Na; Min-Ok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Na; Min-Ok.The latest application filed is for "thermal interface material layer and package-on-package device including the same".

Company Profile

6.18.21

Na; Min-Ok - Bucheon-si KR
NA; Min-Ok - Gyeonggi-do KR
NA; Min-Ok - Chungcheongnam-do KR
NA; Min-ok - Cheonan-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermal interface material layer and package-on-package device including the same Grant 10,950,521 - Na , et al. March 16, 2	2021-03-16
Stacked semiconductor packages Grant 10,593,652 - Kwon , et al.	2020-03-17
Thermal Interface Material Layer And Package-on-package Device Including The Same App 20200006188 - Na; Min-Ok ; et al.	2020-01-02
Stacked Semiconductor Packages, Methods Of Fabricating The Same, And/or Systems Employing The Same App 20190319012 - KWON; Heung-Kyu ; et al.	2019-10-17
Thermal interface material layer and package-on-package device including the same Grant 10,431,522 - Na , et al. O	2019-10-01
Method of fabricating a semiconductor package Grant 10,403,606 - Kwon , et al. Sep	2019-09-03
Stacked Semiconductor Packages, Methods Of Fabricating The Same, And/or Systems Employing The Same App 20180331071 - KWON; Heung-Kyu ; et al.	2018-11-15
Thermal Interface Material Layer And Package-on-package Device Including The Same App 20180145006 - NA; Min-Ok ; et al.	2018-05-24
Apparatus for stacked semiconductor packages and methods of fabricating the same Grant 9,978,721 - Kwon , et al. May 22, 2	2018-05-22
Thermal interface material layer and package-on-package device including the same Grant 9,899,294 - Na , et al. February 20, 2	2018-02-20
Stacked Semiconductor Packages, Methods For Fabricating The Same, And/or Systems Employing The Same App 20160358893 - KWON; Heung-Kyu ; et al.	2016-12-08
Thermal Interface Material Layer And Package-on-package Device Including The Same App 20160190035 - NA; Min-Ok ; et al.	2016-06-30
Image sensor packages Grant 9,214,484 - Park , et al. December 15, 2	2015-12-15
Stacked Semiconductor Packages, Methods For Fabricating The Same, And /or Systems Employing The Same App 20150228627 - KWON; Heung-Kyu ; et al.	2015-08-13
Stacked semiconductor packages Grant 9,042,115 - Kwon , et al. May 26, 2	2015-05-26
Stack packages having fastening element and halogen-free inter-package connector Grant 9,040,351 - Kwon , et al. May 26, 2	2015-05-26
Image Sensor Packages App 20150130011 - PARK; Ok-Gyeong ; et al.	2015-05-14
Stack Packages Having Fastening Element And Halogen-free Inter-package Connector App 20140335657 - KWON; HEUNG-KYU ; et al.	2014-11-13
Package-on-package assembly including adhesive containment element Grant 8,829,686 - Hong , et al. September 9, 2	2014-09-09
Method of forming a semiconductor package Grant 8,709,879 - Park , et al. April 29, 2	2014-04-29
Stacked Semiconductor Packages App 20130292828 - KWON; Heung-Kyu ; et al.	2013-11-07
Systems employing a stacked semiconductor package Grant 8,508,954 - Kwon , et al. August 13, 2	2013-08-13
Semiconductor Package And Method Of Manufacturing The Same App 20130203219 - PARK; Ji-hyun ; et al.	2013-08-08
Package-on-package Assembly App 20130187288 - Hong; Ji-Sun ; et al.	2013-07-25
Semiconductor package and method of manufacturing the same Grant 8,426,959 - Park , et al. April 23, 2	2013-04-23
Stack Packages Having Fastening Element And Halogen-free Inter-package Connector App 20120280404 - Kwon; Heung-Kyu ; et al.	2012-11-08
Stacked Semiconductor Packages, Methods Of Fabricating The Same, And/or Systems Employing The Same App 20110149493 - Kwon; Heung-Kyu ; et al.	2011-06-23
Semiconductor Package And Method Of Manufacturing The Same App 20110042797 - Park; Ji-hyun ; et al.	2011-02-24
Method Of Dicing App 20080160724 - SONG; Hyun-Jung ; et al.	2008-07-03
Method Of Fabricating A Semiconductor Package App 20080064215 - NA; Min-ok ; et al.	2008-03-13

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