loadpatents
name:-0.029739856719971
name:-0.017257928848267
name:-0.00051307678222656
Na; Kyu Tae Patent Filings

Na; Kyu Tae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Na; Kyu Tae.The latest application filed is for "isolation layer structure, method of forming the same and method of manufacturing a semiconductor device including the same".

Company Profile
0.17.24
  • Na; Kyu Tae - Malta NY
  • Na; Kyu-Tae - Seoul N/A KR
  • Na; Kyu-Tae - Gyeonggi-do KR
  • Na; Kyu Tae - Hwasung KR
  • Na; Kyu Tae - Hwasung-City KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods of forming isolation regions for FinFET semiconductor devices
Grant 8,673,723 - Na March 18, 2
2014-03-18
Methods of forming a metal silicide layer for semiconductor devices
Grant 8,563,429 - Hur , et al. October 22, 2
2013-10-22
Isolation layer structure, method of forming the same and method of manufacturing a semiconductor device including the same
Grant 8,237,240 - Kim , et al. August 7, 2
2012-08-07
Isolation Layer Structure, Method Of Forming The Same And Method Of Manufacturing A Semiconductor Device Including The Same
App 20110298036 - KIM; Ju-Wan ;   et al.
2011-12-08
Method of forming isolation layer structure and method of manufacturing a semiconductor device including the same
Grant 8,017,495 - Kim , et al. September 13, 2
2011-09-13
Method Of Forming Isolation Layer Structure And Method Of Manufacturing A Semiconductor Device Including The Same
App 20110117721 - KIM; Ju-Wan ;   et al.
2011-05-19
Methods Of Forming A Metal Silicide Layer For Semiconductor Devices
App 20100210099 - Hur; Won-Goo ;   et al.
2010-08-19
Method of removing an oxide and method of filling a trench using the same
Grant 7,745,305 - Lee , et al. June 29, 2
2010-06-29
Method of forming a trench isolation layer and method of manufacturing a non-volatile memory device using the same
Grant 7,601,588 - Choi , et al. October 13, 2
2009-10-13
Methods of filling trenches using high-density plasma deposition (HDP)
Grant 7,598,177 - Cha , et al. October 6, 2
2009-10-06
Methods of forming spin-on-glass insulating layers in semiconductor devices and associated semiconductor device
Grant 7,585,786 - Goo , et al. September 8, 2
2009-09-08
Method of forming a thin layer and method of manufacturing a non-volatile semiconductor device using the same
Grant 7,560,383 - Joo , et al. July 14, 2
2009-07-14
Methods of forming semiconductor devices having multilayer isolation structures
Grant 7,534,698 - Kim , et al. May 19, 2
2009-05-19
Method for forming a silicon oxide layer using spin-on glass
Grant 7,517,817 - Goo , et al. April 14, 2
2009-04-14
Compositions Including Perhydro-polysilazane Used In A Semiconductor Manufacturing Process
App 20090012221 - Hong; Eunkee ;   et al.
2009-01-08
Method of forming carbon polymer film using plasma CVD
Grant 7,410,915 - Morisada , et al. August 12, 2
2008-08-12
Wiring Structures Of Semiconductor Devices And Methods Of Forming The Same
App 20080179746 - Hur; Won-Goo ;   et al.
2008-07-31
Method of removing an oxide and method of filling a trench using the same
App 20080182383 - Lee; Seung-Heon ;   et al.
2008-07-31
Methods of filling gaps by deposition on materials having different deposition rates
Grant 7,358,190 - Kim , et al. April 15, 2
2008-04-15
Methods of forming trench isolation layers using high density plasma chemical vapor deposition
Grant 7,332,409 - Cha , et al. February 19, 2
2008-02-19
Method of forming carbon polymer film using plasma CVD
App 20070224833 - Morisada; Yoshinori ;   et al.
2007-09-27
Method for forming a silicon oxide layer using spin-on glass
App 20070117412 - Goo; Ju-seon ;   et al.
2007-05-24
Plasma CVD film formation apparatus provided with mask
App 20070065597 - Kaido; Shintaro ;   et al.
2007-03-22
Method for forming a silicon oxide layer using spin-on glass
Grant 7,192,891 - Goo , et al. March 20, 2
2007-03-20
Method of forming an isolation layer and method of manufacturing a field effect transistor using the same
App 20070020879 - Baek; Eun-Kyung ;   et al.
2007-01-25
Method of manufacturing a non-volatile semiconductor device
App 20070004139 - Kim; Hong-Gun ;   et al.
2007-01-04
Method of forming a thin layer and method of manufacturing a non-volatile semiconductor device using the same
App 20060246661 - Joo; Kyong-Hee ;   et al.
2006-11-02
Methods of filling trenches using high-density plasma deposition (HDP)
App 20060183320 - Cha; Yong-Won ;   et al.
2006-08-17
Methods of filling trenches using high-density plasma deposition (HDP)
Grant 7,056,827 - Cha , et al. June 6, 2
2006-06-06
Semiconductor device having a photodetector and method for fabricating the same
App 20060102940 - Cha; Yong-Won ;   et al.
2006-05-18
Method of forming a trench isolation layer and method of manufacturing a non-volatile memory device using the same
App 20060094203 - Choi; Jong-Wan ;   et al.
2006-05-04
Methods of manufacturing silicon oxide isolation layers and semiconductor devices that include such isolation layers
App 20060089008 - Hong; Eunkee ;   et al.
2006-04-27
Methods of forming a thin layer for a semiconductor device and apparatus for performing the same
App 20060068599 - Baek; Eun-Kyung ;   et al.
2006-03-30
Semiconductor devices having multilayer isolation structures and methods of forming semiconductor devices having multilayer isolation structures
App 20060054989 - Kim; Hong-Gun ;   et al.
2006-03-16
Methods of forming trench isolation layers using high density plasma chemical vapor deposition
App 20050277265 - Cha, Yong-Won ;   et al.
2005-12-15
Methods of forming spin-on-glass insulating layers in semiconductor devices and associated semiconductor device
App 20050130439 - Goo, Juseon ;   et al.
2005-06-16
Methods of filling trenches using high-density plasma deposition (HDP)
App 20050037610 - Cha, Yong-Won ;   et al.
2005-02-17
Method for forming a silicon oxide layer using spin-on glass
App 20050026443 - Goo, Ju-Seon ;   et al.
2005-02-03
Integrated circuit devices and methods of forming the same that have a low dielectric insulating interlayer between conductive structures
App 20040169283 - Baek, Eun-Kyung ;   et al.
2004-09-02
Methods of filling gaps by deposition on materials having different deposition rates
App 20040144749 - Kim, Hong-Gun ;   et al.
2004-07-29

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