| Patent | Date |
|---|
Thermoelectric Generator To Engine Exhaust Manifold Interface Using A Direct-Bond-Copper (DBC) Arrangement
App 20170098750 - Berlin; Carl W. ; et al. | 2017-04-06 |
Heat exchanger equipped with thermal electric device for engine exhaust carbon dioxide collection system
Grant 9,267,415 - Myers , et al. February 23, 2 | 2016-02-23 |
Thermoelectric Generator To Engine Exhaust Manifold Assembly
App 20140305481 - BRANDENBURG; SCOTT D. ; et al. | 2014-10-16 |
Thermoelectric Generator To Engine Exhaust Manifold Assembly
App 20140305480 - BRANDENBURG; SCOTT D. ; et al. | 2014-10-16 |
Carbon dioxide absorbent fluid for a carbon dioxide sequestering system on a vehicle
Grant 8,696,804 - Ihms , et al. April 15, 2 | 2014-04-15 |
Carbon Dioxide Absorbent Fluid For A Carbon Dioxide Sequestering System On A Vehicle
App 20130220130 - IHMS; DAVID W. ; et al. | 2013-08-29 |
Heat Exchanger Equipped With Thermal Electric Device For Engine Exhaust Carbon Dioxide Collection System
App 20130186075 - MYERS; BRUCE A. ; et al. | 2013-07-25 |
Vehicle system to separate and store carbon dioxide from engine exhaust
Grant 8,480,798 - Myers , et al. July 9, 2 | 2013-07-09 |
Thermally-protected chamber for a temperature-sensitive consumer electronic device
Grant 8,438,862 - Oman , et al. May 14, 2 | 2013-05-14 |
Thermally-protected Chamber For A Temperature-sensitive Consumer Electronic Device
App 20110094725 - OMAN; TODD P. ; et al. | 2011-04-28 |
Visual Gap Mitigation Apparatus For A Segmented Display Panel
App 20110080665 - MYERS; BRUCE A. ; et al. | 2011-04-07 |
Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
Grant 7,795,726 - Myers , et al. September 14, 2 | 2010-09-14 |
Heat-dissipating component having stair-stepped coolant channels
Grant 7,782,616 - Myers , et al. August 24, 2 | 2010-08-24 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
Grant 7,608,924 - Myers , et al. October 27, 2 | 2009-10-27 |
Circuit assembly with surface-mount IC package and heat sink
Grant 7,561,436 - Brandenburg , et al. July 14, 2 | 2009-07-14 |
Fluid cooled electronic assembly
Grant 7,551,439 - Peugh , et al. June 23, 2 | 2009-06-23 |
Power semiconductor package having integral fluid cooling
Grant 7,538,425 - Myers , et al. May 26, 2 | 2009-05-26 |
Thermal transient suppression material and method of production
Grant 7,498,376 - Myers , et al. March 3, 2 | 2009-03-03 |
Transistor package with wafer level dielectric isolation
App 20080290378 - Myers; Bruce A. ; et al. | 2008-11-27 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages
App 20080272485 - Myers; Bruce A. ; et al. | 2008-11-06 |
Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips
App 20080272484 - Myers; Bruce A. ; et al. | 2008-11-06 |
Fluid-cooled electronic system
Grant 7,365,981 - Myers , et al. April 29, 2 | 2008-04-29 |
Polymer encapsulated electrical devices
Grant 7,352,070 - Ellis , et al. April 1, 2 | 2008-04-01 |
Vane integration into motor hub to enhance CD cooling
Grant 7,334,243 - Chengalva , et al. February 19, 2 | 2008-02-19 |
Electronic package and method of cooling electronics
Grant 7,307,841 - Berlin , et al. December 11, 2 | 2007-12-11 |
Chip cooling system
Grant 7,294,926 - Schubert , et al. November 13, 2 | 2007-11-13 |
Fluid cooled electronic assembly
App 20070230127 - Peugh; Darrel E. ; et al. | 2007-10-04 |
Thermal management of surface-mount circuit devices on laminate ceramic substrate
Grant 7,269,017 - Berlin , et al. September 11, 2 | 2007-09-11 |
Integrated cooling system for electronic devices
Grant 7,215,547 - Chang , et al. May 8, 2 | 2007-05-08 |
Chip cooling system
App 20070063337 - Schubert; Peter J. ; et al. | 2007-03-22 |
Vane integration into motor hub to enhance CD cooling
App 20070050794 - Chengalva; Suresh K. ; et al. | 2007-03-01 |
Electronic package and method of cooling electronics
App 20070025081 - Berlin; Carl W. ; et al. | 2007-02-01 |
Fluid-cooled electronic system
App 20060291164 - Myers; Bruce A. ; et al. | 2006-12-28 |
Circuit Assembly With Surface-mount Ic Package And Heat Sink
App 20060274512 - Brandenburg; Scott D. ; et al. | 2006-12-07 |
Electronic assembly with solder-bonded heat sink
Grant 7,132,746 - Brandenburg , et al. November 7, 2 | 2006-11-07 |
Method of fabricating an electronic package having underfill standoff
Grant 7,118,940 - Myers , et al. October 10, 2 | 2006-10-10 |
Electronic assembly with integral thermal transient suppression
App 20060209516 - Chengalva; Suresh K. ; et al. | 2006-09-21 |
Power electronic system with passive cooling
Grant 7,106,588 - Oberlin , et al. September 12, 2 | 2006-09-12 |
Circuit board with localized stiffener for enhanced circuit component reliability
Grant 7,094,975 - Chengalva , et al. August 22, 2 | 2006-08-22 |
Audio automatic volume control
App 20060153405 - Myers; Bruce A. | 2006-07-13 |
Thermal Management Of Surface-mount Circuit Devices On Laminate Ceramic Substrate
App 20060109632 - Berlin; Carl W. ; et al. | 2006-05-25 |
Integrated cooling system for electronic devices
App 20060034052 - Chang; Shih-Chia ; et al. | 2006-02-16 |
Surface mount axial leaded component for an electronic module
App 20060021792 - Myers; Bruce A. ; et al. | 2006-02-02 |
Power semiconductor package having integral fluid cooling
App 20060022334 - Myers; Bruce A. ; et al. | 2006-02-02 |
Thermal transient suppression material and method of production
App 20050287352 - Myers, Bruce A. ; et al. | 2005-12-29 |
Integrated circuit package with integral leadframe convector and method therefor
Grant 6,979,900 - Chengalva , et al. December 27, 2 | 2005-12-27 |
Thermally-conductive electrically-insulating polymer-base material
App 20050137286 - Chaudhuri, Arun K. ; et al. | 2005-06-23 |
Circuit board with localized stiffener for enhanced circuit component reliability
App 20050109534 - Chengalva, Suresh K. ; et al. | 2005-05-26 |
Power electronic system with passive cooling
App 20050088822 - Oberlin, Gary E. ; et al. | 2005-04-28 |
Integrated circuit package with integral leadframe convector and method therefor
App 20050082660 - Chengalva, Suresh K. ; et al. | 2005-04-21 |
Method for forming an electronic assembly
App 20050081377 - Brandenburg, Scott D. ; et al. | 2005-04-21 |
Process and electronic assembly for removing heat from a circuit device
App 20050040518 - Brandenburg, Scott D. ; et al. | 2005-02-24 |
Thermally enhanced electronic module
App 20050018402 - Oman, Todd P. ; et al. | 2005-01-27 |
Thermally-conductive electrically-insulating polymer-base material
Grant 6,822,018 - Chaudhuri , et al. November 23, 2 | 2004-11-23 |
Method for forming an electronic assembly
Grant 6,807,731 - Brandenburg , et al. October 26, 2 | 2004-10-26 |
Overmolded electronic package including circuit-carrying substrate
Grant 6,779,260 - Brandenburg , et al. August 24, 2 | 2004-08-24 |
High performance thermal stack for electrical components
App 20040065432 - Smith, John R. ; et al. | 2004-04-08 |
Thermally-capacitive phase change encapsulant for electronic devices
Grant 6,703,128 - Myers , et al. March 9, 2 | 2004-03-09 |
Overmolded circuit board with underfilled surface-mount component and method therefor
Grant 6,693,239 - Myers , et al. February 17, 2 | 2004-02-17 |
Electromagnetic interference shield for overmolded packaging of an electronic assembly
App 20030184976 - Brandenburg, Scott D. ; et al. | 2003-10-02 |
Thermally-conductive electrically-insulating polymer-base material
App 20030158294 - Chaudhuri, Arun K. ; et al. | 2003-08-21 |
Thermally-capacitive phase change encapsulant for electronic devices
App 20030157342 - Myers, Bruce A. ; et al. | 2003-08-21 |
Corrosive resistant flip chip thermal management structure
Grant 6,560,110 - Myers , et al. May 6, 2 | 2003-05-06 |
Overmolded circuit board with underfilled surface-mount component and method therefor
App 20030042035 - Myers, Bruce A. ; et al. | 2003-03-06 |
Method for controlling solder bump height for flip chip integrated circuit devices
Grant 5,400,950 - Myers , et al. March 28, 1 | 1995-03-28 |
Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits
Grant 5,395,679 - Myers , et al. March 7, 1 | 1995-03-07 |
Method and apparatus for through hole substrate printing
Grant 5,322,565 - Zachman , et al. June 21, 1 | 1994-06-21 |
Interface device for thermally coupling an integrated circuit to a heat sink
Grant 5,151,777 - Akin , et al. September 29, 1 | 1992-09-29 |
Method and apparatus for through hole substrate printing
Grant 5,080,929 - Zachman , et al. January 14, 1 | 1992-01-14 |
Flexible circuit interconnector and method of assembly thereof
Grant 4,894,015 - Stockero , et al. January 16, 1 | 1990-01-16 |
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