Murray; Mark P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Murray; Mark P..The latest application filed is for "full removal of dual damascene metal level".
- Murray; Mark P. - Stowe VT
- Murray; Mark P. - Burlington VT
- Murray; Mark P. - Essex Junction VT
| Patent | Date |
|---|---|
| Full Removal Of Dual Damascene Metal Level App 20070275565 - Cooney; Edward C. III ; et al. | 2007-11-29 |
| Slurry and use thereof for polishing Grant 7,052,625 - Chamberlin , et al. May 30, 2 | 2006-05-30 |
| Single and multilevel rework Grant 6,982,227 - Cooney, III , et al. January 3, 2 | 2006-01-03 |
| Full Removal Of Dual Damascene Metal Level App 20040245636 - Cooney, Edward C III ; et al. | 2004-12-09 |
| Single and multilevel rework App 20040142565 - Cooney, Edward C. III ; et al. | 2004-07-22 |
| Single and multilevel rework Grant 6,674,168 - Cooney, III , et al. January 6, 2 | 2004-01-06 |
| Interconnection structure and method for fabricating same Grant 6,653,737 - Horak , et al. November 25, 2 | 2003-11-25 |
| Interconnection structure and method for fabricating same App 20020142581 - Horak, David V. ; et al. | 2002-10-03 |
| Interconnection structure and method for fabricating same Grant 6,436,814 - Horak , et al. August 20, 2 | 2002-08-20 |
| Slurry and use thereof for polishing App 20010013506 - Chamberlin, Timothy Scott ; et al. | 2001-08-16 |
| Combined chemical mechanical polishing and reactive ion etching process Grant 6,221,775 - Ference , et al. April 24, 2 | 2001-04-24 |
| SEC | 0001394202 | Murray Mark P |
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