA; Junichi ; et al. | 2022-07-14 |
Resin composition, heat storage material, and commodity
Grant 11,352,466 - Furukawa , et al. June 7, 2 | 2022-06-07 |
Authentication-permission System, Information Processing Apparatus, Equipment, Authentication-permission Method And Program
App 20210344515 - TAMURA; Sakurako ; et al. | 2021-11-04 |
Acrylic Resin, Producing Method Thereof, Resin Composition Set, Heat Storage Material, And Article
App 20210301059 - FURUKAWA; Naoki ; et al. | 2021-09-30 |
Resin Composition, Heat Storage Material, And Article
App 20210261706 - FURUKAWA; Naoki ; et al. | 2021-08-26 |
Resin Composition, Heat Storage Material, And Article
App 20210246349 - FURUKAWA; Naoki ; et al. | 2021-08-12 |
Shared Key System, Information Processing Apparatus, Equipment, Shared Key Method And Program
App 20210211275 - NAGAI; Akira ; et al. | 2021-07-08 |
Authentication control system, server apparatus, client apparatus, authentication control method, authentication method, and program
Grant 10,979,411 - Kobayashi , et al. April 13, 2 | 2021-04-13 |
Resin Member, Method For Producing Resin Member And Heat Storage Body
App 20210024803 - KIZAWA; Keiko ; et al. | 2021-01-28 |
Method of manufacturing laminated rotor core
Grant 10,848,039 - Nagai , et al. November 24, 2 | 2020-11-24 |
Method for manufacturing semiconductor device
Grant 10,734,350 - Honda , et al. | 2020-08-04 |
Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer
Grant 10,669,454 - Honda , et al. | 2020-06-02 |
Resin Composition, Heat Storage Material, And Commodity
App 20200165437 - FURUKAWA; Naoki ; et al. | 2020-05-28 |
Laminated rotor and method for balancing the same
Grant 10,622,873 - Nagai , et al. | 2020-04-14 |
Adhesive For Semiconductor, Semiconductor Device, And Method For Manufacturing Said Device
App 20200095481 - HONDA; Kazutaka ; et al. | 2020-03-26 |
Resin Member And Sheet Using Same, Method For Producing Resin Member, And Heat Storage Material And Heat Control Sheet Using Sam
App 20200048442 - NAGAI; Akira ; et al. | 2020-02-13 |
Resin Member And Sheet Using Same, And Heat Storage Material And Heat Control Sheet Using Same
App 20200048521 - NAGAI; Akira ; et al. | 2020-02-13 |
Fastening structure for flexible externally toothed gear of strain wave gearing and shaft member
Grant 10,508,726 - Hoshina , et al. Dec | 2019-12-17 |
Key exchange method, key exchange system, key device, terminal device, and program
Grant 10,419,213 - Nagai , et al. Sept | 2019-09-17 |
Method for manufacturing laminated core
Grant 10,418,886 - Nagai , et al. Sept | 2019-09-17 |
Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection
Grant 10,381,533 - Kotani , et al. A | 2019-08-13 |
Composite Member And Production Method Therefor, Heat Storage Material And Production Method Therefor, Heat-storage-type Air Con
App 20190241784 - MORIMOTO; Tsuyoshi ; et al. | 2019-08-08 |
Method of manufacturing laminated core
Grant 10,283,264 - Nagai , et al. | 2019-05-07 |
Method For Manufacturing Semiconductor Device
App 20190123014 - HONDA; Kazutaka ; et al. | 2019-04-25 |
Semiconductor adhesive, and semiconductor device and method for manufacturing same
Grant 10,224,311 - Honda , et al. | 2019-03-05 |
Authentication Control System, Server Apparatus, Client Apparatus, Authentication Control Method, Authentication Method, And Program
App 20180359234 - KOBAYASHI; Tetsutaro ; et al. | 2018-12-13 |
Adhesive For Semiconductor, Semiconductor Device, And Method For Manufacturing Said Device
App 20180312731 - HONDA; Kazutaka ; et al. | 2018-11-01 |
Method and apparatus for manufacturing laminated iron core
Grant 10,103,612 - Nagai , et al. October 16, 2 | 2018-10-16 |
Method Of Manufacturing Laminated Core
App 20180204676 - Nagai; Akira ; et al. | 2018-07-19 |
Method of manufacturing laminated core
Grant 9,947,464 - Nagai , et al. April 17, 2 | 2018-04-17 |
Method Of Manufacturing Laminated Rotor Core And Apparatus For Manufacturing Laminated Rotor Core
App 20180076700 - NAGAI; Akira ; et al. | 2018-03-15 |
Key Exchange Method, Key Exchange System, Key Device, Terminal Device, And Program
App 20170373841 - NAGAI; Akira ; et al. | 2017-12-28 |
Semiconductor Adhesive, And Semiconductor Device And Method For Manufacturing Same
App 20170345797 - HONDA; Kazutaka ; et al. | 2017-11-30 |
Fastening Structure For Flexible Externally Toothed Gear Of Strain Wave Gearing And Shaft Member
App 20170335941 - HOSHINA; Tatsuro ; et al. | 2017-11-23 |
Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
Grant 9,803,111 - Honda , et al. October 31, 2 | 2017-10-31 |
Method of manufacturing laminated rotor core
Grant 9,768,673 - Nagai , et al. September 19, 2 | 2017-09-19 |
Brake pad for yaw control, and brake member
Grant 9,568,061 - Kobune , et al. February 14, 2 | 2017-02-14 |
Optical Semiconductor Element Mounting Substrate And Optical Semiconductor Device Using Thermosetting Resin Composition For Light Reflection
App 20170040513 - Kotani; Hayato ; et al. | 2017-02-09 |
Method for manufacturing laminated core
Grant 9,564,790 - Nagai , et al. February 7, 2 | 2017-02-07 |
Method of resin sealing permanent magnet and laminated core manufactured thereof
Grant 9,548,644 - Nagai , et al. January 17, 2 | 2017-01-17 |
Method For Manufacturing Laminated Core
App 20160329783 - NAGAI; Akira ; et al. | 2016-11-10 |
Method of manufacturing laminated core having permanent magnets sealed with resin
Grant 9,431,883 - Matsubayashi , et al. August 30, 2 | 2016-08-30 |
Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device
Grant 9,431,314 - Enomoto , et al. August 30, 2 | 2016-08-30 |
Semiconductor device and production method therefor
Grant 9,425,120 - Honda , et al. August 23, 2 | 2016-08-23 |
Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
Grant 9,387,608 - Kotani , et al. July 12, 2 | 2016-07-12 |
Method Of Manufacturing Rotor
App 20160134179 - NAGAI; Akira ; et al. | 2016-05-12 |
Laminated iron core and method for manufacturing same
Grant 9,318,923 - Nagai , et al. April 19, 2 | 2016-04-19 |
Method And Apparatus For Manufacturing Laminated Iron Core
App 20160065040 - NAGAI; Akira ; et al. | 2016-03-03 |
Laminated Rotor Core And Method For Manufacturing The Same
App 20160013709 - Nagai; Akira ; et al. | 2016-01-14 |
Welding transformer and welding transformer assembly and welding apparatus
Grant 9,202,622 - Kai , et al. December 1, 2 | 2015-12-01 |
Semiconductor Device And Production Method Therefor
App 20150332983 - HONDA; Kazutaka ; et al. | 2015-11-19 |
Brake Pad For Yaw Control, And Brake Member
App 20150308532 - KOBUNE; Mika ; et al. | 2015-10-29 |
Adhesive For Semiconductor, Fluxing Agent, Manufacturing Method For Semiconductor Device, And Semiconductor Device
App 20150048495 - Honda; Kazutaka ; et al. | 2015-02-19 |
Adhesive For Semiconductor, Fluxing Agent, Manufacturing Method For Semiconductor Device, And Semiconductor Device
App 20150035175 - Honda; Kazutaka ; et al. | 2015-02-05 |
Semiconductor Device And Production Method Therefor
App 20150014842 - Honda; Kazutaka ; et al. | 2015-01-15 |
Rotor core
Grant 08922084 - | 2014-12-30 |
Rotor core
Grant 8,922,084 - Nagai , et al. December 30, 2 | 2014-12-30 |
Method for manufacturing laminated core and laminated core
Grant 8,916,254 - Nagai , et al. December 23, 2 | 2014-12-23 |
Welding Transformer And Welding Transformer Assembly And Welding Apparatus
App 20140360994 - Kai; Koji ; et al. | 2014-12-11 |
Method Of Manufacturing Laminated Rotor Core
App 20140196276 - Nagai; Akira ; et al. | 2014-07-17 |
Method For Manufacturing Laminated Core
App 20140124980 - Nagai; Akira ; et al. | 2014-05-08 |
Method Of Manufacturing Laminated Core Having Permanent Magnets Sealed With Resin
App 20140109391 - Matsubayashi; Satoshi ; et al. | 2014-04-24 |
Planar optical waveguide
Grant 8,615,146 - Nagano , et al. December 24, 2 | 2013-12-24 |
Method of manufacturing laminated rotor core
Grant 8,578,592 - Nagai , et al. November 12, 2 | 2013-11-12 |
Laminated Iron Core And Method For Manufacturing Same
App 20130249346 - Nagai; Akira ; et al. | 2013-09-26 |
Method Of Manufacturing Laminated Core
App 20130234363 - Nagai; Akira ; et al. | 2013-09-12 |
Method Of Resin Sealing Permanent Magnet And Laminated Core Manufactured By The Method
App 20130127282 - Nagai; Akira ; et al. | 2013-05-23 |
Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
Grant 8,420,210 - Amou , et al. April 16, 2 | 2013-04-16 |
Adhesive for bonding circuit members, circuit board and process for its production
Grant 8,273,457 - Watanabe , et al. September 25, 2 | 2012-09-25 |
Adhesive for bonding circuit members, circuit board and process for its production
Grant 8,273,458 - Watanabe , et al. September 25, 2 | 2012-09-25 |
Method Of Manufacturing Laminated Rotor Core
App 20120222289 - Nagai; Akira ; et al. | 2012-09-06 |
Adhesive for bonding circuit members, circuit board and process for its production
Grant 8,252,419 - Watanabe , et al. August 28, 2 | 2012-08-28 |
Thermosetting Resin Composition For Sealing Packing Of Semiconductor, And Semiconductor Device
App 20120101191 - ENOMOTO; Tetsuya ; et al. | 2012-04-26 |
Rotor Core
App 20120091846 - Nagai; Akira ; et al. | 2012-04-19 |
Method For Manufacturing Laminated Core And Laminated Core
App 20120058313 - Nagai; Akira ; et al. | 2012-03-08 |
Epoxy resin molding material for sealing and electronic component device
Grant 8,084,130 - Hamada , et al. December 27, 2 | 2011-12-27 |
Adhesive for connection of circuit member and semiconductor device using the same
Grant 8,044,524 - Nagai October 25, 2 | 2011-10-25 |
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production
App 20110247874 - WATANABE; Itsuo ; et al. | 2011-10-13 |
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production
App 20110247873 - WATANABE; Itsuo ; et al. | 2011-10-13 |
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production
App 20110247867 - WATANABE; Itsuo ; et al. | 2011-10-13 |
Production method of semiconductor device and bonding film
Grant 8,034,659 - Nagai , et al. October 11, 2 | 2011-10-11 |
Epoxy Resin Composition For Sealing Packing Of Semiconductor, Semiconductor Device, And Manufacturing Method Thereof
App 20110241228 - ENOMOTO; Tetsuya ; et al. | 2011-10-06 |
Adhesive For Connection Of Circuit Member And Semiconductor Device Using The Same
App 20110133346 - NAGAI; Akira | 2011-06-09 |
Adhesive For Connection Of Circuit Member And Semiconductor Device Using The Same
App 20110127667 - Nagai; Akira | 2011-06-02 |
Adhesive For Connection Of Circuit Member And Semiconductor Device Using The Same
App 20110121447 - Nagai; Akira | 2011-05-26 |
Planar Optical Waveguide
App 20110110629 - Nagano; Mitsuru ; et al. | 2011-05-12 |
Laminated core and method for manufacturing the same
Grant 7,928,627 - Nagai , et al. April 19, 2 | 2011-04-19 |
Adhesive for bonding circuit members, circuit board and process for its production
Grant 7,879,445 - Watanabe , et al. February 1, 2 | 2011-02-01 |
Laminated core and method for manufacturing the same
Grant 7,847,466 - Nagai , et al. December 7, 2 | 2010-12-07 |
Laminated Core And Method For Manufacturing The Same
App 20100270888 - Nagai; Akira ; et al. | 2010-10-28 |
Laminated Core And Method For Manufacturing The Same
App 20100213785 - Nagai; Akira ; et al. | 2010-08-26 |
Laminated core and method for manufacturing the same
Grant 7,777,387 - Nagai , et al. August 17, 2 | 2010-08-17 |
Thermosetting Resin Composition For Light Reflection, Method For Manufacturing The Resin Composition And Optical Semiconductor Element Mounting Substrate And Optical Semiconductor Device Using The Resin Composition
App 20100140638 - Kotani; Hayato ; et al. | 2010-06-10 |
Semiconductor device and multilayer substrate therefor
Grant 7,692,296 - Tanaka , et al. April 6, 2 | 2010-04-06 |
Fiber-reinforced composite material, method for manufacturing the same, and applications thereof
Grant 7,691,473 - Yano , et al. April 6, 2 | 2010-04-06 |
Adhesive For Connection Of Circuit Member And Semiconductor Device Using The Same
App 20100013078 - Nagai; Akira | 2010-01-21 |
Laminated Core And Method For Manufacturing The Same
App 20100001612 - Nagai; Akira ; et al. | 2010-01-07 |
Production Method Of Semiconductor Device And Bonding Film
App 20100003771 - Nagai; Akira ; et al. | 2010-01-07 |
Epoxy Resin Molding Material For Sealing And Electronic Component Device
App 20090326100 - Hamada; Mitsuyoshi ; et al. | 2009-12-31 |
Adhesive For Bonding Circuit Members, Circuit Board And Process For Its Production
App 20090314533 - Watanabe; Itsuo ; et al. | 2009-12-24 |
Epoxy Resin Molding Material for Sealing, and Electronic Component Device
App 20090247670 - Hamada; Mitsuyoshi ; et al. | 2009-10-01 |
Fiber-reinforced Composite Material, Method For Manufacturing The Same, And Applications Thereof
App 20090123726 - YANO; Hiroyuki ; et al. | 2009-05-14 |
Epoxy Resin Molding Material for Sealing and Electronic Component Device
App 20090012233 - Hamada; Mitsuyoshi ; et al. | 2009-01-08 |
Fiber-reinforced composite material, method for manufacturing the same and applications thereof
Grant 7,455,901 - Yano , et al. November 25, 2 | 2008-11-25 |
Resin Composition, Prepreg, Laminate Sheet And Printed Wiring Board Using The Same And Method For Production Thereof
App 20070292668 - Amou; Satoru ; et al. | 2007-12-20 |
Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
Grant 7,273,900 - Amou , et al. September 25, 2 | 2007-09-25 |
Adhesive for bonding circuit members, circuit board, and method of producing the same
Grant 7,247,381 - Watanabe , et al. July 24, 2 | 2007-07-24 |
Adhesive for bonding circuit members, circuit board and process for its production
App 20070137887 - Watanabe; Itsuo ; et al. | 2007-06-21 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
Grant 7,217,992 - Ogino , et al. May 15, 2 | 2007-05-15 |
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
Grant 7,202,570 - Nagai , et al. April 10, 2 | 2007-04-10 |
Electronic device using low dielectric loss tangent insulators for high frequency signals
Grant 7,193,009 - Amou , et al. March 20, 2 | 2007-03-20 |
Low dielectric loss tangent films and wiring films
Grant 7,112,627 - Amou , et al. September 26, 2 | 2006-09-26 |
Fiber-reinforced composite material, method for manufacturing the same and applications thereof
App 20060182941 - Yano; Hiroyuki ; et al. | 2006-08-17 |
Semiconductor device and manufacturing method thereof
Grant 7,091,620 - Miyazaki , et al. August 15, 2 | 2006-08-15 |
Wiring tape for semiconductor device including a buffer layer having interconnected foams
Grant 7,038,325 - Ogino , et al. May 2, 2 | 2006-05-02 |
Remote control system for a vehicle
Grant 6,998,958 - Asakura , et al. February 14, 2 | 2006-02-14 |
Conductive paste
Grant 6,994,806 - Nagai , et al. February 7, 2 | 2006-02-07 |
Integrated circuit device having reduced substrate size and a method for manufacturing the same
Grant 6,989,600 - Kubo , et al. January 24, 2 | 2006-01-24 |
Semiconductor device and multilayer substrate therefor
App 20050230826 - Tanaka, Naotaka ; et al. | 2005-10-20 |
Semiconductor device and manufacturing metthod thereof
App 20050212142 - Miyazaki, Chuichi ; et al. | 2005-09-29 |
Semiconductor device and manufacturing method thereof
App 20050200019 - Miyazaki, Chuichi ; et al. | 2005-09-15 |
Semiconductor module and mounting method for same
Grant 6,940,162 - Eguchi , et al. September 6, 2 | 2005-09-06 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
Grant 6,888,230 - Ogino , et al. May 3, 2 | 2005-05-03 |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
Grant 6,878,448 - Ishii , et al. April 12, 2 | 2005-04-12 |
Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
App 20050064159 - Amou, Satoru ; et al. | 2005-03-24 |
Semiconductor device and semiconductor package
Grant 6,855,952 - Nagai , et al. February 15, 2 | 2005-02-15 |
Organic/inorganic oxide mixed film, passive device contained electronic substrate using the film, and method of manufacturing organic/inorganic oxide mixed film
App 20050029515 - Nagai, Akira ; et al. | 2005-02-10 |
Resin composition containing rubber component, and film and electronic part using the same
App 20050020781 - Sugimasa, Masatoshi ; et al. | 2005-01-27 |
Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards
Grant 6,841,628 - Oota , et al. January 11, 2 | 2005-01-11 |
Semiconductor module and mounting method for same
App 20040251540 - Eguchi, Shuji ; et al. | 2004-12-16 |
Remote control system for a vehicle
App 20040227656 - Asakura, Suguru ; et al. | 2004-11-18 |
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
App 20040224149 - Nagai, Akira ; et al. | 2004-11-11 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
App 20040217453 - Ogino, Masahiko ; et al. | 2004-11-04 |
Wiring tape for semiconductor device including a buffer layer having interconnected foams
App 20040195702 - Ogino, Masahiko ; et al. | 2004-10-07 |
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
Grant 6,791,194 - Nagai , et al. September 14, 2 | 2004-09-14 |
Semiconductor module and mounting method for same
Grant 6,784,541 - Eguchi , et al. August 31, 2 | 2004-08-31 |
Remote control system for a vehicle
Grant 6,778,065 - Asakura , et al. August 17, 2 | 2004-08-17 |
Conductive paste
App 20040124401 - Nagai, Akira ; et al. | 2004-07-01 |
Semiconductor device and manufacturing method thereof
App 20040061220 - Miyazaki, Chuichi ; et al. | 2004-04-01 |
Semiconductor device comprising stress relaxation layers and method for manufacturing the same
Grant 6,710,446 - Nagai , et al. March 23, 2 | 2004-03-23 |
Low dielectric loss tangent films and wiring films
App 20040038611 - Amou, Satoru ; et al. | 2004-02-26 |
Semiconductor device and semiconductor package
App 20040038021 - Nagai, Akira ; et al. | 2004-02-26 |
Electronic device using low dielectric loss tangent insulators for high frequency signals
App 20040039127 - Amou, Satoru ; et al. | 2004-02-26 |
Conductive paste
Grant 6,689,296 - Nagai , et al. February 10, 2 | 2004-02-10 |
Remote control system for a vehicle door
Grant 6,670,883 - Asakura , et al. December 30, 2 | 2003-12-30 |
Semiconductor device and its manufacturing method
App 20030207557 - Akiyama, Yukiharu ; et al. | 2003-11-06 |
Thermal stable low elastic modulus material and device using the same
Grant 6,638,352 - Satsu , et al. October 28, 2 | 2003-10-28 |
Semiconductor device and its manufacturing method
Grant 6,639,323 - Akiyama , et al. October 28, 2 | 2003-10-28 |
Thermal stable low elastic modulus material and device using the same
Grant 6,638,631 - Satsu , et al. October 28, 2 | 2003-10-28 |
Semiconductor module and method of mounting
Grant 6,627,997 - Eguchi , et al. September 30, 2 | 2003-09-30 |
Semiconductor apparatus having stress cushioning layer
Grant 6,621,154 - Satoh , et al. September 16, 2 | 2003-09-16 |
Integrated circuit and method of manufacturing thereof
App 20030148558 - Kubo, Masaharu ; et al. | 2003-08-07 |
Conductive paste
App 20030102465 - Nagai, Akira ; et al. | 2003-06-05 |
Semiconductor module and mounting method for same
App 20030071348 - Eguchi, Shuji ; et al. | 2003-04-17 |
Thermal stable low elastic modulus material and device using the same
App 20030047351 - Satsu, Yuichi ; et al. | 2003-03-13 |
Thermal stable low elastic modulus material and device using the same
App 20030049193 - Satsu, Yuichi ; et al. | 2003-03-13 |
Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards
App 20030027942 - Oota, Satoru ; et al. | 2003-02-06 |
Semiconductor device with elastic structure and wiring
Grant 6,515,371 - Akiyama , et al. February 4, 2 | 2003-02-04 |
Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound
Grant 6,489,013 - Nagai , et al. December 3, 2 | 2002-12-03 |
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
App 20020160185 - Nagai, Akira ; et al. | 2002-10-31 |
Semiconductor device and wiring tape for semiconductor device
App 20020158343 - Ogino, Masahiko ; et al. | 2002-10-31 |
Sliding article with electrode film, window glass with electrode film, and conductive paste
App 20020146569 - Nagai, Akira ; et al. | 2002-10-10 |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
App 20020146565 - Ishll, Toshiaki ; et al. | 2002-10-10 |
Semiconductor device and method of manufacture thereof
App 20020130412 - Nagai, Akira ; et al. | 2002-09-19 |
Method of making a semiconductor device having a stress relieving mechanism
Grant 6,423,571 - Ogino , et al. July 23, 2 | 2002-07-23 |
Semiconductor device and method for manufacturing the same technical field
Grant 6,396,145 - Nagai , et al. May 28, 2 | 2002-05-28 |
Pulse generating capacitor
App 20020060897 - Kobayashi, Shinichi ; et al. | 2002-05-23 |
Semiconductor device and its manufacturing method
App 20020050636 - Akiyama, Yukiharu ; et al. | 2002-05-02 |
Semiconductor device and its manufacturing method
App 20020047215 - Akiyama, Yukiharu ; et al. | 2002-04-25 |
Method of making a semiconductor device having a stress relieving mechanism
App 20010051393 - Ogino, Masahiko ; et al. | 2001-12-13 |
Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound
App 20010018986 - Nagai, Akira ; et al. | 2001-09-06 |
Capacitor
App 20010006450 - Kobayashi, Shinichi ; et al. | 2001-07-05 |
Method of production of semiconductor device
Grant 6,223,429 - Kaneda , et al. May 1, 2 | 2001-05-01 |
Electronic component parts device
Grant 6,184,577 - Takemura , et al. February 6, 2 | 2001-02-06 |
Laminate and multilayer printed circuit board
Grant 6,114,005 - Nagai , et al. September 5, 2 | 2000-09-05 |
Resin sealed semiconductor devices and a process for manufacturing the same
Grant 6,097,100 - Eguchi , et al. August 1, 2 | 2000-08-01 |
Semiconductor device
Grant 6,049,128 - Kitano , et al. April 11, 2 | 2000-04-11 |
Semiconductor device having a stress relieving mechanism
Grant 6,028,364 - Ogino , et al. February 22, 2 | 2000-02-22 |
Method for producing thin film multilayer wiring board
Grant 5,707,749 - Katagiri , et al. January 13, 1 | 1998-01-13 |
Anti-theft apparatus which permits the engine to start prior to ID signal discrimination
Grant 5,703,414 - Mutoh , et al. December 30, 1 | 1997-12-30 |
Vehicle anti-theft system
Grant 5,686,883 - Mutoh , et al. November 11, 1 | 1997-11-11 |
Laminate and multilayer printed circuit board
Grant 5,677,045 - Nagai , et al. October 14, 1 | 1997-10-14 |
Vehicle anti-theft device
Grant 5,621,380 - Mutoh , et al. April 15, 1 | 1997-04-15 |
Circuit board and process for producing the same
Grant 5,021,296 - Suzuki , et al. June 4, 1 | 1991-06-04 |
Thermosetting resin composition and laminate and process for the production thereof
Grant 4,784,917 - Tawara , et al. November 15, 1 | 1988-11-15 |
Thermo-setting, polymerizable composition and wiring board
Grant 4,738,900 - Ono , et al. April 19, 1 | 1988-04-19 |
Optical submarine cable connection
Grant 4,708,427 - Ejiri , et al. November 24, 1 | 1987-11-24 |
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