loadpatents
name:-0.028098821640015
name:-0.030785083770752
name:-0.0013840198516846
NADAHARA; Soichi Patent Filings

NADAHARA; Soichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for NADAHARA; Soichi.The latest application filed is for "perfusion device for liver graft, and liver removal method and liver transplantation method using the device".

Company Profile
1.25.21
  • NADAHARA; Soichi - Kyoto JP
  • Nadahara; Soichi - Yokohama-shi JP
  • Nadahara; Soichi - Yokohama JP
  • Nadahara; Soichi - Kanagawa JP
  • Nadahara; Soichi - Kanagawa-ken JP
  • Nadahara; Soichi - Tokyo JP
  • Nadahara; Soichi - Inagi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Perfusion Device For Liver Graft, And Liver Removal Method And Liver Transplantation Method Using The Device
App 20190141988 - KOBAYASHI; Eiji ;   et al.
2019-05-16
Substrate treating apparatus and substrate treating method
Grant 10,153,181 - Sasaki , et al. Dec
2018-12-11
Substrate Treating Apparatus And Substrate Treating Method
App 20170345683 - SASAKI; Yuta ;   et al.
2017-11-30
Substrate treatment apparatus and substrate treatment method
Grant 7,913,346 - Iwami , et al. March 29, 2
2011-03-29
Etching Apparatus, A Method Of Controlling An Etching Solution, And A Method Of Manufacturing A Semiconductor Device
App 20100210110 - Okuchi; Hisashi ;   et al.
2010-08-19
Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device
Grant 7,776,756 - Okuchi , et al. August 17, 2
2010-08-17
Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
Grant 7,700,381 - Arikado , et al. April 20, 2
2010-04-20
Substrate Processing Apparatus
App 20080083501 - ARAI; Kenichiro ;   et al.
2008-04-10
Material supply system in semiconductor device manufacturing plant
Grant 7,305,275 - Miyazaki , et al. December 4, 2
2007-12-04
Semiconductor wafer and a method for manufacturing a semiconductor wafer
Grant 7,268,053 - Iwase , et al. September 11, 2
2007-09-11
Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device
Grant 7,267,742 - Okuchi , et al. September 11, 2
2007-09-11
Semiconductor wafer and a method for manufacturing a semiconductor wafer
Grant 7,253,500 - Iwase , et al. August 7, 2
2007-08-07
Substrate treatment apparatus and substrate treatment method
App 20060219260 - Iwami; Masaki ;   et al.
2006-10-05
Polishing method and apparatus
Grant 7,101,259 - Kimura , et al. September 5, 2
2006-09-05
Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
App 20060131696 - Arikado; Tsunetoshi ;   et al.
2006-06-22
Semiconductor wafer and a method for manufacturing a semiconductor wafer
App 20060118916 - Iwase; Masao ;   et al.
2006-06-08
Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
Grant 7,057,259 - Arikado , et al. June 6, 2
2006-06-06
Holding unit, processing apparatus and holding method of substrates
Grant 7,055,535 - Kunisawa , et al. June 6, 2
2006-06-06
Semiconductor wafer and a method for manufacturing a semiconductor wafer
Grant 7,015,566 - Iwase , et al. March 21, 2
2006-03-21
Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device
App 20050230045 - Okuchi, Hisashi ;   et al.
2005-10-20
Material supply system in semiconductor device manufacturing plant
App 20050177273 - Miyazaki, Kunihiro ;   et al.
2005-08-11
Semiconductor wafer and a method for manufacturing a semiconductor wafer
App 20050167857 - Iwase, Masao ;   et al.
2005-08-04
Substrate treating apparatus
App 20040221880 - Tomita, Hiroshi ;   et al.
2004-11-11
Semiconductor wafer and a methd for manufacturing a semiconductor wafer
App 20040129940 - Iwase, Masao ;   et al.
2004-07-08
Polishing method and apparatus
App 20040087258 - Kimura, Norio ;   et al.
2004-05-06
Holding unit, processing apparatus and holding method of substrates
App 20040016452 - Kunisawa, Junji ;   et al.
2004-01-29
Cleaning method and cleaner
Grant 6,679,950 - Tomita , et al. January 20, 2
2004-01-20
Apparatus and method for cleaning a semiconductor substrate
Grant 6,673,163 - Tomita , et al. January 6, 2
2004-01-06
Polishing method and apparatus
Grant 6,667,238 - Kimura , et al. December 23, 2
2003-12-23
Etching for manufacture of semiconductor devices
Grant 6,645,876 - Saito , et al. November 11, 2
2003-11-11
Semiconductor device in trench
Grant 6,639,317 - Tomita , et al. October 28, 2
2003-10-28
Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
App 20030003608 - Arikado, Tsunetoshi ;   et al.
2003-01-02
Apparatus and method for cleaning a semiconductor substrate
App 20020170572 - Tomita, Hiroshi ;   et al.
2002-11-21
Etching method and etching apparatus, method for manufacturing semiconductor device, and semiconductor device
App 20020164887 - Tomita, Hiroshi ;   et al.
2002-11-07
Apparatus and method for cleaning a semiconductor substrate
Grant 6,431,185 - Tomita , et al. August 13, 2
2002-08-13
Etching for manufacture of semiconductor devices
App 20020086552 - Saito, Mami ;   et al.
2002-07-04
Cleaning method and cleaner
App 20020005214 - Tomita, Hiroshi ;   et al.
2002-01-17
Semiconductor device having multilevel interconnection
App 20020003304 - Matsunaga, Noriaki ;   et al.
2002-01-10
Method of manufacturing a semiconductor device including a seamless shallow trench isolation step
Grant 6,333,274 - Akatsu , et al. December 25, 2
2001-12-25
Method Of Manufacturing A Semiconductor Device Including A Seamless Shallow Trench Isolation Step
App 20010023134 - AKATSU, HIROYUKI ;   et al.
2001-09-20
Wafer drying apparatus and method with residual particle removability enhancement
Grant 6,286,524 - Okuchi , et al. September 11, 2
2001-09-11
Process for cleaning the interior of semiconductor substrate
Grant 6,059,887 - Muraoka , et al. May 9, 2
2000-05-09
Wafer cleaning system with progressive megasonic wave
Grant 6,021,789 - Akatsu , et al. February 8, 2
2000-02-08
Semiconductor device and method of manufacturing the same
Grant 5,989,988 - Iinuma , et al. November 23, 1
1999-11-23
Method of manufacturing a semiconductor device
Grant 5,360,748 - Nadahara , et al. November 1, 1
1994-11-01
Method of manufacturing a semiconductor device by mega-electron volt ion implantation
Grant 5,098,852 - Niki , et al. March 24, 1
1992-03-24

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed