| Patent | Date |
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Method Of Porosifying Part Of A Semiconductor Wafer
App 20220310380 - Friedler; Sophia ; et al. | 2022-09-29 |
Superjunction Transistor Device
App 20220270933 - Weber; Hans ; et al. | 2022-08-25 |
Transistor Device And Method Of Manufacturing
App 20220246744 - Siemieniec; Ralf ; et al. | 2022-08-04 |
Method for partially removing a semiconductor wafer
Grant 11,404,262 - Friedler , et al. August 2, 2 | 2022-08-02 |
Method for forming a superjunction transistor device
Grant 11,348,838 - Weber , et al. May 31, 2 | 2022-05-31 |
Semiconductor chip including back-side conductive layer
Grant 11,328,955 - Muri , et al. May 10, 2 | 2022-05-10 |
Method for Producing a Superjunction Device
App 20220052182 - Tutuc; Daniel ; et al. | 2022-02-17 |
Superjunction Transistor Device
App 20220052154 - Weber; Hans ; et al. | 2022-02-17 |
Power Relay Circuit
App 20210407746 - Muri; Ingo ; et al. | 2021-12-30 |
Semiconductor Device Manufacturing By Thinning And Dicing
App 20210391218 - Ernst; Felix Johannes Heinrich ; et al. | 2021-12-16 |
Method Of Thinning A Semiconductor Substrate To High Evenness And Semiconductor Substrate Having A Device Layer Of High Evenness
App 20210391377 - Frey; Alexander ; et al. | 2021-12-16 |
Superjunction Transistor Device And Method For Forming A Superjunction Transistor Device
App 20210376063 - Weber; Hans ; et al. | 2021-12-02 |
Method For Producing A Superjunction Device
App 20210376064 - Muri; Ingo ; et al. | 2021-12-02 |
Method for forming a superjunction transistor device
Grant 11,189,690 - Weber , et al. November 30, 2 | 2021-11-30 |
Power relay circuit
Grant 11,139,125 - Muri , et al. October 5, 2 | 2021-10-05 |
Semiconductor Device Having Semiconductor Device Elements In A Semiconductor Layer
App 20210265468 - Muri; Ingo ; et al. | 2021-08-26 |
Semiconductor device and manufacturing method
Grant 11,038,028 - Muri , et al. June 15, 2 | 2021-06-15 |
Semiconductor Device Including An Electrical Contact With A Metal Layer Arranged Thereon
App 20210167036 - HELLMUND; Oliver ; et al. | 2021-06-03 |
Devices with backside metal structures and methods of formation thereof
Grant 11,011,409 - Hellmund , et al. May 18, 2 | 2021-05-18 |
Method for Forming a Superjunction Transistor Device
App 20200395252 - Weber; Hans ; et al. | 2020-12-17 |
Semiconductor Chip Including Back-side Conductive Layer
App 20200365457 - Muri; Ingo ; et al. | 2020-11-19 |
Reticle and exposure method including projection of a reticle pattern into neighboring exposure fields
Grant 10,802,404 - Ortner , et al. October 13, 2 | 2020-10-13 |
Semiconductor chip including self-aligned, back-side conductive layer and method for making the same
Grant 10,784,161 - Muri , et al. Sept | 2020-09-22 |
Semiconductor device and semiconductor wafer including a porous layer and method of manufacturing
Grant 10,714,377 - Muri , et al. | 2020-07-14 |
Method for Forming a Superjunction Transistor Device
App 20200194547 - Weber; Hans ; et al. | 2020-06-18 |
Method for Partially Removing a Semiconductor Wafer
App 20200168449 - Friedler; Sophia ; et al. | 2020-05-28 |
Power Relay Circuit
App 20200161062 - Muri; Ingo ; et al. | 2020-05-21 |
Devices with Backside Metal Structures and Methods of Formation Thereof
App 20200098617 - Hellmund; Oliver ; et al. | 2020-03-26 |
Devices with backside metal structures and methods of formation thereof
Grant 10,535,553 - Hellmund , et al. January 14, 2 | 2020-01-14 |
Method for manufacturing a semiconductor device comprising etching a semiconductor material
Grant 10,497,583 - Moder , et al. De | 2019-12-03 |
Semiconductor Device and Manufacturing Method
App 20190348506 - Muri; Ingo ; et al. | 2019-11-14 |
Wafer contacting device, and arrangement and method for electrochemical etching of a wafer
Grant 10,373,839 - Kroener , et al. | 2019-08-06 |
Method of wafer thinning and realizing backside metal structures
Grant 10,325,804 - Hellmund , et al. | 2019-06-18 |
Semiconductor Chip Including Self-Aligned, Back-Side Conductive Layer and Method for Making the Same
App 20190096758 - Muri; Ingo ; et al. | 2019-03-28 |
Semiconductor Device and Semiconductor Wafer Including a Porous Layer and Method of Manufacturing
App 20190074212 - Muri; Ingo ; et al. | 2019-03-07 |
Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck
Grant 10,199,255 - Muri , et al. Fe | 2019-02-05 |
Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures
Grant 10,199,372 - Muri , et al. Fe | 2019-02-05 |
Monolithically Integrated Chip Including Active Electrical Components And Passive Electrical Components With Chip Edge Stabilization Structures
App 20180374843 - Muri; Ingo ; et al. | 2018-12-27 |
Method for Thinning Substrates
App 20180330981 - Rupp; Roland ; et al. | 2018-11-15 |
Method for Manufacturing a Semiconductor Device Comprising Etching a Semiconductor Material
App 20180277391 - Moder; Iris ; et al. | 2018-09-27 |
Reticle And Exposure Method Including Projection Of A Reticle Pattern Into Neighboring Exposure Fields
App 20180267408 - Ortner; Joerg ; et al. | 2018-09-20 |
Semiconductor device and methods for forming a plurality of semiconductor devices
Grant 10,074,566 - Baumgartl , et al. September 11, 2 | 2018-09-11 |
Devices with Backside Metal Structures and Methods of Formation Thereof
App 20180233399 - Hellmund; Oliver ; et al. | 2018-08-16 |
Method for thinning substrates
Grant 10,049,914 - Rupp , et al. August 14, 2 | 2018-08-14 |
Method of Wafer Thinning and Realizing Backside Metal Structures
App 20180144974 - Hellmund; Oliver ; et al. | 2018-05-24 |
Semiconductor Devices And Methods For Manufacturing Semiconductor Devices
App 20180144982 - Muri; Ingo ; et al. | 2018-05-24 |
Devices with backside metal structures and methods of formation thereof
Grant 9,960,076 - Hellmund , et al. May 1, 2 | 2018-05-01 |
Method of forming a semiconductor device and semiconductor device
Grant 9,954,065 - Mauder , et al. April 24, 2 | 2018-04-24 |
Devices with Backside Metal Structures and Methods of Formation Thereof
App 20180040504 - Hellmund; Oliver ; et al. | 2018-02-08 |
Substrates with buried isolation layers and methods of formation thereof
Grant 9,875,926 - Moder , et al. January 23, 2 | 2018-01-23 |
Method for planarizing one or more workpieces, a workpiece planarization arrangement, a chuck and a replaceable workpiece-support for a chuck
Grant 9,862,037 - Muri , et al. January 9, 2 | 2018-01-09 |
Semiconductor Device and Methods for Forming a Plurality of Semiconductor Devices
App 20170338153 - Baumgartl; Johannes ; et al. | 2017-11-23 |
Method For Providing A Planarizable Workpiece Support, A Workpiece Planarization Arrangement, And A Chuck
App 20170263490 - MURI; Ingo ; et al. | 2017-09-14 |
Method For Planarizing One Or More Workpieces, A Workpiece Planarization Arrangement, A Chuck And A Replaceable Workpiece-support For A Chuck
App 20170259354 - MURI; Ingo ; et al. | 2017-09-14 |
Method of forming a composite material and apparatus for forming a composite material
Grant 9,683,306 - Kroener , et al. June 20, 2 | 2017-06-20 |
Substrates with Buried Isolation Layers and Methods of Formation Thereof
App 20170154808 - Moder; Iris ; et al. | 2017-06-01 |
Method For Thinning Substrates
App 20170148664 - Rupp; Roland ; et al. | 2017-05-25 |
Method of Forming a Semiconductor Device and Semiconductor Device
App 20170133465 - Mauder; Anton ; et al. | 2017-05-11 |
Method for producing a semiconductor
Grant 9,627,209 - Schulze , et al. April 18, 2 | 2017-04-18 |
Semiconductor arrangement including buried anodic oxide and manufacturing method
Grant 9,472,395 - Schulze , et al. October 18, 2 | 2016-10-18 |
Method For Producing A Semiconductor
App 20160225626 - Schulze; Hans-Joachim ; et al. | 2016-08-04 |
Semiconductor Arrangement Including Buried Anodic Oxide and Manufacturing Method
App 20160203977 - Schulze; Hans-Joachim ; et al. | 2016-07-14 |
Method for producing a semiconductor
Grant 9,293,330 - Schulze , et al. March 22, 2 | 2016-03-22 |
Method Of Forming A Composite Material And Apparatus For Forming A Composite Material
App 20160053397 - Kroener; Friedrich ; et al. | 2016-02-25 |
Wafer Contacting Device, And Arrangement And Method For Electrochemical Etching Of A Wafer
App 20150068918 - Kroener; Friedrich ; et al. | 2015-03-12 |
Method For Producing A Semiconductor
App 20150064890 - Schulze; Hans-Joachim ; et al. | 2015-03-05 |
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