loadpatents
name:-0.011937856674194
name:-0.0069069862365723
name:-0.00360107421875
Muse; Danny W. Patent Filings

Muse; Danny W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Muse; Danny W..The latest application filed is for "electronic gaming die".

Company Profile
3.7.10
  • Muse; Danny W. - El Paso TX
  • Muse; Danny W. - Huntsville AL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices
Grant 10,748,867 - Wicker , et al. A
2020-08-18
Methods for connecting inter-layer conductors and components in 3D structures
Grant 10,660,214 - Wicker , et al.
2020-05-19
Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices
Grant 10,518,490 - Wicker , et al. Dec
2019-12-31
Electronic gaming die
Grant 10,335,673 - Muse , et al.
2019-07-02
Electronic Gaming Die
App 20180140941 - Muse; Danny W. ;   et al.
2018-05-24
Method for treating infectious diseases using emissive energy
App 20180078641 - Felder; Mitchell S. ;   et al.
2018-03-22
Electronic gaming die
Grant 9,908,037 - Muse , et al. March 6, 2
2018-03-06
Method for treating infectious diseases using emissive energy
App 20170049889 - Felder; Mitchell S. ;   et al.
2017-02-23
Methods For Connecting Inter-layer Conductors And Components In 3d Structures
App 20160324009 - Wicker; Ryan B. ;   et al.
2016-11-03
Method for connecting inter-layer conductors and components in 3D structures
Grant 9,414,501 - Wicker , et al. August 9, 2
2016-08-09
Electronic Gaming Die
App 20150014923 - Muse; Danny W. ;   et al.
2015-01-15
Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices
App 20140268604 - Wicker; Ryan B. ;   et al.
2014-09-18
Methods and Systems For Connecting Inter-Layer Conductors and Components in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices
App 20140268607 - Wicker; Ryan B. ;   et al.
2014-09-18
Extrusion-based Additive Manufacturing System For 3d Structural Electronic, Electromagnetic And Electromechanical Components/devices
App 20130170171 - Wicker; Ryan B. ;   et al.
2013-07-04

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