Murugan; Sanjay Kumar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Murugan; Sanjay Kumar.The latest application filed is for "molded semiconductor module having a mold step for increasing creepage distance".

Company Profile

5.7.10

Murugan; Sanjay Kumar - Melaka MY
Murugan; Sanjay Kumar - Malacca MY
Murugan; Sanjay Kumar - Batu Berendam MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molded Semiconductor Module Having A Mold Step For Increasing Creepage Distance App 20220262693 - Kreiter; Oliver Markus ; et al.	2022-08-18
Package lead design with grooves for improved dambar separation Grant 11,362,023 - Narayanasamy , et al. June 14, 2	2022-06-14
Chip Package, Semiconductor Arrangement, Method Of Forming A Chip Package, And Method Of Forming A Semiconductor Arrangement App 20220173006 - Gan; Thai Kee ; et al.	2022-06-02
Power Semiconductor Package And Method For Fabricating A Power Semiconductor Package App 20220115245 - Narayanasamy; Jayaganasan ; et al.	2022-04-14
Power semiconductor package and method for fabricating a power semiconductor package Grant 11,211,356 - Lim , et al. December 28, 2	2021-12-28
Power Semiconductor Package and Method for Fabricating a Power Semiconductor Package App 20210057375 - Lim; Wee Aun Jason ; et al.	2021-02-25
Package Lead Design with Grooves for Improved Dambar Separation App 20210013135 - Narayanasamy; Jayaganasan ; et al.	2021-01-14
Method for forming a matrix composite layer and workpiece with a matrix composite layer Grant 10,457,001 - Narayanasamy , et al. Oc	2019-10-29
Rivetless lead fastening for a semiconductor package Grant 10,431,526 - Ho , et al. O	2019-10-01
Spatially selective roughening of encapsulant to promote adhesion with functional structure Grant 10,347,554 - Santos , et al. July 9, 2	2019-07-09
Rivetless Lead Fastening for a Semiconductor Package App 20190109070 - Ho; Kar Meng ; et al.	2019-04-11
Method for Forming a Matrix Composite Layer and Workpiece With a Matrix Composite Layer App 20180297301 - Narayanasamy; Jayaganasan ; et al.	2018-10-18
Semiconductor chip package having contact pins at short side edges Grant 10,037,934 - Otremba , et al. July 31, 2	2018-07-31
Functionalized interface structure Grant 9,922,910 - Otremba , et al. March 20, 2	2018-03-20
Spatially selective roughening of encapsulant to promote adhesion with functional structure App 20170271229 - SANTOS; Norbert Joson ; et al.	2017-09-21
Electronic Devices with Increased Creepage Distances App 20160365296 - Otremba; Ralf ; et al.	2016-12-15
Semiconductor Chip Package Having Contact Pins at Short Side Edges App 20160233149 - Otremba; Ralf ; et al.	2016-08-11

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