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Patent applications and USPTO patent grants for Na; GuiChea.The latest application filed is for "filp chip interconnection structure with bump on partial pad and method thereof".
Patent | Date |
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Filp chip interconnection structure with bump on partial pad and method thereof Grant 9,125,332 - Pendse , et al. September 1, 2 | 2015-09-01 |
Integrated circuit package system with bump over via Grant 8,592,989 - Na , et al. November 26, 2 | 2013-11-26 |
Filp Chip Interconnection Structure with Bump on Partial Pad and Method Thereof App 20100244245 - Pendse; Rajendra D. ;   et al. | 2010-09-30 |
Flip chip interconnection structure with bump on partial pad and method thereof Grant 7,759,137 - Pendse , et al. July 20, 2 | 2010-07-20 |
Flip Chip Interconnection Structure with Bump on Partial Pad and Method Thereof App 20090243080 - Pendse; Rajendra D. ;   et al. | 2009-10-01 |
Integrated Circuit Package System With Bump Over Via App 20080191345 - Na; Guichea ;   et al. | 2008-08-14 |
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