NACHREINER; Jens

Patent Applications and Registrations

Patent applications and USPTO patent grants for NACHREINER; Jens.The latest application filed is for "metal sintering preparation and the use thereof for the connecting of components".

Company Profile

3.4.11

NACHREINER; Jens - Schluchtern DE
Nachreiner; Jens - Gelnhausen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal Sintering Preparation And The Use Thereof For The Connecting Of Components App 20210276085 - SCHMITT; Wolfgang ; et al.	2021-09-09
Electrical feedthrough with a sintered electrical connection Grant 11,110,285 - Hausch , et al. September 7, 2	2021-09-07
Metal paste and use thereof for joining components Grant 11,045,910 - Schmitt , et al. June 29, 2	2021-06-29
Method For Connecting Components By Means Of A Metal Paste App 20200156155 - Schmitt; Wolfgang ; et al.	2020-05-21
Method For Connecting Components By Means Of A Metal Paste App 20200147696 - Schmitt; Wolfgang ; et al.	2020-05-14
Solder paste with oxalic acid and amine component Grant 10,434,610 - Nachreiner , et al. O	2019-10-08
Electrical Feedthrough With A Sintered Electrical Connection App 20180050211 - Hausch; Ulrich ; et al.	2018-02-22
Metal Sintering Preparation And The Use Thereof For The Connecting Of Components App 20170326640 - SCHMITT; Wolfgang ; et al.	2017-11-16
Metal Paste And Use Thereof For The Connecting Of Components App 20170221855 - NACHREINER; Jens	2017-08-03
Solder Paste With Oxalic Acid And Amine Component App 20160311067 - NACHREINER; Jens ; et al.	2016-10-27
Method For Mounting A Component On A Substrate App 20160316572 - NACHREINER; Jens ; et al.	2016-10-27
Paste And Method For Connecting Electronic Component To Substrate App 20130068373 - SCHAFER; Michael ; et al.	2013-03-21
No-clean low-residue solder paste for semiconductor device applications Grant 7,767,032 - Sheng , et al. August 3, 2	2010-08-03
No-clean low-residue solder paste for semiconductor device applications App 20080000549 - Sheng; Quan ; et al.	2008-01-03

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.