| Patent | Date |
|---|
Single metallization scheme for gate, source, and drain contact integration
Grant 11,309,221 - Greene , et al. April 19, 2 | 2022-04-19 |
Hybridization for characterization and metrology
Grant 11,295,969 - Muthinti , et al. April 5, 2 | 2022-04-05 |
Adjustable via dimension and chamfer angle
Grant 11,276,636 - Clevenger , et al. March 15, 2 | 2022-03-15 |
Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom
Grant 11,101,172 - Motoyama , et al. August 24, 2 | 2021-08-24 |
Multi-channel overlay metrology
Grant 11,054,250 - Muthinti , et al. July 6, 2 | 2021-07-06 |
Semiconductor Device With Linerless Contacts
App 20210151351 - Joseph Varghese; Alex ; et al. | 2021-05-20 |
Single metallization scheme for gate, source, and drain contact integration
Grant 10,985,076 - Greene , et al. April 20, 2 | 2021-04-20 |
Hybrid BEOL metallization utilizing selective reflection mask
Grant 10,957,646 - Briggs , et al. March 23, 2 | 2021-03-23 |
Gate contact over active enabled by alternative spacer scheme and claw-shaped cap
Grant 10,943,990 - Greene , et al. March 9, 2 | 2021-03-09 |
Gate cut critical dimension shrink and active gate defect healing using selective deposition
Grant 10,923,401 - Greene , et al. February 16, 2 | 2021-02-16 |
Adjustable Via Dimension and Chamfer Angle
App 20210035904 - Clevenger; Lawrence A. ; et al. | 2021-02-04 |
Semiconductor device with linerless contacts
Grant 10,903,111 - Joseph Varghese , et al. January 26, 2 | 2021-01-26 |
Determination Of Optical Roughness In Euv Structures
App 20200301268 - BONAM; RAVI K. ; et al. | 2020-09-24 |
Semiconductor Device With Linerless Contacts
App 20200303246 - Joseph Varghese; Alex ; et al. | 2020-09-24 |
Pre-patterned etch stop for interconnect trench formation overlying embedded MRAM structures
Grant 10,741,609 - Muthinti , et al. A | 2020-08-11 |
Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barrier at Via Bottom
App 20200243379 - Motoyama; Koichi ; et al. | 2020-07-30 |
Pre-patterned Etch Stop For Interconnect Trench Formation Overlying Embedded Mram Structures
App 20200219932 - MUTHINTI; GANGADHARA RAJA ; et al. | 2020-07-09 |
Hybrid Beol Metallization Utilizing Selective Reflection Mask
App 20200176388 - BRIGGS; Benjamin D. ; et al. | 2020-06-04 |
Hybridization For Characterization And Metrology
App 20200168489 - MUTHINTI; GANGADHARA RAJA ; et al. | 2020-05-28 |
Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom
Grant 10,658,233 - Motoyama , et al. | 2020-05-19 |
Gate Contact Over Active Enabled by Alternative Spacer Scheme and Claw-Shaped Cap
App 20200135886 - Greene; Andrew ; et al. | 2020-04-30 |
Gate Cut Critical Dimension Shrink And Active Gate Defect Healing Using Selective Deposition
App 20200135575 - Greene; Andrew ; et al. | 2020-04-30 |
Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barrier at Via Bottom
App 20200126854 - Motoyama; Koichi ; et al. | 2020-04-23 |
Single Metallization Scheme For Gate, Source, And Drain Contact Integration
App 20200083117 - Greene; Andrew ; et al. | 2020-03-12 |
Hybrid BEOL metallization utilizing selective reflection mask
Grant 10,586,767 - Briggs , et al. | 2020-03-10 |
Single Metallization Scheme For Gate, Source, And Drain Contact Integration
App 20200066602 - GREENE; Andrew ; et al. | 2020-02-27 |
Hybrid Beol Metallization Utilizing Selective Reflection Mask
App 20200027840 - BRIGGS; Benjamin D. ; et al. | 2020-01-23 |
Multi-channel Overlay Metrology
App 20190316900 - Muthinti; Gangadhara Raja ; et al. | 2019-10-17 |
Interface Passivation Layers And Methods Of Fabricating
App 20160343806 - SIDDIQUI; Shariq ; et al. | 2016-11-24 |
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