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Integrated circuit having improved electromigration performance and method of forming same Grant 9,679,810 - Nag , et al. June 13, 2 | 2017-06-13 |
Laser anneal of buried metallic interconnects including through silicon vias Grant 9,620,396 - Gluschenkov , et al. April 11, 2 | 2017-04-11 |
Low-Loss Large-Grain Optical Waveguide For Interconnecting Components Integrated On A Glass Substrate App 20170097467 - Gates; Stephen M. ;   et al. | 2017-04-06 |
Integrated circuit barrierless microfluidic channel Grant 9,502,325 - Clevenger , et al. November 22, 2 | 2016-11-22 |
Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate Grant 9,472,710 - Gates , et al. October 18, 2 | 2016-10-18 |
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Self-aligned Via Interconnect Structures App 20160163587 - BACKES; Benjamin C. ;   et al. | 2016-06-09 |
Methods to form conductive thin film structures Grant 9,362,230 - Clevenger , et al. June 7, 2 | 2016-06-07 |
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