Murphy; Tim E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Murphy; Tim E..The latest application filed is for "semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods".

Company Profile

0.3.6

Murphy; Tim E. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Dice Having Back Side Redistribution Layer Accessed Using Through-silicon Vias, Methods App 20080153204 - Jackson; Timothy L. ; et al.	2008-06-26
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods Grant 7,355,273 - Jackson , et al. April 8, 2	2008-04-08
Stress and force management techniques for a semiconductor die App 20070018336 - Farnworth; Warren M. ; et al.	2007-01-25
Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof Grant 6,962,867 - Jackson , et al. November 8, 2	2005-11-08
Stress and force management techniques for a semiconductor die App 20050206012 - Farnworth, Warren M. ; et al.	2005-09-22
Semiconductor dice having backside redistribution layer accessed using through-silicon vias, methods App 20050186705 - Jackson, Timothy L. ; et al.	2005-08-25
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies Grant 6,800,930 - Jackson , et al. October 5, 2	2004-10-05
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods of fabrication and assemblies App 20040121521 - Jackson, Timothy L. ; et al.	2004-06-24
Semiconductor Dice Having Backside Redistribution Layer Accessed Using Through-silicon Vias, Methods Of Fabrication And Assemblies App 20040021139 - Jackson, Timothy L. ; et al.	2004-02-05

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