NABORS; Marni
Patent Applications and Registrations
Patent applications and USPTO patent grants for NABORS; Marni.The latest application filed is for "deep trench via for three-dimensional integrated circuit".
- NABORS; Marni - Portland OR
| Patent | Date |
|---|---|
| Deep Trench Via For Three-dimensional Integrated Circuit App 20220285342 - WANG; Yih ; et al. | 2022-09-08 |
| Integrated Circuit Structure With Front Side Signal Lines And Backside Power Delivery App 20220262791 - SHI; Quan ; et al. | 2022-08-18 |
| Device layer interconnects Grant 11,410,928 - Bohr , et al. August 9, 2 | 2022-08-09 |
| Deep trench via for three-dimensional integrated circuit Grant 11,373,999 - Wang , et al. June 28, 2 | 2022-06-28 |
| Power shared cell architecture Grant 11,068,640 - Kumar , et al. July 20, 2 | 2021-07-20 |
| Power Shared Cell Architecture App 20200279069 - KUMAR; Ranjith ; et al. | 2020-09-03 |
| Standard Cell Architecture With Power Tracks Completely Inside A Cell App 20200251464 - Kind Code | 2020-08-06 |
| Device Layer Interconnects App 20190378790 - Bohr; Mark ; et al. | 2019-12-12 |
| Deep Trench Via For Three-dimensional Integrated Circuit App 20190378836 - WANG; Yih ; et al. | 2019-12-12 |
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