Murray; Conal
Patent Applications and Registrations
Patent applications and USPTO patent grants for Murray; Conal.The latest application filed is for "controlling grain boundaries in high aspect-ratio conductive regions".
- Murray; Conal - Yorktown Heights NY
| Patent | Date |
|---|---|
| Modulating metal interconnect surface topography Grant 11,069,567 - Murray , et al. July 20, 2 | 2021-07-20 |
| Controlling grain boundaries in high aspect-ratio conductive regions Grant 10,903,115 - Murray , et al. January 26, 2 | 2021-01-26 |
| Controlling Grain Boundaries In High Aspect-ratio Conductive Regions App 20200135556 - Murray; Conal ; et al. | 2020-04-30 |
| Controlling grain boundaries in high aspect-ratio conductive regions Grant 10,600,686 - Murray , et al. | 2020-03-24 |
| Modulating metal interconnect surface topography Grant 10,522,398 - Murray , et al. Dec | 2019-12-31 |
| Controlling Grain Boundaries In High Aspect-ratio Conductive Regions App 20190378755 - Murray; Conal ; et al. | 2019-12-12 |
| Modulating Metal Interconnect Surface Topography App 20190318962 - Murray; Conal ; et al. | 2019-10-17 |
| Modulating Metal Interconnect Surface Topography App 20190067092 - Murray; Conal ; et al. | 2019-02-28 |
| Reducing Contact Resistance In Vias For Copper Interconnects App 20180033683 - Murray; Conal ; et al. | 2018-02-01 |
| Method of forming images in a scanning electron microscope Grant 7,105,817 - Gignac , et al. September 12, 2 | 2006-09-12 |
| Method for electroplating on resistive substrates Grant 6,974,531 - Andricacos , et al. December 13, 2 | 2005-12-13 |
| Method for electroplating on resistive substrates App 20050199502 - Andricacos, Panayotis ; et al. | 2005-09-15 |
| Process of forming copper structures Grant 6,812,143 - Lane , et al. November 2, 2 | 2004-11-02 |
| Barrier material for copper structures Grant 6,787,912 - Lane , et al. September 7, 2 | 2004-09-07 |
| Method for electroplating on resistive substrates App 20040069648 - Andricacos, Panayotis ; et al. | 2004-04-15 |
| Barrier material for copper structures App 20030201537 - Lane, Michael ; et al. | 2003-10-30 |
| Process of forming copper structures App 20030203617 - Lane, Michael ; et al. | 2003-10-30 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 