| Patent | Date |
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Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package
Grant 11,088,060 - Lee , et al. August 10, 2 | 2021-08-10 |
Semiconductor Device And Semiconductor Package Having The Same
App 20210193555 - LEE; Seonho ; et al. | 2021-06-24 |
Package Module
App 20200161231 - Lee; Jaekul ; et al. | 2020-05-21 |
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
Grant 10,573,600 - Chi , et al. Feb | 2020-02-25 |
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
App 20170309572 - Chi; HeeJo ; et al. | 2017-10-26 |
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
Grant 9,735,113 - Chi , et al. August 15, 2 | 2017-08-15 |
Integrated circuit package system with molded strip protrusion
Grant 8,937,372 - Yee , et al. January 20, 2 | 2015-01-20 |
Integrated circuit package system with stacked die
Grant 8,810,019 - Yee , et al. August 19, 2 | 2014-08-19 |
Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
Grant 8,710,634 - Chi , et al. April 29, 2 | 2014-04-29 |
Method for manufacture of inline integrated circuit system
Grant 8,501,540 - Yee , et al. August 6, 2 | 2013-08-06 |
Integrated circuit packaging system with dual side connection and method of manufacture thereof
Grant 8,421,210 - Chi , et al. April 16, 2 | 2013-04-16 |
Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof
Grant 8,304,296 - Ko , et al. November 6, 2 | 2012-11-06 |
Integrated Circuit Package System With Stacked Die
App 20120133038 - Yee; Jae Hak ; et al. | 2012-05-31 |
Method for manufacturing package system incorporating flip-chip assembly
Grant 8,183,089 - Choi , et al. May 22, 2 | 2012-05-22 |
Integrated circuit package system with stacked die
Grant 8,138,591 - Yee , et al. March 20, 2 | 2012-03-20 |
Semiconductor Packaging System With Multipart Conductive Pillars And Method Of Manufacture Thereof
App 20110316155 - Ko; ChanHoon ; et al. | 2011-12-29 |
Integrated Circuit Packaging System With Dual Side Connection And Method Of Manufacture Thereof
App 20110285009 - Chi; HeeJo ; et al. | 2011-11-24 |
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
App 20110285007 - Chi; HeeJo ; et al. | 2011-11-24 |
Method For Manufacture Of Inline Integrated Circuit System
App 20110244635 - Yee; Jae Hak ; et al. | 2011-10-06 |
Inline integrated circuit system
Grant 7,968,981 - Yee , et al. June 28, 2 | 2011-06-28 |
Method For Manufacturing Package System Incorporating Flip-chip Assembly
App 20110092021 - Choi; A Leam ; et al. | 2011-04-21 |
Stacked integrated circuit package system with intra-stack encapsulation
Grant 7,871,861 - Song , et al. January 18, 2 | 2011-01-18 |
Package system incorporating a flip-chip assembly
Grant 7,859,120 - Choi , et al. December 28, 2 | 2010-12-28 |
Integrated Circuit Packaging System With An Integral-interposer-structure And Method Of Manufacture Thereof
App 20100244222 - Chi; HeeJo ; et al. | 2010-09-30 |
Stacked Integrated Circuit Package System With Intra-stack Encapsulation
App 20090321908 - Song; Sungmin ; et al. | 2009-12-31 |
Integrated Circuit Package System
App 20090283889 - Jang; Byoung Wook ; et al. | 2009-11-19 |
Package System Incorporating A Flip-chip Assembly
App 20090283888 - Choi; A Leam ; et al. | 2009-11-19 |
Inline Integrated Circuit System
App 20090258494 - Yee; Jae Hak ; et al. | 2009-10-15 |
Integrated Circuit Package System With Molded Strip Protrusion
App 20080230883 - Yee; Jae Hak ; et al. | 2008-09-25 |
Integrated Circuit Package System With Stacked Die
App 20080073770 - Yee; Jae Hak ; et al. | 2008-03-27 |
Spacerless Semiconductor Package Chip Stacking System
App 20070268660 - Ahn; Seungyun ; et al. | 2007-11-22 |
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