Na; Do Hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Na; Do Hyun.The latest application filed is for "composition for inhibiting growth of sars-cov-2 and method of preparing the same".

Company Profile

7.13.15

Na; Do Hyun - Seoul KR
Na; Do Hyun - Dongjak-gu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate Grant 11,430,723 - Kim , et al. August 30, 2	2022-08-30
Semiconductor device and manufacturing method thereof Grant 11,328,969 - Na , et al. May 10, 2	2022-05-10
Composition For Inhibiting Growth Of Sars-cov-2 And Method Of Preparing The Same App 20220119381 - NA; Do Hyun ; et al.	2022-04-21
Composition for inhibiting growth of SARS-CoV-2 and method of preparing the same Grant 11,292,789 - Na , et al. April 5, 2	2022-04-05
Drone, Parachute Kit For Drones, And Method Of Controlling Drones App 20210031930 - NA; Do Hyun ; et al.	2021-02-04
Composition For Preventing Or Treating Metabolic Diseases Containing Artemisiae Capillaris Herba And Citrus Unshiu Peel Complex App 20200171113 - NA; Do Hyun ; et al.	2020-06-04
Semiconductor Device And Manufacturing Method Thereof App 20190148254 - Na; Do Hyun ; et al.	2019-05-16
Semiconductor Device With A Semiconductor Die Embedded Between An Extended Substrate And A Bottom Substrate App 20190043793 - Kim; Jae Yun ; et al.	2019-02-07
Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate Grant 10,090,230 - Kim , et al. October 2, 2	2018-10-02
Semiconductor Device And Manufacturing Method Thereof App 20180134546 - Oh; Ji Hoon ; et al.	2018-05-17
Microfluidic sensor package structure and method Grant 9,513,254 - Jeon , et al. December 6, 2	2016-12-06
Semiconductor device Grant 9,418,942 - Chung , et al. August 16, 2	2016-08-16
Semiconductor Device And Manufacturing Method Thereof App 20160211221 - Kim; Jin Young ; et al.	2016-07-21
Semiconductor Device App 20150187717 - Chung; Ji Young ; et al.	2015-07-02
Semiconductor Device With A Semiconductor Die Embedded Between An Extended Substrate And A Bottom Substrate App 20150084185 - Kim; Jae Yun ; et al.	2015-03-26
Microfluidic Sensor Package Structure And Method App 20150041324 - Jeon; Hyung Il ; et al.	2015-02-12
Method of fabricating a semiconductor device having an interposer Grant 8,802,494 - Lee , et al. August 12, 2	2014-08-12
Method Of Fabricating A Semiconductor Device Having An Interposer App 20130109135 - LEE; Choon Heung ; et al.	2013-05-02
Structure of bond pad for semiconductor die and method therefor Grant 8,198,738 - Hwang , et al. June 12, 2	2012-06-12
Semiconductor device having an interposer Grant 8,183,678 - Lee , et al. May 22, 2	2012-05-22
Increased I/O semiconductor package and method of making same Grant 8,125,064 - Lee , et al. February 28, 2	2012-02-28
Semiconductor Device And Fabricating Method Thereof App 20110031598 - LEE; Choon Heung ; et al.	2011-02-10
Semiconductor package with half-etched locking features Grant 7,808,084 - Lee , et al. October 5, 2	2010-10-05
Image sensor package and its manufacturing method Grant 7,227,236 - Lee , et al. June 5, 2	2007-06-05

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