NAGAHARA; Aiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for NAGAHARA; Aiko.The latest application filed is for "bonding material and bonding method using the same".
- NAGAHARA; Aiko - Okayama JP
| Patent | Date |
|---|---|
| Bonding Material And Bonding Method Using The Same App 20160172328 - ENDOH; Keiichi ; et al. | 2016-06-16 |
| Bonding Material And Bonding Method Using The Same App 20160099087 - ENDOH; Keiichi ; et al. | 2016-04-07 |
| Bonding material and bonding method using the same Grant 9,240,256 - Endoh , et al. January 19, 2 | 2016-01-19 |
| Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method Grant 8,858,700 - Endoh , et al. October 14, 2 | 2014-10-14 |
| Low-temperature-sinterable bonding material, and bonding method using the bonding material Grant 8,641,929 - Endoh , et al. February 4, 2 | 2014-02-04 |
| Low-temperature-sinterable Bonding Material, And Bonding Method Using The Bonding Material App 20130081759 - Endoh; Keiichi ; et al. | 2013-04-04 |
| Bonding Material And Bonding Method Using The Same App 20120298009 - Endoh; Keiichi ; et al. | 2012-11-29 |
| Bonding Material Using Metal Nanoparticles And Bonding Method App 20120103515 - Endoh; Keiichi ; et al. | 2012-05-03 |
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