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name:-0.0036959648132324
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Muta; Takatoshi Patent Filings

Muta; Takatoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Muta; Takatoshi.The latest application filed is for "polyamide-based 3d printer material".

Company Profile
0.6.7
  • Muta; Takatoshi - Tokyo JP
  • MUTA; Takatoshi - Chiyoda-ku JP
  • Muta; Takatoshi - Shiga N/A JP
  • Muta; Takatoshi - Nagahama-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polyamide-based 3d Printer Material
App 20210040318 - HIRANO; Akiko ;   et al.
2021-02-11
Multilayer Porous Film, Battery Separator, And Battery
App 20180083247 - SEO; Masayuki ;   et al.
2018-03-22
Heat-shrinkable laminated film, molded product and heat-shrinkable label comprising the film, and container
Grant 9,840,067 - Muta , et al. December 12, 2
2017-12-12
Porous polyolefin resin film
Grant 9,115,277 - Takagi , et al. August 25, 2
2015-08-25
Porous Polyolefin Resin Film
App 20130236793 - Takagi; Yoshihito ;   et al.
2013-09-12
Heat-shrinkable Laminated Film, Molded Product And Heat-shrinkable Label Comprising The Film, And Container
App 20130224412 - Muta; Takatoshi ;   et al.
2013-08-29
Heat-shrinkable film, molded product and heat-shrinkable label employing the film, and container employing the molded product or having the label fitted thereon
Grant 8,420,193 - Hiruma , et al. April 16, 2
2013-04-16
Heat-shrinkable Film, Molded Product And Heat-shrinkable Label Employing The Film, And Container Employing The Molded Product Or Having The Label Fitted Thereon
App 20100143623 - Hiruma; Takashi ;   et al.
2010-06-10

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