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Patent applications and USPTO patent grants for Mutsuji; Toshihiko.The latest application filed is for "method for discharging fluid".
Patent | Date |
---|---|
Method for discharging fluid Grant 11,259,415 - Nakamura , et al. February 22, 2 | 2022-02-22 |
Method For Discharging Fluid App 20210144863 - NAKAMURA; Hideki ;   et al. | 2021-05-13 |
Fluid discharge device Grant 10,932,372 - Nakamura , et al. February 23, 2 | 2021-02-23 |
Fluid discharge device, fluid discharge method, and fluid application device Grant 10,632,492 - Nauchi , et al. | 2020-04-28 |
Fluid Discharge Device And Method For Discharging Fluid App 20180376600 - NAKAMURA; Hideki ;   et al. | 2018-12-27 |
Semiconductor wafer conveying tool Grant 10,026,639 - Mutsuji , et al. July 17, 2 | 2018-07-17 |
Fluid Discharge Device, Fluid Discharge Method, And Fluid Application Device App 20180021803 - NAUCHI; Takashi ;   et al. | 2018-01-25 |
Semiconductor Wafer Transfer Jig App 20150179496 - Mutsuji; Toshihiko ;   et al. | 2015-06-25 |
Positioning jig and method of adjusting position Grant 8,899,402 - Mutsuji December 2, 2 | 2014-12-02 |
Positioning Jig and Method of Adjusting Position App 20140116847 - MUTSUJI; Toshihiko | 2014-05-01 |
Automatic soldering device and carrier device Grant 8,186,563 - Sugihara , et al. May 29, 2 | 2012-05-29 |
Automatic Soldering Device And Carrier Device App 20110278348 - Sugihara; Takashi ;   et al. | 2011-11-17 |
Fume removal method for a reflow furnace and a reflow furnace Grant 7,914,595 - Nakamura , et al. March 29, 2 | 2011-03-29 |
Fume Removal Method for a Reflow Furnace and a Reflow Furnace App 20090282973 - Nakamura; Hideki ;   et al. | 2009-11-19 |
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