Mutoh; Tsutomu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mutoh; Tsutomu.The latest application filed is for "highly adhesive polyimide copper clad laminate and method of making the same".

Company Profile

0.3.10

Mutoh; Tsutomu - Tochigi JP
Mutoh; Tsutomu - Utsunomiya JP
Mutoh; Tsutomu - Utsunomiya Tochigi JP
Mutoh; Tsutomu - Utsunomiya-shi JP
Mutoh; Tsutomu - Utsunomiya City JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Highly Adhesive Polyimide Copper Clad Laminate And Method Of Making The Same App 20130244000 - Chen; Yu-Jean ; et al.	2013-09-19
Composite organic encapsulants Grant 8,233,261 - Summers , et al. July 31, 2	2012-07-31
Highly Adhesive Polyimide Copper Clad Laminate And Method Of Making The Same App 20100323161 - Chen; Yu-Jean ; et al.	2010-12-23
Composite Organic Encapsulants App 20100067168 - Summers; John D. ; et al.	2010-03-18
Flame retardant photoimagable coverlay compositions and methods relating thereto Grant 7,618,766 - Mutoh November 17, 2	2009-11-17
Adhesive Compositions Useful In Flexible Circuit Substrate Applications And Methods Relating Thereto App 20090253834 - KINO; TAKASHI ; et al.	2009-10-08
Highly Adhesive Polyimide Copper Clad Laminate And Method Of Making The Same App 20090197104 - Chen; Yu-Jean ; et al.	2009-08-06
Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto Grant 7,527,915 - Mutoh May 5, 2	2009-05-05
Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto App 20080033090 - Mutoh; Tsutomu	2008-02-07
Flame retardant photoimagable coverlay compositions and methods relating thereto App 20070149635 - Mutoh; Tsutomu	2007-06-28
Photosensitive thick-film dielectric paste composition and method for making an insulating layer using same App 20060223690 - Mutoh; Tsutomu	2006-10-05
Photosensitive thick-film paste materials for forming light-transmitting electromagnetic shields, light-transmitting electromagnetic shields formed using the same, and method of manufacture thereof App 20050037278 - Koishikawa, Jun ; et al.	2005-02-17

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