Na; Seok Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for Na; Seok Ho.The latest application filed is for "hybrid bonding interconnection using laser and thermal compression".

Company Profile

2.4.6

Na; Seok Ho - Incheon KR
NA; Seok Ho - Nowon-gu KR
Na; Seok Ho - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hybrid Bonding Interconnection Using Laser And Thermal Compression App 20210398940 - Kim; Min Ho ; et al.	2021-12-23
Laser Bonded Devices, Laser Bonding Tools, And Related Methods App 20210398936 - Park; Dong Hyeon ; et al.	2021-12-23
Semiconductor Device Having Conductive Wire With Increased Attachment Angle And Method App 20210143105 - JEON; Jun Ho ; et al.	2021-05-13
Semiconductor device having conductive wire with increased attachment angle and method Grant 10,943,871 - Jeon , et al. March 9, 2	2021-03-09
Semiconductor Device Having Conductive Wire With Increased Attachment Angle And Method App 20190051616 - JEON; Jun Ho ; et al.	2019-02-14
Semiconductor device having conductive wire with increased attachment angle and method Grant 10,141,269 - Jeon , et al. Nov	2018-11-27
Semiconductor Device Having Conductive Wire With Increased Attachment Angle And Method App 20170263568 - JEON; Jun Ho ; et al.	2017-09-14
Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing Grant 7,847,398 - Na , et al. December 7, 2	2010-12-07
Semiconductor Device And Method Of Manufacturing App 20090032947 - Na; Seok Ho ; et al.	2009-02-05
Method for manufacturing an alumina-silicon carbide nanocomposite Grant 5,894,008 - Na April 13, 1	1999-04-13

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