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Dielectric-to-metal Adhesion Promotion Material
App 20220293509 - Manepalli; Rahul ; et al. | 2022-09-15 |
Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architectures
Grant 11,445,616 - Nad , et al. September 13, 2 | 2022-09-13 |
In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages
Grant 11,404,389 - Ecton , et al. August 2, 2 | 2022-08-02 |
Selectively Roughened Copper Architectures For Low Insertion Loss Conductive Features
App 20220102259 - Kong; Jieying ; et al. | 2022-03-31 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20220102261 - ELSHERBINI; Adel A. ; et al. | 2022-03-31 |
Apparatus with a substrate provided with plasma treatment
Grant 11,291,122 - Grujicic , et al. March 29, 2 | 2022-03-29 |
Conductive Route Patterning For Electronic Substrates
App 20220093520 - Ecton; Jeremy D. ; et al. | 2022-03-24 |
Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer
Grant 11,257,748 - Manepalli , et al. February 22, 2 | 2022-02-22 |
High performance integrated RF passives using dual lithography process
Grant 11,227,825 - Elsherbini , et al. January 18, 2 | 2022-01-18 |
Package architecture with improved via drill process and method for forming such package
Grant 11,177,234 - Nad , et al. November 16, 2 | 2021-11-16 |
Circuit device with monolayer bonding between surface structures
Grant 11,177,232 - Nad , et al. November 16, 2 | 2021-11-16 |
Structural Elements For Application Specific Electronic Device Packages
App 20210296225 - Nad; Suddhasattwa ; et al. | 2021-09-23 |
Method, Device And System For Providing Etched Metallization Structures
App 20210289638 - Ecton; Jeremy ; et al. | 2021-09-16 |
Conductive Route Patterning For Electronic Substrates
App 20210280463 - Ecton; Jeremy ; et al. | 2021-09-09 |
Method, device and system for providing etched metallization structures
Grant 11,116,084 - Ecton , et al. September 7, 2 | 2021-09-07 |
Package power delivery using plane and shaped vias
Grant 10,971,416 - Bharath , et al. April 6, 2 | 2021-04-06 |
Multiple Layer Copper Seeding
App 20210090946 - GRUJICIC; Darko ; et al. | 2021-03-25 |
Embedded Thin Film Capacitor With Nanocube Film And Process For Forming Such
App 20200402720 - MARIN; Brandon C. ; et al. | 2020-12-24 |
Method For Fabricating Multiplexed Hollow Waveguides Of Variable Type On A Semiconductor Package
App 20200395317 - MARIN; Brandon C. ; et al. | 2020-12-17 |
Hybrid Fine Line Spacing Architecture For Bump Pitch Scaling
App 20200312665 - NAD; Suddhasattwa ; et al. | 2020-10-01 |
Copper Interface Features For High Speed Interconnect Applications
App 20200315023 - NAD; Suddhasattwa ; et al. | 2020-10-01 |
Controlled Organic Layers To Enhance Adhesion To Organic Dielectrics And Process For Forming Such
App 20200312768 - NAD; Suddhasattwa ; et al. | 2020-10-01 |
Novel Customizable Release Layers To Enable Low Warpage Architectures For Advanced Packaging Applications
App 20200312698 - NAD; Suddhasattwa ; et al. | 2020-10-01 |
Semiconductor Package And Method Of Making
App 20200273787 - Manepalli; Rahul N. ; et al. | 2020-08-27 |
Subtractive Etch Resolution Implementing A Functional Thin Metal Resist
App 20200258800 - A1 | 2020-08-13 |
Package Architecture With Tunable Magnetic Properties For Embedded Devices
App 20200258975 - A1 | 2020-08-13 |
Selective Metal Deposition By Patterning Direct Electroless Metal Plating
App 20200251332 - Kind Code | 2020-08-06 |
Apparatus With A Substrate Provided With Plasma Treatment
App 20200245472 - Kind Code | 2020-07-30 |
Method, Device And System For Providing Etched Metallization Structures
App 20200236795 - Ecton; Jeremy ; et al. | 2020-07-23 |
Microelectronic Assemblies Having Conductive Structures With Different Thicknesses
App 20200205279 - Ecton; Jeremy ; et al. | 2020-06-25 |
In-situ Component Fabrication Of A Highly Efficient, High Inductance Air Core Inductor Integrated Into Substrate Packages
App 20200105685 - ECTON; Jeremy ; et al. | 2020-04-02 |
Microelectronic Device Interconnect Structure
App 20200006273 - Dubey; Manish ; et al. | 2020-01-02 |
Package Architecture With Improved Via Drill Process And Method For Forming Such Package
App 20190393183 - NAD; Suddhasattwa ; et al. | 2019-12-26 |
Package Power Delivery Using Plane And Shaped Vias
App 20190355636 - Bharath; Krishna ; et al. | 2019-11-21 |
Interfacial Layer For High Resolution Lithography (hrl) And High Speed Input/output (io Or I/o) Architectures
App 20190320537 - NAD; Suddhasattwa ; et al. | 2019-10-17 |
Package power delivery using plane and shaped vias
Grant 10,410,939 - Bharath , et al. Sept | 2019-09-10 |
Circuit Device With Monolayer Bonding Between Surface Structures
App 20190229082 - Nad; Suddhasattwa ; et al. | 2019-07-25 |
Improved Package Power Delivery Using Plane And Shaped Vias
App 20180331003 - BHARATH; Krishna ; et al. | 2018-11-15 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20180315690 - ELSHERBINI; Adel A. ; et al. | 2018-11-01 |
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