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Patent applications and USPTO patent grants for Nagahashi; Isao.The latest application filed is for "wafer polishing method and apparatus".
Patent | Date |
---|---|
Wafer polishing method and apparatus Grant RE37,622 - Karlsrud , et al. April 2, 2 | 2002-04-02 |
Polishing method and polishing apparatus Grant 6,089,959 - Nagahashi July 18, 2 | 2000-07-18 |
Polishing apparatus with improved product unloading Grant 5,762,543 - Kasprzyk , et al. June 9, 1 | 1998-06-09 |
Wafer polishing method and apparatus Grant 5,498,196 - Karlsrud , et al. March 12, 1 | 1996-03-12 |
Wafer polishing method and apparatus Grant 5,498,199 - Karlsrud , et al. * March 12, 1 | 1996-03-12 |
Wafer polishing method and apparatus Grant 5,329,732 - Karlsrud , et al. July 19, 1 | 1994-07-19 |
Specular machining apparatus for peripheral edge portion of wafer Grant 5,097,630 - Maeda , et al. March 24, 1 | 1992-03-24 |
Edge polisher Grant 5,094,037 - Hakomori , et al. March 10, 1 | 1992-03-10 |
Flat lapping machine Grant 4,805,348 - Arai , et al. February 21, 1 | 1989-02-21 |
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