| Patent | Date |
|---|
Machine-learning Based Biosensor System
App 20220160265 - Sankhala; Devangsingh Gajendarsingh ; et al. | 2022-05-26 |
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
Grant 11,217,516 - Muthukumar , et al. January 4, 2 | 2022-01-04 |
Disease Diagnostics Using A Multi-configurable Sensing Array
App 20210325380 - Muthukumar; Sriram | 2021-10-21 |
High Density Analog Multipexing
App 20200054259 - Sankhala; Devangsingh Gajendarsingh ; et al. | 2020-02-20 |
Multi-configurable Sensing Array And Methods Of Using Same
App 20190250153 - Muthukumar; Sriram ; et al. | 2019-08-15 |
Stacked-chip Packages In Package-on-package Apparatus, Methods Of Assembling Same, And Systems Containing Same
App 20190148275 - MUTHUKUMAR; Sriram ; et al. | 2019-05-16 |
Wearable Biosensors With Room Temperature Ionic Liquid Buffer
App 20190069818 - Prasad; Shalini ; et al. | 2019-03-07 |
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
Grant 10,186,480 - Muthukumar , et al. Ja | 2019-01-22 |
Warpage compensation metal for wafer level packaging technology
Grant 10,134,689 - Sridharan , et al. November 20, 2 | 2018-11-20 |
Biosensing system and methods using electron-ionic mechanisms at fluid-sensor interfaces
Grant 10,006,882 - Prasad , et al. June 26, 2 | 2018-06-26 |
Wafer level device and method with cantilever pillar structure
Grant 9,806,047 - Thambidurai , et al. October 31, 2 | 2017-10-31 |
Integrated WLUF and SOD process
Grant 9,728,515 - Mahmud , et al. August 8, 2 | 2017-08-08 |
Integrated Wluf And Sod Process
App 20160247774 - Mahmud; Rubayat ; et al. | 2016-08-25 |
Biosensing System And Methods Using Electron Ionic Mechanisms At Fluid-sensor Interfaces
App 20160146754 - Prasad; Shalini ; et al. | 2016-05-26 |
Integrated WLUF and SOD process
Grant 9,349,698 - Mahmud , et al. May 24, 2 | 2016-05-24 |
Wafer Level Device And Method With Cantilever Pillar Structure
App 20150279799 - Thambidurai; Karthik ; et al. | 2015-10-01 |
Method of stiffening coreless package substrate
Grant 8,860,205 - Muthukumar , et al. October 14, 2 | 2014-10-14 |
Integrated Wluf And Sod Process
App 20140001631 - Mahmud; Rubayat ; et al. | 2014-01-02 |
Methods and apparatuses to stiffen integrated circuit package
Grant 8,502,400 - Karpur , et al. August 6, 2 | 2013-08-06 |
Stacked-chip Packages In Package-on-package Apparatus, Methods Of Assembling Same, And Systems Containing Same
App 20130127054 - MUTHUKUMAR; Sriram ; et al. | 2013-05-23 |
Methods for making multi-chip packaging using an interposer
Grant 8,387,240 - Muthukumar , et al. March 5, 2 | 2013-03-05 |
Methods And Apparatuses To Stiffen Integrated Circuit Package
App 20120187583 - Karpur; Prasanna ; et al. | 2012-07-26 |
Methods and apparatuses to stiffen integrated circuit package
Grant 8,143,110 - Karpur , et al. March 27, 2 | 2012-03-27 |
Metal-metal bonding of compliant interconnect
Grant 8,030,782 - Ramanathan , et al. October 4, 2 | 2011-10-04 |
Methods And Apparatuses To Stiffen Integrated Circuit Package
App 20110147912 - Karpur; Prasanna ; et al. | 2011-06-23 |
Multi-chip Packaging Using An Interposer Such As A Silicon Based Interposer With Through-silicon-vias
App 20110067236 - MUTHUKUMAR; Sriram ; et al. | 2011-03-24 |
Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias
Grant 7,882,628 - Muthukumar , et al. February 8, 2 | 2011-02-08 |
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
App 20100327419 - Muthukumar; Sriram ; et al. | 2010-12-30 |
Method of stiffening coreless package substrate
Grant 7,851,269 - Muthukumar , et al. December 14, 2 | 2010-12-14 |
Method Of Stiffening Coreless Package Substrate
App 20100301492 - Muthukumar; Sriram ; et al. | 2010-12-02 |
Multi-chip packaging using an interposer with through-vias
Grant 7,841,080 - Muthukumar , et al. November 30, 2 | 2010-11-30 |
Metal-metal Bonding Of Compliant Interconnect
App 20100237505 - Muthukumar; Sriram ; et al. | 2010-09-23 |
Look-up table overdrive circuits
Grant 7,800,402 - Rahim , et al. September 21, 2 | 2010-09-21 |
Method of stiffening coreless package substrate
App 20100207265 - Muthukumar; Sriram ; et al. | 2010-08-19 |
Metal-metal bonding of compliant interconnect
Grant 7,750,487 - Muthukumar , et al. July 6, 2 | 2010-07-06 |
Thin silicon based substrate
Grant 7,589,424 - Muthukumar , et al. September 15, 2 | 2009-09-15 |
Thin Silicon based substrate
App 20080303159 - Muthukumar; Sriram ; et al. | 2008-12-11 |
Multi-chip Packaging Using An Interposer Such As A Silicon Based Interposer With Through-silicon-vias
App 20080295329 - Muthukumar; Sriram ; et al. | 2008-12-04 |
Multi-chip Packaging Using An Interposer Such As A Silicon Based Interposer With Through-silicon-vias
App 20080295325 - Muthukumar; Sriram ; et al. | 2008-12-04 |
Thin silicon based substrate
Grant 7,443,030 - Muthukumar , et al. October 28, 2 | 2008-10-28 |
Electropolishing metal features on a semiconductor wafer
App 20080217183 - Muthukumar; Sriram ; et al. | 2008-09-11 |
Compliant multi-composition interconnects
Grant 7,400,041 - Muthukumar , et al. July 15, 2 | 2008-07-15 |
Schottky diode with silver layer contacting the ZnO and Mg.sub.xZn.sub.1-xO films
Grant 7,400,030 - Lu , et al. July 15, 2 | 2008-07-15 |
Compliant interconnects for semiconductors and micromachines
Grant 7,378,742 - Muthukumar , et al. May 27, 2 | 2008-05-27 |
High Performance Integrated Inductor
App 20080023791 - Muthukumar; Sriram ; et al. | 2008-01-31 |
Integrated Inductors And Compliant Interconnects For Semiconductor Packaging
App 20070290362 - Hsu; Rockwell ; et al. | 2007-12-20 |
High performance integrated inductor
Grant 7,294,525 - Muthukumar , et al. November 13, 2 | 2007-11-13 |
Integrated inductors and compliant interconnects for semiconductor packaging
Grant 7,279,391 - Hsu , et al. October 9, 2 | 2007-10-09 |
Zinc oxide nanotip and fabricating method thereof
App 20070151508 - Lu; Yicheng ; et al. | 2007-07-05 |
Composite metal layer formed using metal nanocrystalline particles in an electroplating bath
App 20060290000 - Worwag; Wojciech ; et al. | 2006-12-28 |
Process for coating thick resist over polymer features
App 20060286487 - Hill; Charles D. ; et al. | 2006-12-21 |
High performance integrated inductor
App 20060270065 - Muthukumar; Sriram ; et al. | 2006-11-30 |
Offset solder bump method and apparatus
App 20060264021 - Farahani; Mohammad M. ; et al. | 2006-11-23 |
Thin silicon based substrate
App 20060189121 - Muthukumar; Sriram ; et al. | 2006-08-24 |
Method of manufacturing of thin based substrate
Grant 7,049,208 - Muthukumar , et al. May 23, 2 | 2006-05-23 |
Compliant interconnects for semiconductors and micromachines
App 20060087032 - Muthukumar; Sriram ; et al. | 2006-04-27 |
Method Of Manufacturing Of Thin Based Substrate
App 20060079079 - Muthukumar; Sriram ; et al. | 2006-04-13 |
Integrated inductors and compliant interconnects for semiconductor packaging
App 20060038289 - Hsu; Rockwell ; et al. | 2006-02-23 |
Metal-metal bonding of compliant interconnect
App 20060033172 - Muthukumar; Sriram ; et al. | 2006-02-16 |
Zinc oxide nanotip and fabricating method thereof
Grant 6,979,489 - Lu , et al. December 27, 2 | 2005-12-27 |
Compliant multi-composition interconnects
App 20050239275 - Muthukumar, Sriram ; et al. | 2005-10-27 |
Schottky diode with silver layer contacting the ZnO and MgxZn1-xO films
App 20050145970 - Lu, Yicheng ; et al. | 2005-07-07 |
Schottky diode with silver layer contacting the ZnO and MgxZn1-xO films
Grant 6,846,731 - Lu , et al. January 25, 2 | 2005-01-25 |
Zinc oxide nanotip and fabricating method thereof
App 20030213428 - Lu, Yicheng ; et al. | 2003-11-20 |
Schottky diode with silver layer contacting the ZnO and MgxZn1-xO films
App 20030129813 - Lu, Yicheng ; et al. | 2003-07-10 |
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