MUTUAL-TEK INDUSTRIES CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for MUTUAL-TEK INDUSTRIES CO., LTD..The latest application filed is for "printed circuit board and method thereof".

Company Profile

0.11.16

MUTUAL-TEK INDUSTRIES CO., LTD. - New Taipei TW
Mutual-Tek Industries Co., Ltd. - Xinzhuang N/A TW
MUTUAL-TEK INDUSTRIES CO., LTD. - New Taipei City TW
MUTUAL-TEK INDUSTRIES CO., LTD. - Taipei TW
MUTUAL-TEK INDUSTRIES CO., LTD. - Xinzhuang City TW
Mutual-Tek Industries Co., Ltd - Xinzhuang TW
Mutual-Tek Industries Co., Ltd. - TW TW
Mutual-TEK Industries Co., Ltd. - Hsin Chuang Taipei Hsien TW
MUTUAL-TEK INDUSTRIES CO., LTD. - No. 25, Lane 195, Huacheng Rd. Taipei County Xinzhaung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board and method thereof Grant 9,526,179 - Chen , et al. December 20, 2	2016-12-20
Method of manufacturing a combined circuit board Grant 9,433,098 - Chiou , et al. August 30, 2	2016-08-30
Package substrate and electronic assembly Grant 9,185,792 - Chang November 10, 2	2015-11-10
Printed Circuit Board And Method Thereof App 20150257267 - CHEN; Chiu Yu ; et al.	2015-09-10
Combined Circuit Board And Method Of Manufacturing The Same App 20140353014 - Lai; Wen-Chin	2014-12-04
Package Substrate And Electronic Assembly App 20140168899 - Chang; Chih Ming	2014-06-19
Packaged structure having magnetic component and method thereof Grant 8,581,114 - Harrison , et al. November 12, 2	2013-11-12
Method Of Manufacturing A Combined Circuit Board App 20130292050 - Chiou; Shi Yu ; et al.	2013-11-07
Printed circuit board with embedded electronic components and methods for the same Grant 8,516,693 - Chang August 27, 2	2013-08-27
Multilayer Circuit Board App 20120314390 - Chang; Jung-Chien	2012-12-13
Combined Multilayer Circuit Board Having Embedded Components And Manufacturing Method Of The Same App 20110216514 - Chang; Jung-Chien	2011-09-08
Interconnection Structure And Method Thereof App 20110168438 - Chang; Jung-Chien	2011-07-14
Manufacturing process of embedded type flexible or rigid printed circuit board Grant 7,892,412 - Chang February 22, 2	2011-02-22
Light Emitting Apparatus And Method For The Same App 20100276718 - Chang; Jung-Chien	2010-11-04
Method for forming a molded circuit board Grant 7,676,918 - Chang March 16, 2	2010-03-16
Printed Circuit Board With Embedded Electronic Components And Methods For The Same App 20090266596 - Chang; Jung-Chien	2009-10-29
Method of manufacturing a combined multilayer circuit board having embedded chips Grant 7,603,771 - Chang October 20, 2	2009-10-20
Laminated bond of multilayer circuit board having embedded chips Grant 7,505,282 - Chang March 17, 2	2009-03-17
Light Emitting Apparatus And Method For The Same App 20090061552 - Chang; Jung-Chien	2009-03-05
Interconnection Structure And Method Thereof App 20080230264 - Chang; Jung-Chien	2008-09-25
Light Emitting Apparatus And Method For The Same App 20080064131 - Chang; Jung-Chien	2008-03-13
Molded Circuit Board And Method For The Same App 20080012154 - Chang; Jung-Chien	2008-01-17
Manufacturing Process Of Embedded Type Flexible Or Rigid Printed Circuit Board App 20070295606 - Chang; Roger	2007-12-27

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